YSD_Users_E.pdf - 第32页

4. Low-liquid sensor functions 3-11 4.1 Remaining amount detection angle setting 3-11 4.1.1 Adjusting the low-liquid sensor (angle setting) 3-12 4.1.2 Making the settings 3-14 Chapter 4 Making the dispensing stable 1. Ma…

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2. Operation screen and buttons 2-7
2.1 Basic configuration of operation screen 2-7
2.2 Setup screen 2-10
2.3 Unit screen 2-12
3. Machine operation from start to finish 2-16
3.1 Pre-operation check 2-17
3.2 Selecting the board data 2-18
3.3 Changing the conveyor unit setup 2-19
3.3.1 Conveyor unit setup flow 2-19
3.3.2 Changing the conveyor width 2-20
3.3.3 Adjusting the board hold plates 2-21
3.3.4 Arranging the push-up pins 2-22
3.4 Head unit setup 2-24
3.5 Starting and warming up the machine 2-27
3.6 Bleeding the nozzle air 2-29
3.7 Performing a dispensing test 2-32
3.8 Starting board production 2-34
3.9 Displaying the production monitors 2-35
3.10 Finishing board production 2-44
4. Basic tasks for optional units 2-46
4.1 Low-liquid sensor 2-46
4.1.1 Adjusting the low-liquid sensor 2-48
4.2 Dot station 2-50
4.2.1 Replacing the paper 2-50
4.3 Laser displacement meter 2-52
4.3.1 Initialization 2-52
Chapter 3 Q & A
1. Troubleshooting 3-1
1.1 Typical errors and troubleshooting 3-1
1.2 Mark recognition errors 3-4
1.3 Conveyor operation errors 3-4
1.4 Other errors 3-5
2. Handling dispensing errors 3-6
3. Reducing paper consumption 3-10
3.1 Predispensing interval setting 3-10
4. Low-liquid sensor functions 3-11
4.1 Remaining amount detection angle setting 3-11
4.1.1 Adjusting the low-liquid sensor (angle setting) 3-12
4.1.2 Making the settings 3-14
Chapter 4 Making the dispensing stable
1. Making the dispensing stable 4-1
2. Dispensing test function 4-2
2.1 Overview 4-2
2.2 Performing a dispensing test 4-3
2.3 Starting a dispensing test during automatic operation 4-6
3. Creating the predispensing information 4-8
3.1 Using the dispense correction function 4-8
3.1.1 Enabling each setting 4-10
3.1.2 Creating the predispense parameters 4-12
3.1.3 Creating the mark data for dot recognition 4-14
3.1.4 Checking the dispensing amount on the dot station 4-20
3.1.5 Checking the dispensing amount on the board 4-22
3.1.6 Creating the dispense correction (map) 4-23
3.1.7 Setting the calculation type 4-27
3.1.8 Checking that each setting is consistent 4-33
4. Position correction dispense function 4-34
4.1 Overview and item restrictions 4-34
4.2 Setting method 4-35
4.3 Machine data setting 4-36
5. Dot station (option) 4-37
5.1 Dot station setup 4-37
5.1.1 Setting the dot station function 4-38
5.1.2 Entering the pre-dispensing position 4-39
5.1.3 Setting the dot station data 4-40
5.2 Setting the board information 4-42
5.3 Dispense correction limit check 4-44
5.3.1 Correction amount calculation 4-44
5.3.2 Setting method 4-47
5.4 Dispense correction retries 4-48
5.4.1 Setting method 4-50
6. Editing a dispense sequence 4-51
6.1 Performing a predispensing test 4-51
6.2 Editing the dispense sequence 4-51
7. Checking/correcting dispensing positions 4-55
Chapter 5 Creating the board data
1. Overview 5-1
1.1 Creating the board data from mounter data 5-2
1.2 Creating the board data from CAD data 5-3
1.3 Creating the board data by manual input 5-4
2. Registering and selecting board name 5-5
2.1 Registering board names 5-5
2.1.1 Registering a new board name 5-5
2.1.2 Utilizing board data already registered 5-8
3. Creating the setup information 5-11
3.1 Nozzle information 5-11
3.2 Temperature setting 5-12
4. Creating the board information 5-13
4.1 Board parameters 5-14
4.2 Mount parameters 5-16
4.3 Offset parameters 5-18
4.3.1 Pitch distribution function 5-20
4.4 Fiducial parameters 5-22
4.4.1 Board fiducial function 5-23
4.4.2 Block fiducial function 5-23
4.4.3 Local fiducial functions 5-24
4.5 Badmark parameters 5-26
4.5.1 Using the badmark functions 5-27
4.6 Height correction parameters (option) 5-29
4.7 Position correction dispense parameters 5-30
4.8 Pre-dispense parameters 5-31
4.9 Dot dispense parameters 5-33
5. Creating the component information 5-35
5.1 Creating procedure 5-36
5.2 Chip components 5-37
5.2.1 Basic parameters 5-37
5.2.2 Shape parameters 5-38
5.2.3 Dispense parameters 5-39
5.3 IC components 5-40
5.3.1 Mini-mold transistors and SOT 5-40
5.3.2 SOP components 5-43
5.3.3 QFP components 5-45
5.4 Ball lead components 5-47
5.4.1 BGA components 5-47
5.5 Connector components 5-48
5.5.1 Connectors 5-48