ASMPT_Brochure_DEK_Galaxy_EN_250212 - 第3页

DEK GALAXY IS YOUR COMPETITIVE ADV ANT AGE DEK Virtual Panel T ooling (VPT) DEK Virtual Panel T ooling (VPT) allows the printer to process multiple individual substrates in a single print cycle. DEK HawkEye ® DEK HawkEye…

TOP PERFORMANCE AND FLEXIBILITY

AT WAFER, SUBSTRATE AND

PCB LEVEL

Are you looking for a high-precision and extremely powerful printer? If so then

the DEK Galaxy is the perfect choice. This solder paste printer combines

impressive performance with extensive flexibility and allows you to switch quickly

between different product requirements: Wafer bumping by solder paste printing,

SMT pre-assembly for next-generation assemblies or DirEKt Ball Attach on

wafers or substrates with ball diameters down to 0.2 mm.

DEK Galaxy uses proven ASMPT technologies such as linear motors for maxi-

mum speed, precision and reliability. The printer offers numerous options,

including singulated tooling systems which allow for individual alignment and

printing of multiple substrates within one print cycle, JEDEC wafer chuck and

carriers for substrate and wafer processing. Grid-Lok

and Customized tools

which enable advanced substrate support even for extremely dense assemblies.

SMEMA-compatible interfaces support easy integration with DEK solutions for

wafer loading and substrate fluxing as well as with back-end devices such as

grid array reflow or placement platforms. As a stand-alone offering or as part

of a turnkey process configured by ASMPT specialists: DEK Galaxy is the

ultimate performer.

Material Management

The combination of DEK Paste

Roll Height Monitor and DEK

Automatic Paste Dispenser

(cartridge or can) controls the

paste quantity automatically.

Newly developed DEK Typhoon

high-speed stencil cleaning system

Maximum exibility and speed for under stencil

cleaning with exible insert types and chamber

lengths for optimal cleaning performance for

every process and stencil.

DEK Multiple Alignment

of Singulated Substrates

(MASS)

Multiple substrates are optically

aligned at the same time –

a technological breakthrough for

ecient and high-precision printing

processes with singulated substrates.

DEK GALAXY

INNOVATIONS

DEK GALAXY IS YOUR

COMPETITIVE ADVANTAGE

DEK Virtual Panel

Tooling (VPT)

DEK Virtual Panel Tooling (VPT)

allows the printer to process

multiple individual substrates

in a single print cycle.

DEK HawkEye

quickly veries

the printing results within the

printer itself.

Maximum precision

Alignment accuracy: ± 12.5 µm,

at >2.0 cmk (± 6 sigma),

wet print: ± 17.5 µm,

at >2.0 cpk (± 6 Sigma)

High throughput

7 seconds core

cycle time

High print quality

Leading to greater

rst pass yield

Fast New Product Introduction (NPI)

Instinctiv V9, for faster setup and

rst print, easier operation and error

prevention and correction

Singulated substrate tooling

Allows for individual alignment and

processing of multiple substrates

within one print cycle

3D Stencil printing

Capable of 3D stencil printing with AgS

paste for power electronics packaging

All information and illustrations in this brochure are provided “as is” and without any warranties of any kind, whether expressed or implied, including but not limited to,

implied warranties of satisfactory quality, tness for a particular purpose and/or correctness.

The contents of this brochure are for general information purposes only, do not constitute advice, and are subject to change without notice. ASMPT therefore makes no war-

ranties or representations regarding the use of the content, details, specications or information contained in this brochure in terms of their correctness, accuracy, adequacy,

usefulness, timeliness, reliability or otherwise, in each case to the fullest extent permitted by law. Please contact ASMPT for the most current information.

Any specic performance features and/or capabilities will only be binding if contractually agreed upon.

All product names are brands or trademarks of ASMPT or other suppliers. Unauthorised use by third parties may violate the rights of their owners.

ASMPT GmbH & Co. KG

Rupert-Mayer-Strasse 48 | 81379 Munich | Germany | Phone: +49 89 20800-22000 | Email: smt-solutions.de@asmpt.com

asmpt.com | smt.asmpt.com

Printer platform DEK Galaxy

Machine type DEK Galaxy

Standard configuration Description

Machine accuracy* > 2.0 cmk @ ±12.5 µm, (±6 sigma)

Accuracy in wet printing > 2.0 cpk @ ±17.5 µm, (±6 Sigma)

Optimum cycle time (CCT) 7 seconds

Maximum pressure range 600 mm (X) × 508.5 mm (Y)

Controller Motion control via CAN BUS network

User interface Touchscreen, keyboard and trackball, Instinctiv V9 software, Windows 10 IoT Enterprise

Camera HawkEye

1700 Digital camera with IEEE 1394 interface

Multi-channel LED illumination, FOV 11.3 mm × 8.7 mm, inspection window 75 mm

Axle drive High-precision linear motors and encoders with 1 µm accuracy

Squeegee pressure control Software-controlled, motorized, with closed-loop control circuit

Template positioning Automatic loading system with drip tray for squeegee

Stencil alignment Motorized via actuators (X, Y, and theta)

Underside cleaning DEK Typhoon high-speed cleaner, fully programmable with wet/dry/vacuum wiping,

external solvent tank (300 mm, 400 mm, 460 mm, 515 mm)

Substrate size (min.) 50 mm (X) × 40.5 mm (Y)

Substrate size (max.) 620 mm (X)** × 508.5 mm (Y)

Machine dimensions (approx.) 2060 mm × 1500 mm × 1570 mm (81.1“ × 59“ × 61.8“) (L × W × H)

Compressed air supply According to ISO 8573.1 Standard Quality Class 2.3.3. pressure: 5 - 8 bar

Consumption, normal: 5 l/min, at 5 - 8 bar. Consumption, maximum 226 l/min, at 6 bar

Weight 840 kg, packed (depending on configuration)

680 kg, unpacked (depending on configuration)

Options

DEK Paste Management Automatic solder paste application and automatic height control of the paste roller

ProFlow Optional

Closed-loop connection

to SPI systems

Advanced solder paste control with ProDEK

Semiconductor options SEMI S2/S8, SECS GEM, VPT tooling, DirEKT, Ball Placement, MASS

DEK Galaxy

* The measurement of machine and repeat accuracy is carried out with process variables typical for production.

** Longboard option