西门子SIPLACE HS 60-设备参数_EN - 第28页

26 Machine Criteria: Placement Accuracy Technical Data Gantry Drive Brushless AC Temperature Controlled Motor (X-axis) Linear drive (Y-axis) Position measuring system (X/Y) Linear scales Resolution of X-/Y-axis 1 µm Spee…

Vision Sensor Technology:

Standard Component Vision Modules for 12-Nozzle

Collect & Place Head

DCA-Vision Module for 12-Nozzle Collect & Place Head

(Option)

Standard Component Vision Module for the 12-Nozzle C & P Head

Component size minimum 0.6 x 0.3 mm

(0201) /

maximum 18.7 x 18.7 mm

Component range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front lighting

(3 freely programmable planes)

Pixel size 50 µm

DCA-Vision Module for the 12-Nozzle C & P Head

Component size: minimum 0.6 x 0.3 mm

(0201) /

maximum 13 x 13 mm

Component range Flip Chips, Bare Dies, Standard SMDs

Camera’s field of view 15.6 x 15.6 mm

Illumination Front light

(4 freely programmable planes)

Pixel size 27.5 µm

Description

Standard Component Vision

Module for 12-Nozzle

Collect & Place Head

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is evalu-

ated by the central vision system.

The component rotation is then

corrected by the appropriate angle

based on the position offsets de-

termined with vision inspection.

DCA Vision Module for 12-

Nozzle Collect & Place Head

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be handled

with this vision module including

0201 capacitors and resistors.

The DCA vision module option of-

fers the possibility to process with

one machine SMDs, Flip Chips

and Bare Dies without problems,

thus achieving a maximum of

flexibility.

The DCA-Vision Module option re-

places the Standard Component

Vision Module.

Machine Criteria:

Placement Accuracy

Technical Data Gantry

Drive Brushless AC

Temperature Controlled Motor (X-axis)

Linear drive (Y-axis)

Position measuring system

(X/Y)

Linear scales

Resolution of X-/Y-axis 1 µm

Speed of X-axis max. 2 m/s

Speed of Y-axis max. 2.5 m/s

Placement Accuracy see table on page 6

Description

Various factors contribute to the

placement accuracy of the

SIPLACE HS-60 machine, e.g., the

stationary PCB during the place-

ment process. As no accelerations

are acting on the placed compo-

nents, their position continues un-

changed. The PCB moves in and

out at a coordinated speed which

is automatically reduced just be-

fore the nominal position is

reached.

A further guarantee for long-term

high placement accuracy is the

position recognition of the axes of

the gantry and placement head by

means of optical scanning by in-

cremental encoders. Revolving

star and segments of the Collect &

Place Head are positioned by

means of high-resolution glass in-

cremental panels. The X- and Y-

axes are positioned with the help

of the linear scales on each gantry

axis.

To determine the placement accu-

racy on SIPLACE machines, highly

precision glass components with

mounted structures are placed on

a dimensionally accurate glass

mapping plate. The results are sta-

tistically evaluated and presented

as a Gaussian standard distribu-

tion. In the case of the 12-Nozzle

Collect & Place Head the place-

ment accuracy is ± 75 µm at a

statistical reliability of 4 sigma.

If the accuracy value ± 75 µm is

divided by the sigma value 4, the

result is the standard deviation

S of 1 sigma = ± 18.75 µm (as

defined in Scope of Service and

Delivery SIPLACE).

P Point of Inflection

2700 dpm

60 dpm

-4σ -3σ -2σ σ x σ 2σ 3σ 4

Standard Deviation – dpm

A machine capability analysis is

conducted for each machine ac-

ceptance test.

Machine Criteria:

Placement Reliability

Description

In addition to correct positioning,

placement reliability is important.

On the SIPLACE HS-60 this is en-

sured through a number of control

functions, such as vacuum checks

and component vision testing dur-

ing the placement sequence.

Out of tolerance components are

rejected, placed on the repair list

and automatically processed dur-

ing a repair cycle. An offset in the

position of the PCB relative to the

conveyor system (PCB vision) and

an offset of the X-axis, Y-axis or ro-

tation of the component relative to

the midpoint of the nozzle (com-

ponent vision) trigger an immedi-

ate correction to ensure place-

ment accuracy.

ℵ 12-Nozzle Collect & Place Head

ℑ X-/Y-Gantry System

ℜ Fixed Component Supply

℘

Fixed PCB

Placement Principle SIPLACE HS-60

Since the PCB is fixed, the com-

ponents remain in the exact posi-

tion they are placed. The station-

ary component table ensures a

precise pick up. Options, such as

the component bar code scanner,

can be added to further enhance

reliability.