YSD_Users_E.pdf - 第227页
5-38 5 Creating the board data 5.2.2 Shape parameters Set these parameters after specifying “ Alignment T ype”. If “ Alignment T ype” is undefined, the following parameters are not displa yed. Shape parameters 64522-N7-0…
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Creating the board data
5.2 Chip components
This section explains how to set the parameters for chip components.
5.2.1 Basic parameters
Set basic parameters for chip components.
On dispenser machines, check/edit the settings for the parameters "A: Alignment Group", "B: Alignment Type"
and "J: Database Number".
The other parameters are not used for dispenser machines.
Basic parameters
64519-N7-00
TIP
The “Alignment Group” and “Alignment Type” parameters are also displayed on the [Shape] tab screen.
A: Alignment Group
Set to "Chip".
B: Alignment Type
Set this parameter when creating data for solder type. Specify the type of chip component. For example, set standard box
type chip components to "Std. Chip", and Melf components to "Melf Chip".
J: Database number
Shows the database number when the parameter values were copied from the database.
When you want to copy the parameter values from the database, press the [Database] button to open the database list.
Then select the copy source data and press the [Set] button to make a copy.
Database list
64520-N7-00
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Creating the board data
5.2.2 Shape parameters
Set these parameters after specifying “Alignment Type”. If “Alignment Type” is undefined, the following
parameters are not displayed.
Shape parameters
64522-N7-00
A, B: Body Size X, Body Size Y
Enter the correct dimensions (mm) measured with a vernier caliper or micrometer.
Parts orientation and shape parameters
0° 90°
Loading
position
Pickup angle
NS
E
W
N
S
WE
0° 90°
Loading
position
Pickup angle
NS
E
W
N
S
WE
N
S
E
W
A
C
B
N
S
WE
A
B
D
Top view
C
A
B
E
D
A : Body Size X
B : Body Size Y
C : Body Size Z
D : Ruler Offset
E : Lead Width
Square chip
Melf chip
63516-N7-00
C: Body Size Z (Not used with this machine.)
D: Ruler Offset (Not used with this machine.)
E: Lead Width (Not used with this machine.)
Check Many Adsorption (Not used with this machine.)
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Creating the board data
5.2.3 Dispense parameters
Dispense parameters
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A: Required Nozzle
Select the nozzle to be used for dispense.
B: Dispense Nozzle
Select the nozzle type from "1 SHOT Type" or "2 SHOT Type".
C: Dispense Unit
Set the quantity of adhesive to be dispensed.
D, E: Ref. Pos. X (mm), Ref. Pos Y (mm)
In the case of bond type adhesive, set the deviation between the center of dispense and that of the component.
In the case of solder type adhesive, set the offset from the outer line of the component.
F, G: Dot Extent X (mm), Dot Extent Y (mm)
Set the dispense area (dot extend).
This parameter will be ignored if solder type adhesive is used.
H, I: Dot Amount X, Dot Amount Y
Set the number of dots to be dispensed in X and Y directions within the specified dispense area (Dot Extent).
This parameter will be ignored if solder type adhesive is used.
J: Angle Offset
Set the dispense angle. An angle between 0 and ±90° can be set in 5° steps.
Dispense for chip components
Center of component
Reference position
■ 1-shot nozzle (bond) ■ 2-shot nozzle (bond) ■ 1-shot nozzle (solder)
X-directional dot extent
Center of component
Varies with 2-shot nozzle pitch.
Reference
position Y
Dispense for square chip components
Center of component
■ 1-shot nozzle (bond)
■ 2-shot nozzle (bond)
(Dispense angle offset: 90°)
Center of component
Varies with
2-shot nozzle pitch.
■ 1-shot nozzle (solder)
Reference position
(0.00)
Reference
position Y
Dispense for Melf components
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