OM-1352-003_w.pdf - 第29页

1-8 Tg1357-ID-SO 0703-003 1.5 Outline of Actions (1) Flux is deposited on the drum (rotational disk) and the thick ﬁlm is ﬂattened evenly by the squeegee whose height is adjusted to the speciﬁed one. (2) The drum is stop…

1-7

Tg1357-ID-SO

0703-003

1.4 Structure and Names

Fig.2

Fig.3

1.4 Structure and Names

1-8

Tg1357-ID-SO

0703-003

1.5 Outline of Actions

(1) Flux is deposited on the drum (rotational disk) and the thick ﬁlm

is ﬂattened evenly by the squeegee whose height is adjusted to the

speciﬁed one.

(2) The drum is stopped just before ﬂux dispensing and ﬂux transfer opera

tion is performed.

Squeegee

(For Even Flattening of Flux)

Rotational Disk

(Flux

Transfer Position)

Manual Supply Motor

(For

Table Rotation)

(Depth)

Syringe

(Flux is supplied automatically)

Feeder Control PCB

Feeder Base

Drawer

Connector

Pass Line

PCB Positioning Upper Surface

Center of

Machine

(Width)

(Push Out the Flux in the Syringe)

Fig.4

1.5 Outline of Actions

2-1

Tg1357-ID-SO

0703-003

2. Placement Action Mode

2.1 Normal Operation (Dip Transfer 1)

Transfer Position

Component Picks

with Nozzle #1

Multi Functional Head

Component Recognition Camera

Nozzle Stocker (Housing)

(Step 1) Pickup → (Step 2) Recognition (Outline and

Bump) → (Step 3) Flux Application →

(Step 4) Recognition (Outline) → (Step 5) Placement

Note: When the component is placed (step 5) the

bump position is estimated, based on the

outline after correction in steps 2 and 4, and

the component is placed by using the bump as

the reference. For the XY placement position,

the component is placed using the PEC

recognition mark as the reference.

PCB (460 × 460)PCB (460 × 460)

Fig.5

2. Placement Action Mode