YSD_Users_E.pdf - 第189页
5. Creating the component information 5-35 5.1 Creating procedur e 5-36 5.2 Chip components 5-37 5.2.1 Basic parameters 5-37 5.2.2 Shape parameters 5-38 5.2.3 Dispense parameters 5-39 5.3 IC components 5-40 5.3.1 Mini-mo…
Chapter 5 Creating the board data
Contents
1. Overview 5-1
1.1 Creating the board data from mounter data 5-2
1.2 Creating the board data from CAD data 5-3
1.3 Creating the board data by manual input 5-4
2. Registering and selecting board name 5-5
2.1 Registering board names 5-5
2.1.1 Registering a new board name 5-5
2.1.2 Utilizing board data already registered 5-8
3. Creating the setup information 5-11
3.1 Nozzle information 5-11
3.2 Temperature setting 5-12
4. Creating the board information 5-13
4.1 Board parameters 5-14
4.2 Mount parameters 5-16
4.3 Offset parameters 5-18
4.3.1 Pitch distribution function 5-20
4.4 Fiducial parameters 5-22
4.4.1 Board fiducial function 5-23
4.4.2 Block fiducial function 5-23
4.4.3 Local fiducial functions 5-24
4.5 Badmark parameters 5-26
4.5.1 Using the badmark functions 5-27
4.6 Height correction parameters (option) 5-29
4.7 Position correction dispense parameters 5-30
4.8 Pre-dispense parameters 5-31
4.9 Dot dispense parameters 5-33
5. Creating the component information 5-35
5.1 Creating procedure 5-36
5.2 Chip components 5-37
5.2.1 Basic parameters 5-37
5.2.2 Shape parameters 5-38
5.2.3 Dispense parameters 5-39
5.3 IC components 5-40
5.3.1 Mini-mold transistors and SOT 5-40
5.3.2 SOP components 5-43
5.3.3 QFP components 5-45
5.4 Ball lead components 5-47
5.4.1 BGA components 5-47
5.5 Connector components 5-48
5.5.1 Connectors 5-48
6. Creating the mark information 5-51
6.1 Creating procedure 5-52
6.2 Basic parameters 5-53
6.3 Shape parameters 5-54
6.4 Vision parameters 5-56
6.5 Mark Adjust mode 5-58
6.6 Pattern matching 5-62
6.6.1 Pattern registration 5-63
6.6.2 Using the data for pattern matching 5-67
7. Creating dot dispense information 5-68
7.1 Dispense distribution 5-68
7.2 Editing the dot dispense information 5-73
8. Height correction (option) 5-74
8.1 Creating the board data for height correction 5-74
8.2 Height correction distribution 5-76
5-1
5
Creating the board data
1. Overview
The board data is indexed by each individual board name. Each board type consists of various information
and parameters as shown below, which can be selected or checked with the menu button and tab on the
operation screen. This section describes basic methods for creating board data so that you will understand
what data is needed for what item. After you have obtained a complete understanding of these methods,
begin actual work according to the desired method.
The figure below shows the parameters necessary to create board data from YAMAHA mounter data or CAD
data and also by manual input.
Board data structure
Board name Parts
Basic
Vision
Shape
Mount
Pick
Tray
Option
Dispense
Shape
Vision
Basic
Mount
Board
Parameters created from YAMAHA mounter data or CAD data
* Parameters when solder is used
Parameters created by manual input
Not used
Not used
Not used
Not used
Not used
Various parameters
Fiducial
Badmark
Offset
Pre-dispense
Dot Dispense
Height offset
Position correction dispensing
Board
Mark
63500-N7-00