00197295-01_UM_D4i_SR605_EN - 第115页
User manual SIPLACE D4i 3 Technical data for the machine From software version SR.605.03 SP2 10/2012 EN edition 3.8 Vision system 115 3.8 V ision system A component camera is in tegrated into each Collect&Place hea d…
3 Technical data for the machine User manual SIPLACE D4i
3.7 PCB conveyor system From software version SR.605.03 SP2 10/2012 EN edition
114
3.7.7.2 PCB warpage during placement
A warpage of 2 mm can lead to problems focusing on local fiducials and ink spots in the middle of
the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account, this
value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
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3
PCB warpage down, max. 0.5 mm
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→ Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side wall
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side wall
0.5 mm
User manual SIPLACE D4i 3 Technical data for the machine
From software version SR.605.03 SP2 10/2012 EN edition 3.8 Vision system
115
3.8 Vision system
A component camera is integrated into each Collect&Place head (see Fig. 3.5 - 1 page 96).
The component vision module is used to determine:
– the precise position of the components at the nozzle and
– the geometry of the package form.
The PCB vision module uses fiducials on the PCBs to determine:
– the position of the PCB,
– its rotation angle
– and the PCB skew.
The PCB cameras are fixed to the bottom of the gantries. They use fiducials on the feeder mod-
ules to determine the exact pick-up position of components, which is particularly important for
small components.
3 Technical data for the machine User manual SIPLACE D4i
3.8 Vision system From software version SR.605.03 SP2 10/2012 EN edition
116
3.8.1 C&P component camera, type 28, 18 x 18, digital
3.8.1.1 Structure
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Fig. 3.8 - 1 C&P component camera, type 28, 18 x 18, digital
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(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.8.1.2 Technical data
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Component dimensions 0.5 x 0.5 mm² to 18.7 x 18.7 mm²
Range of components 0402 to PLCC44 incl. BGA, µBGA, flip-chip, TSOP, QFP,
SO to SO32, DRAM
Min. lead pitch 0.5 mm
Min. lead width 0.2 mm
Min. ball pitch 0.35 mm
Min. ball diameter 0.2 mm
Field of vision 24.5 x 24.5 mm²
Method of illumination Front-illumination (5 levels, programmable as required)