Specification SIPLACE X-Series规格说明书2 - 第38页

38 01005 Placement The SIPLACE X-series is designed to place 01005 components (0.4 mm x 0.2 mm) as standard. The follow- ing placement head vari ants are available: • SpeedStar •M u l t i S t a r The SIPLACE component li…

Vision Sensor Technology

PCB Position Recognition

Bad Board Recognition

Ink Spot Criteria

Methods

• Synthetic fiducial recognition method

• Mean grayscale value

• Histogram method

• Template matching

Shapes and sizes of fiducials/structures for

synthetic fiducials

other methods

For dimensions of synthetic fiducials, see page 36

min. 0.3 mm

max. 5 mm

Masking material good coverage

Recognition time depends on the method: 20 ms - 200 ms

Description

In the cluster technology

each subpanel is assigned

an ink spot. If this is present

during the measurement via

the PCB vision module, the

corresponding subpanel is

populated. With this function

it is possible to eliminate

costs due to unnecessary

population of faulty sub-

panels.

Technical data for PCB position detection

PCB fiducials

Local fiducials

Library memory for recognition of

bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option (optional PCB fiducials are out-

put before optimization.)

up to 2 per PCB (may be of different types)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (Singular feature) based on grayscale

values

Lighting method Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 x 5.78 mm

01005 Placement

The SIPLACE X-series is

designed to place 01005

components (0.4 mm x 0.2

mm) as standard. The follow-

ing placement head variants

are available:

• SpeedStar

•MultiStar

The SIPLACE component

library already contains the

contours and dimensions of

the 01005 components.

There are also specially-

developed type 1005 compo-

nent nozzles for the

SIPLACE X-series. The

shape and size of these noz-

zles is adapted for the 01005

components and - like all

other SIPLACE nozzles -

they have an extremely

wear-resistant ceramic tip

and a flexible nozzle seat.

This guarantees maximum

precision and process reli-

ability. Optimized pick-up is

guaranteed by the ideal feed-

ing conditions in the

SIPLACE X feeder module.

The smaller the elements to

be picked up, the more accu-

rate the pick-up must be.

Even the tiniest inaccuracy

may result in components

not being sucked up or being

sucked up incorrectly. The

SIPLACE X feeder modules

are ideally designed for this.

New motors and fewer preci-

sion mechanical parts also

help. The tiny components

can be processed without

any loss of performance,

and can be placed with mini-

mal spacings and regardless

of any large components

beside the 01005 compo-

nent. This equates to true

01005 capability. As a rule

with 01005 placement, a

finely tuned overall 01005

process is the basic require-

ment if you want to achieve

excellent results. All the pro-

cess parameters must be

optimized. The SIPLACE

team will be pleased to

advise you on how to do this.

01005 measurement

results and ambient condi-

tions

Dpm values and pick-up

rates for 01005 placement

are highly dependent on the

measuring conditions, so it is

important to specify them

without the corresponding

ambient conditions.

The following table lists some typically values for 01005

placement that can be achieved with a SIPLACE X-series if

the listed marginal conditions are fulfilled:

Machine type SIPLACE X4I, X4, X3, X2

Placement head SpeedStar with type 23 compo-

nent camera

MultiStar with type 30 compo-

nent camera

Nozzle type 1005 (SpeedStar)

2005 (MultiStar)

Feeder module type 8mm SIPLACE X tape feeder

module

Station software 703.01 or later

SIPLACE Pro 7.0 or later

Pickup rate 99.9%

Dpm rate 50

Pad width 200 µm

Distance 100 µm

Components (L x W x H) 400 x 200 x 200 µm³ (±20 µm)

Solder paste type 5

Stencil thickness 60 µm

Machine Maintenance

To ensure that your

SIPLACE placement

machine is always in perfect

condition for production, the

machine should be main-

tained. The maintenance

instructions for the SIPLACE

X-series includes recom-

mended maintenance inter-

vals. All maintenance tasks

are explained in detail and

have informative pictures to

help.

The maintenance intervals

are weekly, 3-monthly,

6-monthly or 12-monthly.

For ease of organizing line

maintenance as part of daily

production practice, the level

of complexity is also speci-

fied for each maintenance

task. We distinguish

between Minor and Major

maintenance tasks.

Weekly maintenance tasks

The weekly maintenance

tasks are all simple Minor -

maintenance tasks. They do

not require any special train-

ing and can be carried out by

the line operators with refer-

ence to the maintenance

instructions.

No more than one hour need

be scheduled for the weekly

maintenance of a line; if pro-

cedures are optimized, this

time can be much shorter.

3, 6 and 12-monthly main-

tenance tasks

The 3-monthly, 6-monthly

and 12-monthly maintenance

tasks are a mixture of simple

Minor and complex Major

tasks. For the complex tasks,

we recommend training for

the operators or mainte-

nance personnel.

Die 3-monthly, 6-monthly

and 12-monthly maintenance

can generally take place at

the same time as mainte-

nance of the soldering oven

on the line.