Micron Technical Reference V9 Volume 1 - 第22页
INTRODUCTION SOFTWARE/HARDWARE CONFIGURATIONS 1.12 Technical Reference Manual Chapter Issue 12, Feb 18 Software Release V ersion 9 SP14 Software Hardware No hardware enhancements. Software Release V ersion 9 SP15 -17 Sof…
INTRODUCTION
SOFTWARE/HARDWARE CONFIGURATIONS
Chapter Issue 12, Feb 18 Technical Reference Manual 1.11
Software Release Version 9 SP11
Software
Hardware No hardware enhancements added.
Software Release Version 9 SP12
Software
Hardware No hardware enhancements.
Software Release Version 9 SP13
Software
Hardware No hardware enhancements.
Software Release Version 9 SP13 P04
Software
Hardware
Feature Detail
GEM Improved functionality
Defect Fixes Various
Feature Detail
SMEMA Good Board/Bad Board Enhancements for down line transfers
Power Monitor Software Improved PSU voltage monitoring
Defect Fixes Various
Feature Detail
Double Alignment Option This option can enable improvements to the alignment
accuracy.
Defect Fixes Various
Feature Detail
Defect Fixes Various
Feature Detail
Style 2 Rising Table ASM are continuously using qualitative methodologies
such as Lean Manufacturing to reduce waste and Six
Sigma to increase quality linking to improve manufac-
turing productivity
Underscreen Cleaner Size Options 300,400 and 520mm cleaning options available
Barcode Reader Configuration
Cards
Updated configuration cards to improve read quality
Rear Rail Parallelism New setting jig added
Chase Sensor Replaced thru-beam opto sensor with a reflective type
INTRODUCTION
SOFTWARE/HARDWARE CONFIGURATIONS
1.12 Technical Reference Manual Chapter Issue 12, Feb 18
Software Release Version 9 SP14
Software
Hardware No hardware enhancements.
Software Release Version 9 SP15 -17
Software
Hardware Hardware options.
Feature Detail
Operating System Software updated to work on Windows 7 Embedded
and Windows XP Embedded systems
QC Calc Newer version of QC Calc capable of running on Win-
dows 7 Embedded
Defect Fixes Various
Feature Detail
Cyclone Duo Underscreen Cleaner Support for the dual chamber Cyclone USC. This unit
allows a fabric wetting and vacuum process all in the
same sweep
Process Expert The line process self learning SMT expert system
Verification and Traceability Updated version (V2)
APC All Purpose Clamping system software support
Line Control MES PCB and Recipe controlled verification
SIPLACE OIS The configurable Operator Information System is used
to tailor the output
Feature Detail
Cyclone Duo Underscreen Cleaner Dual Chamber Cyclone USC
APC All Purpose Clamping hardware
INTRODUCTION
GLOSSARY
Chapter Issue 12, Feb 18 Technical Reference Manual 1.13
GLOSSARY
Term Definition
2D Inspection 2D Inspection is a software feature which utilizes the printer vision system to detect print medium
deposits on the board or the stencil.
Actuator A motor and leadscrew assembly utilized to drive a mechanical device in a given direction.
Asset Management A range of tools employed in the process of printer maintenance; includes a module that provides
a wireless real time connection from the DEK printer to the ASM call centre for fault diagnosis.
Camsafe Switch Safety interlock switch mounted on an opening printhead cover.
CAN Controller Area Network. The CAN is a bus system for printer motion control. The CAN is a 2
wire data link designed for transmission of small data packets for fast update of axis position
information.
CCD Charge-Coupled Device. An integral circuit that responds to light. Consisting of MOS (metal-
oxide semiconductor) photosensitive capacitors arranged in a regular array, producing a corre-
sponding voltage and hence charge proportional to the light’s intensity.
Chase The moving frame within the screen alignment module holding the print stencil.
Cp A term used in statistical analysis to represent Process Capability (repeatability).
Cpk A term used in statistical analysis to represent accurate repeatability.
Crate British term describing an electronic enclosure.
Downline A term referring to an item or piece of equipment within a production line situated after the DEK
printer moving in the direction of the line towards the end.
E Stop Emergency stop button. An electrical safety switch providing automatic shut down of equipment.
Diagnostics A fault finding aid in software. Enables a technician to individually control the motors, sensors
and switches throughout the printer.
Fiducial Geometric alignment mark on the board and the stencil.
Field of View Area of the image seen through the camera lens.
FMI Foreign Machine Interface. Electronic means of communication with adjacent printers.
GUI Graphical User Interface. An enhanced DEK interface utilized in the 2D inspection, portraying a
realistic representation of a board being inspected.
Host Comms Host Comms provides the user with access to certain networking functions without accessing the
printer maintenance function.
HPR Heavy Pallet Rails. A transport system used to carry pallets up to 15kg in weight
HTC High Throughput Conveyor. A combined manual/programmable width conveyor system which
sets the rail width and transports boards through the printer using belts.
Instinctiv The DEK printer software interface providing to the user an enhanced graphically printer display.
Knead Action of working the solder paste into a soft mixture.
Loom Wiring harness or cable assembly. A loom is composed of several wires fitted with a connector.
Magna-Print Quick fit/release squeegee system. The system addresses the issues associated with maintain-
ing multiple squeegee blades.
MIU Machine Interface Unit. Allows the printer to communicate with other printers up and down the
line.
MMI Man Machine Interface. A modular system enabling communication between the user and the
printer, utilizing the monitor, keyboard, tricoloured beacon and the two button control system.
MTR Modular Transport Rails. Transport rails designed to accept a variety of tooling and clamping
arrangements.
Module Self contained assembly of mechanical and/or electronic construction.
Nano-ProTek A protective coating that is applied to stencils, which gives better release characteristics and
extends the life of the stencil, benefiting from fewer cleaning cycles.