西门子SIPLACE HS 60-设备参数_EN - 第25页

23 Vision Sensor Technology: Multicolor PCB Camera (Option) Description At present, the most commonly used PCBs are made of FR3 (Epoxy Paper) or FR4 (Epoxy Glass Fiber Laminate) board materials. However, the use of speci…

Vision Sensor Technology:

Bad Board Recognition

Position Recognition of Feeder

Ink Spot Criteria

Evaluation method

for fiducials

for structures

brightness method

contrast method

Shapes and sizes of

fiducials/structures for

brightness method

contrast method

square or circular forms

edge length/diameter 0.3 - 5 mm

rectangular forms

edge length 0.3 - 5 mm

Masking material mat dark (light-absorbing)

not recommended: white or shiny

Ink spot recognition time 0.3 s for each method

Description

In the cluster technology each

subpanel is assigned an ink spot.

If this is present during the meas-

urement via the PCB vision mod-

ule, the corresponding subpanel is

populated. It is also possible to ac-

complish the population of the

subpanel when the ink spot is

missing. With this function it is

possible to eliminate costs due to

unnecessary population of faulty

subpanels.

Global Ink Spot

Each bad board evaluation needs

time, so naturally the consumed

time increases with the number of

subpanels per PCB. Using a global

ink spot can result in a significant

reduction of these secondary

times.

The PCB vision module searches

at positions taught before for the

defined fiducial. In case of recogni-

tion there is no following evalua-

tion of subpanels. The system al-

lows the customer to choose also

the opposite interpretation.

Position Recognition of Feeder

The pick-up position of the com-

ponents can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Multicolor PCB Camera (Option)

Description

At present, the most commonly

used PCBs are made of FR3

(Epoxy Paper) or FR4 (Epoxy

Glass Fiber Laminate) board

materials. However, the use of

special materials such as ceramics

(Al

), flexible material (Capton)

or Paper Phenolic Core (CEM1) are

becoming increasingly widespread

for special applications. In general

optical techniques with a fixed

light spectrum (frequency range)

and just one direction of illumina-

tion are inadequate for these spe-

cial applications. The new

SIPLACE Multicolor Fiducial Cam-

era however is designed to work

with new materials and special

applications just as fast and relia-

bly as with conventional ones.

Technical Data

PCB

material

Fiducial

material

Used light source

Blue light Infra red White light

FR 4 Tin X

Ceramic NiAu; Cu; AgPi X

Ceramic AgPt X

CEM 1 Bright copper, tin X

CEM 1 Fiducials

covered by

solder resist

(X)

Flex on

Aluminium

carrier

The new SIPLACE Multicolor

Fiducial Camera detects almost

all fiducials and ink spots on all

known PCB materials even under

very difficult environmental con-

ditions. The associated illumination

system developed by SIPLACE

allows the individual selection of

suitable illumination colors and

angles on to the object.

Vision Sensor Technology:

Algorithms to Determine the X-/Y-Position and the

Placement Angle

Description

The component vision module in-

tegrated into the placement head

significantly contributes to place-

ment precision and reliability. It

dependably recognizes all package

forms (= geometric dimensions of

the component) which are illumi-

nated at various angles from three

planes in the case of the 12-Nozzle

Collect & Place Head. For optimal

illumination of each component,

the brightness of the lighting of

the planes can be adjusted indi-

vidually in 256 increments.

Aside from the dimension of the

SMD module, the vision system

determines the number of leads

and their pitch (lateral IC lead

bend) as well as the offset of the

placement angle and the X-/Y-axis.

Unsuitable components are re-

jected and automatically added

later in a repair cycle. Offsets in

placement angle and X-/Y-axis are

corrected at the turning station of

the Collect & Place Head or via the

gantry axes. From the positions of

a number of components in one

track a relevant offset in the pick-

up position on the X-/Y-axis is cal-

culated. This offset is taken into

account during subsequent com-

ponent pick-up steps due to the

self-learning principle.

Algorithm Component Analysis based on

Size Driven Chip the component contour (pro-

file/gradient)

Row Driven IC Several component leads (correla-

tion method)

Corner Driven IC all component leads

(correlation method)

Lead Driven Complex IC

Each component lead (High-

Accuracy-Lead-Extraction method)

Grid/Ball

BGA, µBGA,

Flip Chip

all defined balls

(gradients/ball centering)

Prior to placement, the required

geometric dimensions of a com-

ponent type are entered into the

GF editor, creating a synthetic

model of the SMD chip. This task

is facilitated by the extensive on-

line information and help system.

The central SIPLACE vision sys-

tem, to which the other vision

modules are also connected, sub-

sequently analyzes the gray-scale

value of the component vision

module. Algorithms suitable for

the specific package form are

used for this purpose. Due to the

combination of algorithms, the vi-

sion system also functions reliably

under the most difficult conditions,

e.g., in case of different reflection

behavior on the part of the leads

or interference from outside.