Specification SIPLACE X-Series规格说明书2 - 第6页

6 Machine Description Intelligent placement solu- tions for the most rigorous demands If you need maximum flexibil- ity, output or quality in the placement process, the SIPLACE X-series has the technology yo u need to me…

Overview of the Technical Data

Maximum Values

Placement rate

IPC value

Benchmark value

Theoretical value

a) See page 10 for a definition of the output values.

102,000 comp./h

120,000 comp./h

135,500 comp./h

Component range 01005 - 200 x 125 mm²

Placement accuracy

angular accuracy

b) The accuracy value was measured using the vendor-neutral IPC standard.

± 22 µm, ± 0.05° / (3),

± 30 µm, ± 0.07° / (4)

Gantry axes measuring system

X-axis resolution

Y-axis resolution

1 µm

Feeder module types Tape feeder modules, waffle-pack trays, stick

magazine feeders, dip modules, application-

specific OEM feeder modules

Feeding capacity (component changeover

table)

160 8 mm X feeder modules

PCB format (length x width) max. 450 x 535 mm²

PCB thickness 0.3 - 4.5 mm (others available on request)

PCB weight max. 3 kg

Camera 6 illumination levels

SIPLACE X4I

SIPLACE X-Series machine colors

Machine protection: Light Basic Gray

(SIPLACE color code B002)

Pantone solid coated:

Warm Gray 3C

Hoods: Slate Gray, RAL 7015

(SIPLACE color code C002)

Hoods: Light Basic Gray

(SIPLACE color code B002)

Pantone solid coated:

Warm Gray 3C

SIPLACE X4I machine protection:

Slate Gray, RAL 7015,

(SIPLACE color code C002)

Machine Description

Intelligent placement solu-

tions for the most rigorous

demands

If you need maximum flexibil-

ity, output or quality in the

placement process, the

SIPLACE X-series has the

technology you need to meet

any challenge associated

with SMT production.

Maximum modularity for

every need

The platform of the SIPLACE

X-series has a modular

structure, and can be per-

fectly adapted to meet all the

requirements of electronics

production.

Four different variants of the

placement machine are

available:

•SIPLACE X4I

•SIPLACE X4

•SIPLACE X3

•SIPLACE X2

The figures in the type desig-

nations represent the num-

ber of gantries. There is a

placement head on each

gantry. The optimized prop-

erties and broad component

range means that it is no lon-

ger necessary to change the

placement heads. They can

generally be matched to the

customer's requirements. As

well as the flexible SIPLACE

TwinStar for placing com-

plex models, the SIPLACE

X-series is also available

with the high-precision and

extremely fast SIPLACE

SpeedStar - the 20-segment

Collect&Place head. From

software version SR.703

onwards, all SIPLACE X

placement machines can be

equipped with the recently

developed SIPLACE Multi-

Star. The MultiStar - abbrevi-

ated to CPP head - brings

together two opposing prop-

erties: fast processing speed

and flexibility. For size 0201

to 27 x 27 mm² components

it achieves placement rates

of up to 23,500 comp./h. It

also extends the component

range up to a size of 50 x

40 mm². During placement,

the placement heads fetch

the components from the at-

rest component supply, and

set them down on the PCB,

which is also stationary. This

proven SIPLACE principle

guarantees reliable pick-up

of even the smallest compo-

nents, prevents the compo-

nents slipping on the PCB

and minimizes traversing

paths.

The user also has access to

different variants of the PCB

conveyor: the SIPLACE

single conveyor and flexi-

ble SIPLACE dual con-

veyor. The latter offers all

the benefits of the conven-

tional dual conveyor, such as

reducing non-productive

downtimes, combined with

the option of using the single

conveyor.

Quad Lane Conveyor

The quad lane conveyor

allows up to four different

products to be produced on a

line at the same time. It is so

flexible, that it can be config-

ured as a 1-lane, 2-lane or 4-

lane conveyor simply by

changing the software set-

tings. The quad lane con-

veyor can be ordered

together with SIPLACE X4I

and SIPLACE X4 placement

machines. The extremely

fast placement rate of these

machines can be efficiently

utilized, even for PCBs with

few components to be placed

or PCBs with very different

components on the top and

underside.

01005 placement without

compromise

The SIPLACE X-series is

designed to place 01005

components as standard.

There are also specially

developed nozzles for 01005

components that can be

used. With these prepara-

tions, the tiny components

can be processed without

any loss of quality and

speed. The components can

be placed with minimal spac-

ings and independently of

large components that are

beside the 01005 com-

ponent. This equates

to true 01005

capability.

SIPLACE MultiStar

Machine Description

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and SIPLACE vision teach-

ing

The SIPLACE X-series dem-

onstrates its strengths in

terms of the flexible produc-

tion environment, as well on

the high-performance side.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE Vir-

tual Product Build. This NPI

solution allows you to pro-

gram offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

This increases machine utili-

zation and reduces waste.

And with respect to the cur-

rent production run, the

SIPLACE vision teaching

station also makes it

extremely simple and fast to

generate package form

descriptions, even for com-

plex components. The set-up

process starts once you have

optimized the product and

defined all the components in

the programming system.

This is also done externally

and then checked by means

of the barcode and data

transfer.

Lowest dpm with set-up

verification and sophisti-

cated sensors

The highest machine quality

allows the SIPLACE X-series

to produce the highest prod-

uct quality. This is guaran-

teed by a number of addi-

tional features. Sensors

check the presence and

position of the components

before and after every pick-

up and placement operation

at the placement head. The

digital vision system

detects the components

faster and more reliably than

the old analog technology. In

addition, set-ups are verified

on the component roll and by

the intelligent SIPLACE X

feeder modules with refer-

ence to the barcode. This

network of tests considerably

lowers dpm rates and

increases the first pass yield.

100% uptime with intelli-

gent feeder modules

The SIPLACE X-series

works with intelligent feeder

modules that greatly simplify

set-up and set-up change

tasks. For example, the

SIPLACE X feeder modules

can even be simply con-

verted while production is

running, thus greatly reduc-

ing machine stoppages.

SIPLACE X4 LED placer

SIPLACE X4-series place-

ment machines occupy a

sizeable segment of the mar-

ket for the production of LED

backlight units for monitors.

With software SR.705

onwards we provide a config-

uration for SIPLACE X4

machines that is specially tai-

lored to the needs of custom-

ers who produce these LED

backlight units.

The SIPLACE X4 LED placer

is based on a SIPLACE X4

machine with four C&P20 or

CPP placement heads. Spe-

cial component tables are

installed in place of compo-

nent trolleys. Special cus-

tomer-specific bowl feeders

supply the LED compo-

nents. If there is only a bowl

feeder set up at the location,

a tape cutter must not be

installed at the same loca-

tion. The feeders are opti-

mally supported by the

station software with func-

tions such as the empty

feeder function, for example.

It is also possible to set up

additional SIPLACE X-feeder

modules. The PCB single

and dual conveyors pro-

cess printed circuit boards up

to 850 mm long.