IPC-CM-770D-1996 - 第11页
January 1996 IPC-CM-770 Figure 17-8 Figure 17-9 Figure 17-10 Figure 17-11 Figure 17-12 Figure 17-13 Figure 17-14 Figure 17-15 Figure 17-16 Figure 17-17 Figure 17-18 Figure 17-19 Figure 17-20 Figure 17-21 Figure 17-22 Fig…
IPC-CM-770
Januaty
1996
15.0
15.1
15.2
15.3
15.4
15.5
15.6
15.7
Table
of
Contents
.
Section
4
CONNECTORS
.......................................................
4-1
19.0
Performance Considerations
.........................
4-
1
Selection Considerations 4-
1
Part Type Descriptions 4-2
Through-Hole Mount Connectors 4-3
Surface Mounting
.........................................
4-4
Mixed Technology 4-5
Manual Assembly
.........................................
4-5
19.1
19.2
19.3
..............................
.................................
................
19.4
........................................
15.8 Automated Assembly
....................................
4-5
15.9 Handling and Storage
...................................
4-5
15.10
Soldering
.......................................................
4-6
15.11
Cleaning
........................................................
4-6
15.12 Coating
..........................................................
4-6
16.0
DISCRETE COMPONENT SOCKETS
...................
4-6
16.1 Part Type Description
...................................
4-6
16.2 Through-Hole Mounting
.............................
4-1
1
16.3 Surface Mounting
.......................................
4-13
16.4 Mixed Technology
......................................
4-14
16.5 Manual Assembly
.......................................
4-15
16.6 Automated Assembly
..................................
4-15
16.7 Handling and Storage
.................................
4-15
16.8 Soldering
.....................................................
4-15
16.9 Cleaning
......................................................
4-15
16.10 Coating
........................................................
4-15
17.0
INTERCONNECT COMPONENTS
.......................
4-15
17.1 Part Type Description
.................................
4-15
17.2 Through-Hole Mounting
.............................
4-20
17.3 Surface Mounting
.......................................
4-24
17.4 Mixed Technology
......................................
4-25
17.5 Manual Assembly
.......................................
4-25
17.6 Automated Assembly
..................................
4-25
17.7 Handling and Storage
.................................
4-25
17.8 Soldering
.....................................................
4-25
17.9 Cleaning
......................................................
4-25
17.10 Conformal Coating
.....................................
4-25
18.0
MECHANICAL COMPONENTS
...........................
4-26
18.1 Part Type Description
.................................
4-26
18.2 Through-Hole Mounting
.............................
4-28
18.3 Surface Mounting
.......................................
4-28
18.4 Mixed Technology
......................................
4-28
18.5 Manual Assembly
.......................................
4-28
18.6 Automated Assembly
..................................
4-28
18.7 Handling and Storage
.................................
4-29
18.8 Soldering
.....................................................
4-29
18.10 Conformal Coating
.....................................
4-29
18.9 Cleaning
......................................................
4-29
PACKAGING AND INTERCONNECTING
STRUCTURES
......................................................
4-29
Printed Boards
............................................
4-29
Surface Mounting
.......................................
4-30
Supporting-Plane Printed Board
Structures
....................................................
4-30
Constraining Core Printed Board
Structures
....................................................
4-32
Figure 15-1
Figure 15-2
Figure 15-3
Figure 15-4
Figure 15-5
Figure 15-6
Figure 15-7
Figure 15-8
Figure 15-9
Figure 15-10
Figure 15-11
Figure 15-12
Figure 15-13
Figure 16-1
Figure 16-2
Figures
Typical Polarization
...................................................
4-2
Connector with Keying and Polarization
..................
4-2
Card Edge Connector to Ribbon Cable
....................
4-2
Card Edge Connector for Discrete Wiring
...............
4-2
Card Guide Connector
...............................................
4-3
Two-piece Connector System
....................................
4-3
Header Connectors
.....................................................
4-3
Female Receptacles
...................................................
4-4
Connector with Press Fit Contacts
............................
4-4
Surface Mount Connector
.........................................
4-5
D-subminiature Surface Mount Connector
...............
4-6
Surface Mount Receptacle
.........................................
4-7
Box-contact Surface Mount Receptacle
....................
4-7
Low Profile Pluggable Devices
.................................
4-8
Low Profile Devices
..................................................
4-8
Figure 16-3 Closed Bottom Socket
...............................................
4-8
Figure 16-4 Low Profile Grip Type Device
..................................
4-8
Figure 16-5
Use of Low Profile Grip Devices
.............................
4-8
Figure 16-6 Styles of Low-Profile Grip Devives
..........................
4-9
Figure 16-7
Contact Configurations
..............................................
4-9
Figure 16-9 Surface Mount Chip Carrier Socket
........................
4-10
Figure 16-10 Pin Grid Array Sockets
............................................
4-11
Figure 16-11 Leadless Grid Array Socket
....................................
4-12
Figure 16-12 Section Through Socket Solder Contact
.................
4-12
Figure 16-13 Screw Down Cover
.................................................
4-13
Figure 16-15 Section Through Pressure Mounted Socket
............
4-14
Figure 16-8 DIP Socket
...............................................................
4-10
Figure 16-14 High Speed Circuit Socket
......................................
4-13
Figure 16-16 Example of 68
I/O
Land Pattern on Printed
Board Structure
........................................................
4-14
Figure 17-1 Typical Turret Terminals
.........................................
4-16
Figure 17-3
Typical Pin Terminals
..............................................
4-17
Figure 17-4 Typical Solder Cup Terminal
..................................
4-17
Figure 17-5 Typical Crimp Terminal
...........................................
4-17
Figure 17-2 Typical Bifurcated Terminals
..................................
4-16
Figure 17-6
Expendable Carrier Strip
.........................................
4-18
Figure 17-7
Stamped Pins
...........................................................
4-18
vi
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
January
1996
IPC-CM-770
Figure 17-8
Figure 17-9
Figure 17-10
Figure 17-11
Figure 17-12
Figure 17-13
Figure 17-14
Figure 17-15
Figure 17-16
Figure 17-17
Figure 17-18
Figure 17-19
Figure 17-20
Figure 17-21
Figure 17-22
Figure 17-23
Figure 17-24
Figure 17-25
Figure 18-1
Figure 18-2
Figure 18-3
Figure 18-4
Figure 18-5
Figure 19-1
Figure 19-2
Figure 19-3
Figure 19-4
Figure 19-5
Figure 19-6
Figure 19-7
Figure 19-8
Table 16-1
Table 17-1
Table 17-2
Table 17-3
Table 17-4
Table 17-5
Table 19-1
Compliant Press-fit Pins
..........................................
4-18
Solder Carrying Pins
...............................................
4-18
Vertically Mounted Bus Bars
..................................
4-19
Horizontally Mounted Bus Bars
.............................
4-20
Under-DIP Mounted Bus Bars
................................
4-20
One-terminal Printed Board Test Point
...................
4-21
Two-terminal Printed Board Test Point
..................
4-21
Terminal Installation. Single-Sided Board.
Soldered on Shoulder Side
......................................
4-21
Terminal Installation. Single-Sided Board.
Soldered on Flared Flange Side
..............................
4-22
Installation of Terminal in Plated-through Hole
.....
4-22
Elliptical Swaging
....................................................
4-22
Placement of Terminal-Mounted Components
.......
4-22
Double-ended Terminal
...........................................
4-23
Terminal Wrap Prior to Soldering
...........................
4-23
Methods of Mounting Jumpers
...............................
4-23
“Wrapping Terminology”
.......................................
4-24
Conventional Solderless Wrapped Connection
.......
4-24
Modified Solderless Wrapped Connection
..............
4-24
Common Component Heat Sinks
............................
4-26
Solderable Heat Sink
...............................................
4-26
Typical Spacers
........................................................
4-27
Can Mounting Spreader
...........................................
4-27
Thermally Conductive Insulator
..............................
4-27
Printed Board Bonded to Supporting Plane
...........
4-30
Sequentially-processed Structure with
Supporting Plane
......................................................
4-32
Discrete-wire Structure with Low-expansion
Metal Support Plane
................................................
4-32
Flexible Printed Board with Metal Support
Plane
.........................................................................
4-33
Printed Board with Supporting Plane (Not
Electrically-functional Constraining Core)
.............
4-33
Multilayer Printed Board Structure with
Copper-clad Invar Power and Ground Planes
(Electricallyfunctional Constraining Cores)
............
4-34
Balanced Structure with Constraining Core
not at Neutral Axis
..................................................
4-34
Balanced Structure with Constraining Core
on Neutral Axis
........................................................
4-34
Tables
Socket Types
...............................................................
4-10
Current Carrying Capacity of Small Wires
...............
4-19
Breaking Strength of Small Wires
.............................
4-19
Turns Requirement
.....................................................
4-24
Wire Size (in inches)
..................................................
4-24
Nicked or Broken Strand Limits
................................
4-25
Packaging and Interconnecting Structure
Comparison
.................................................................
4-31
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COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
IPC-CM-770
Januaty
1996
20.0
20.1
20.2
20.3
20.4
21
.o
21.1
21.2
21.3
21.4
21.5
21.6
22.0
22.1
22.2
22.3
22.4
23.0
23.1
23.2
23.3
23.4
24.0
24.1
24.2
24.3
24.4
24.5
24.6
24.7
24.8
25.0
25.1
25.2
25.3
25.4
Table
of
Contents
.
Section
5
Figure 21-5 Lead Terminations
.....................................................
5-9
v
....................................
5-1
Figure 21-6 Clinch Patterns
.........................................................
5-11
General
Considerations""""""""""""""""'
5-1
Figure 21-7 Clinched Leads
........................................................
5-12
Figure 21-8 Offset Clinched Lead
...............................................
5-12
Figure 21-9 Straight Through Leads (Semi-clinched Leads)
.....
5-12
Figure 22-1 Depleted Solder
.......................................................
5-13
Assembly Processes
......................................
5-
1
Process Flow
.................................................
5-1
Materials
.......................................................
5-2
THROUGH-HOLE
MOUNTING
TECHNIQUES .....
5-7
Figure 22-2 Lead Forming for Surface Mounting
......................
5-13
General Considerations
.................................
5-7
Figure 22-3
Preferred Mounting Orientations
.............................
5-14
Component Preparation
................................
5-7
Figure 23-1
Chip Termination Techniques
..................................
5-16
LeadHole Relationships
...............................
5-7
Figure 23-2 Thermocompression Ball Wire Bonding
Component Retention 5-7
Lead Configuration After Assembly
5-9
................................................................
Parameters 5-17
...................................
Figure 23-3 Mechanics of Thermocompression Ball Wire
............
Bondine
....................................................................
5-18
u
Assembly
.....................................................
5-12
Figure 23-4 Thermocompression Stitch Wire Bonding
..............
5-19
......................................................................
Automated Assembly 5-14
Quality Assurance
.......................................
5-14
System 5-20
Figure 23-8 COB Chip Handling System Block Diagram
.........
5-21
Figure 23-9 Fully-integrated COB Assembly System
................
5-21
..................................
CHIP-oN-BoARD
..........
5-14
Figure 24-1 Typical TAB Process Flow (bumbed wafer)
..........
5-22
General Considerations
...............................
5-14
~i~~~~ 24-2 Interconnection
G~~~~~~
of
B d ~i~
TAB
....
5.23
Die Attachment
...........................................
5-14
~i~~~~ 24-3 Interconnection
G~~~~~~
of
Bumped
Interconnection Techniques
........................
5-15
TAB (BTAB) 5-23
Assembly
.....................................................
5-19
Figure 24-4
l., 2., and 3 layer TAB Contructions
.....................
5-24
............................................................
TAPE AUTOMATED BONDING (TAB)
................
5-20
Figure 24-5 Excising of the leaded die from the tape
carrier
.......................................................................
5-24
Advantages
..................................................
5-20
Figure 24-6 TAB Mounting Options
...........................................
5-25
Disadvantages
.............................................
5-22
Figure 24-7 Registered Features for TAB Tape Outer-lead
...................
Types of TAB 5-22
Types of Tape
.............................................
5-23
Figure
25-1
Modifications
for
Through-ho1e
Bonding from JEDEC outline UO-O17 5-26
.............................................
Applications
.............................................................
5-27
TAB Applications
.......................................
5-24
Applications
.............................................................
5-27
Pattern Standardization (TAB Tape)
..........
5-25
Figure 25-3 Placement Machine Considerations
........................
5-28
Encapsulation
..............................................
5-25
Figure 25-4 Through-the Board Component Types
....................
5-29
Outer-Lead Bonding (OLB)
.......................
5-23
Figure 25-2 Component Modifications for Surface Mounting
INTERMIXED
TECHNOLOGY .............................
5-26
General Considerations
...............................
5-27
Manual Assembly
.......................................
5-3
1
Automated Assembly
..................................
5-3
1
Quality Assurance
.......................................
5-32
Figures
Figure 25-5 Surface Mount Component Types
...........................
5-29
Figure 25-6 Single-sided Board Assemblies
...............................
5-30
Figure 25-7 Double-sided/multilayer Board Assembly
..............
5-30
Figure 25-8 Mixed Technology Assemblies
................................
5-30
Figure 25-9 Sample Process Sequence
.......................................
5-30
Figure 25-10 Class
C-2
Process Sequence
....................................
5-32
Figure 25-11 Panel Assembly Tooling Holes
...............................
5-33
Figure 25-12 Positive Symbol Machine Correction
.....................
5-33
Figure
20-1
Clip-mounted
.........................................
5-4
Figure 25-13 Chip Placement
........................................................
5-33
Figure 20-2 Strap Securing
............................................................
5-4
Figure 21-1 Component Mounting Sequence
...............................
5-8
Tables
Figure 21-2 Component Retention-Deep Solder
........................
5-8
Table
20-1
Through
Hole
and
Mount
Assembly
Figure 21-3 Conforming Web-like Material
.................................
5-9 Process Flow Comparison
............................................
5-3
Figure 21-4 Thermal Shunt
...........................................................
5-9 Table 20-4 Various Bonding Adhesive Types 5-5
................................
...
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COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services