Specification SIPLACE X-Series规格说明书2 - 第37页

37 Vision Sensor Technology PCB Position Recognition Bad Board Recognition Ink Spot Criteria Methods • Synthetic fiducial recognition method • Mean grayscale value • Histogram method • Template matching Shapes and sizes …

Vision Sensor Technology

PCB Position Recognition

Description

Different fiducial shapes

prove to be optimal depend-

ing on the condition of the

surface. Particularly advis-

able for bare copper surfaces

with little oxidation is the sin-

gle cross. Maximum accu-

racy is achieved due to the

high information content.

Rectangle, square and circle

are less “informative” but

save space and can even be

used when oxidation is at an

advanced stage. Advisable

for tinned structures are

circle or square because in

this case the ratio of the fidu-

cial dimensions to the presol-

der thickness is particularly

favorable.

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

in addition: shear, distortion in X- and Y-direction separately

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, rhombus, circu-

lar, square, and rectangular contours, double cross, any pattern

Fiducial surface:

copper

tin

Without oxidation and solder resist

Fiducial warp  1/10 of structure width, both with good contrast to

environment

Dimensions of synthetic fiducials

min. X/Y size for circle and rectangle: 0.25 mm

min. X/Y size for annulus and rectangle: 0.3 mm

min. X/Y size for cross: 0.3 mm

min. X/Y size for double-cross: 0.5 mm

min. X/Y size for lozenge: 0.35 mm

min. frame width for annulus and rectangle: 0.1 mm

min. bar width / bar distance for cross, double-cross: 0.1 mm

max. X/Y size for fiducial shapes: 3 mm

max. bar width for cross / double-cross: 1.5 mm

min. tolerances, general: 2% of nominal dimension

max. tolerances, general: 20% of nominal dimension

Dimensions of patterns

min. size

max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there is no

similar fiducial structure in the search area

Vision Sensor Technology

PCB Position Recognition

Bad Board Recognition

Ink Spot Criteria

Methods

• Synthetic fiducial recognition method

• Mean grayscale value

• Histogram method

• Template matching

Shapes and sizes of fiducials/structures for

synthetic fiducials

other methods

For dimensions of synthetic fiducials, see page 36

min. 0.3 mm

max. 5 mm

Masking material good coverage

Recognition time depends on the method: 20 ms - 200 ms

Description

In the cluster technology

each subpanel is assigned

an ink spot. If this is present

during the measurement via

the PCB vision module, the

corresponding subpanel is

populated. With this function

it is possible to eliminate

costs due to unnecessary

population of faulty sub-

panels.

Technical data for PCB position detection

PCB fiducials

Local fiducials

Library memory for recognition of

bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option (optional PCB fiducials are out-

put before optimization.)

up to 2 per PCB (may be of different types)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (Singular feature) based on grayscale

values

Lighting method Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 x 5.78 mm

01005 Placement

The SIPLACE X-series is

designed to place 01005

components (0.4 mm x 0.2

mm) as standard. The follow-

ing placement head variants

are available:

• SpeedStar

•MultiStar

The SIPLACE component

library already contains the

contours and dimensions of

the 01005 components.

There are also specially-

developed type 1005 compo-

nent nozzles for the

SIPLACE X-series. The

shape and size of these noz-

zles is adapted for the 01005

components and - like all

other SIPLACE nozzles -

they have an extremely

wear-resistant ceramic tip

and a flexible nozzle seat.

This guarantees maximum

precision and process reli-

ability. Optimized pick-up is

guaranteed by the ideal feed-

ing conditions in the

SIPLACE X feeder module.

The smaller the elements to

be picked up, the more accu-

rate the pick-up must be.

Even the tiniest inaccuracy

may result in components

not being sucked up or being

sucked up incorrectly. The

SIPLACE X feeder modules

are ideally designed for this.

New motors and fewer preci-

sion mechanical parts also

help. The tiny components

can be processed without

any loss of performance,

and can be placed with mini-

mal spacings and regardless

of any large components

beside the 01005 compo-

nent. This equates to true

01005 capability. As a rule

with 01005 placement, a

finely tuned overall 01005

process is the basic require-

ment if you want to achieve

excellent results. All the pro-

cess parameters must be

optimized. The SIPLACE

team will be pleased to

advise you on how to do this.

01005 measurement

results and ambient condi-

tions

Dpm values and pick-up

rates for 01005 placement

are highly dependent on the

measuring conditions, so it is

important to specify them

without the corresponding

ambient conditions.

The following table lists some typically values for 01005

placement that can be achieved with a SIPLACE X-series if

the listed marginal conditions are fulfilled:

Machine type SIPLACE X4I, X4, X3, X2

Placement head SpeedStar with type 23 compo-

nent camera

MultiStar with type 30 compo-

nent camera

Nozzle type 1005 (SpeedStar)

2005 (MultiStar)

Feeder module type 8mm SIPLACE X tape feeder

module

Station software 703.01 or later

SIPLACE Pro 7.0 or later

Pickup rate 99.9%

Dpm rate 50

Pad width 200 µm

Distance 100 µm

Components (L x W x H) 400 x 200 x 200 µm³ (±20 µm)

Solder paste type 5

Stencil thickness 60 µm