YSD_Users_E.pdf - 第237页
5-48 5 Creating the board data 5.5 Connector components Connector components are registered with the parameters shown belo w . F or parameters not explained here, refer to the description in "5.2 Chip Components&quo…
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Creating the board data
5.4 Ball lead components
This section describes how to set data for ball lead parts such as BGA and flip chip.
5.4.1 BGA components
When "Alignment Type" of the Basic parameters is set to “Simple BGA” or "BGA", BGA components are
registered with the parameters shown below.
For parameters not explained here, refer to the description in "5.2 Chip Components" of this chapter.
c
CAUTION
The solder distribution is not supported for ball components. When using solder, teach the data obtained by dispense
distribution or edit the dot dispense information.
BGA component parameters
Basic
Dispense
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Basic parameters
A: Alignment Group
Set this parameter to “Ball”.
B: Alignment Type
Set to "Simple BGA" or "BGA".
Enter the distance between each terminal.
Dispense parameters
Bond type adhesive is not used for ball lead components.
To use solder paste, perform teaching for the data after it has been subjected to dispense distribution or edit the dot
dispense information.
For instance, assuming that Dot Extent X =24, Dot Extent Y = 24, Dot Amount X = 3 and Dot Amount Y = 3, coordinate
data for 3 points for both X and Y directions will be created by performing dispense distribution.
So, delete unnecessary coordinate data from the dot dispense information screen.
c
CAUTION
When using solder paste for ball lead components, dispense may not be possible if the ball pitch is 0.8 mm or
narrower.
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Creating the board data
5.5 Connector components
Connector components are registered with the parameters shown below. For parameters
not explained here, refer to the description in "5.2 Chip Components" of this chapter.
5.5.1 Connectors
Connector component parameters
Basic Shape Dispense
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Basic parameters
A: Alignment Group
Set this parameter to “Connector”.
B: Alignment Type
Set to “Con-E”.
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Creating the board data
Shape parameters
Set these parameters after specifying “Alignment Type”. If “Alignment Type” is undefined, the following parameters are
not displayed.
A, B: Body Size X, Body Size Y
Enter the correct dimensions (mm) including the leads, measured with a vernier caliper or micrometer.
D to F: Contr. Offset XYR
Enter the values to correct the lead offset (positional shift) from the center of the component.
G: Ruler Offset
Enter the distance in pixels from the end of the leads to an imaginary line used to measure the lead width and pitch. Use
the default setting in most cases.
H: Ruler Width
Enter the width of an imaginary line used to measure the lead width and pitch. Set this parameter to "1 to 2" for
components with a lead length shorter than 0.3 mm, and to "2 to 3" for components with a lead length longer than 0.3
mm. Use the default setting in most cases.
I: LeadNumber
Enter the number of leads existing on one side.
N
N
N
N
S
S
S
S
W
W
W
W
E
E
E
E
Connector orientation
Loading
position
Pickup angle
0° 180° 90° -90°
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J: Lead Pitch
Enter the correct lead pitch (lead-to-lead spacing).
K: Lead Width
Enter the correct lead width.
L: ReflectLL
Enter the projected length of leads which reflect light during recognition. Use the default setting in most cases.
Shape parameters for connectors
A : Body Size X
B : Body Size Y
C : Body Size Z
J : Lead Pitch
K : Lead Width
L : Reflect LL
Bottom view
S
N
W
E
B
C
A
L
J
K
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