IPC-CM-770D-1996 - 第18页

January

1996

IPC-CM-770

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Components (mounted) on only one side of the board

Through-hole

Simple

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CHIP COMPONENT SOE

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BGA

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Similar, Not Shown

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Components (mounted) on both sides of the board

?-Sided Thru-hole (NOT RECOMMENDED)

SMT

Complex

FPT

Simple

THISMT

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-CHIPe COMPONENT

Wire bond

or

tab IC chip

attachment

PLCC

CHIP

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COMPONENT

THT

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DIP

COB

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TAB

Flip Chip

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COMPONENT

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Similar, Not Shown

(selectively attached)

Class A

=

Through-hole component mounting only

Class B

=

Surface mounted components only

Class C

=

Simplistic through-hole and surface mounting intermixed assembly

Class

X

=

Complex intermixed assembly, through-hole, surface mount, fine pitch and BGA

Class

Y

=

Complex intermixed assembly, through-hole, surface mount, ultra fine pitch, chip scale

Class

2

=

Complex intermixed assembly, through-hole, ultra fine pitch, COB, flip chip, TAB

IPC-1-001229

Figure 1-1 Electronic Assembly Types

2.2 Joint Industry Standards' J-STD-003

Solderability Tests for Printed Boards

J-STD-001

Requirements for Soldered Electrical and Elec-

J-STD-004

Requirements for Electronic Soldering Fluxes

tronic Assemblies

J-STD-005

Requirements and Test Methods for Solder

J-STD-002

Solderability Tests for Component Leads, Ter-

minations, Lugs, Terminals and Wires

J-STD-006

General Requirements and Test Methods for

Paste

1-3

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

IPC-CM-770

Januaty

1996

Electronic Grade, Soft Solder Alloys and Fluxed and Non-

Fluxed Solid Solders for Electronic Soldering Applications

2.3 Department of Defense2

MIL-STD-1

O0

Engineering Drawing Practices

MIL-STD-129

Marking for Shipment and Storage

MIL-STD-202

Test Methods for Electronic and Electrical

Component Parts

MIL-STD-454

Standard General Requirements for Elec-

tronic Equipment

MIL-STD-883

Test Methods and Procedures for Microelec-

tronics

MIL-STD-1344

Test Methods for Electrical Connectors

MIL-1-7444

Insulation Sleeving, Electrical, Flexible

MIL-C-11268

Parts, Materials, and Processes, Used in

Electronic Equipment

MIL-P-13949

Plastic Sheet, Laminated, Metal Clad, for

Printed Wiring Boards

MIL-S-1 9500

Semiconductor Devices, General Specifica-

tion

MIL-1-23053

Insulation Sleeving, Electrical, Heat Shrink-

able

MIL-P-28809

Printed Wiring Assemblies

MIL-M-3851

O

Semiconductor Devices, General Specifica-

tion

MIL-P-55110

Printed Wiring Boards

MIL-S-83502

Sockets, Plug-In Electronic Component,

Round Style

2.4 Electronic Industries Association3

JEDEC-95

JEDEC Registered and Standard Outlines for

Solid State Products

RS-167

Type Designation for Receiver Type Tube Sockets

RS-186-9E

Standard Test Methods for Passive Electronic

Component Parts-Method

9,

Solderability Rev. E

RS-192

Holder Outlines and Pin Connections for Quartz

Crystal Units

RS-198

Ceramic Dielectric Capacitors

RS-228

Fixed Electrolytic Tantalum Capacitors

RS-296

Lead Taping, Axial Components

RS-367

Dimensional and Electrical Characteristics Defin-

ing Receiver Type Sockets

RS-376

Fixed Film Dielectric Capacitors in Metallic and

Non-Metallic Cases for D.C. Application

RS-415

Dimensional and Electrical Characteristic Defin-

ing Dual-In-Line-Type Sockets

RS-428

Type Designation System for Microelectronic

Devices

RS-468

Lead Taping, Radial Components

RS-471

Symbol and Label for Electrostatic Sensitive

Devices

RS-481

Lead Taping, Leadless Components

RS-488

Sockets, Individual Lead Types (for Electrical and

Electronic Components)

2.5 American National Standards Institute4

ANSI Y-1 4.5

Dimensioning and Tolerancing

2.6 Underwriters Laboratories5

UL-1244

Electrical and Electronic Measuring and Testing

Equipment

2.7 American Society for Testing and Materials6

B25

Standard Nominal Diameters and Cross-Sectional

Areas of AWG Sizes of Solid Round Wires Used as Elec-

trical Conductors

F72

Gold Wire for Semiconductor Lead Bonding

F487

Fine Aluminum-

1

%

Silicon Wire for Semiconductor

Lead Bonding

D3295

Standard for PTFE Tubing

2.8 Other Documents

IEC-348

Safety Requirements for Electronic Measuring

Apparatus

FCC

Docket

20780

3.0 TERMS AND DEFINITIONS

Terms and definitions used herein are in accordance with

IPC-T-50 except as otherwise specified. Note: Any defini-

tion denoted with as asterisk

(*)

is a reprint of the defini-

tion defined in IPC-T-50.

2. Publications are available from Naval Publications and Form Center, 5801 Tabor Road, Philadelphia, PA 19120.

3. Electronic Industries Association, 2001

"I"

Street, NW, Washington, DC 20006.

4. American National Standards Institute, 11 W. 42nd St., New York, NY 10036.

5. Underwriters Laboratories, Inc., 333 Pfingsten Rd., Northbrook, IL 60062.

6. American Society for Testing and Materials, 1916 Race St., Philadelphia, PA 19103-1187.

1-4

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

January

1996

IPC-CM-770

3.1 *Assembly

A number of parts of subassemblies or

any combination thereof joined together.

Note: When this term is used in conjunction with other

terms listed herein, the following definitions shall prevail.

printed wiring assembly

-

An assembly that uses a

printed wiring board for component mounting and

interconnecting purposes.

multilayer printed wiring assembly

-

An assembly

that uses a multilayer printed wiring board for com-

ponent mounting and interconnecting purposes.

printed circuit assembly

-

An assembly that uses a

printed circuit board for component mounting and

interconnecting purposes.

multilayer printed circuit assembly

-

A multilayer

printed circuit board on which separately manufac-

tured components and parts have been added.

printed board assembly

-

An assembly of several

printed circuit assemblies or printed wiring assem-

blies, or both.

3.2 *Base Material

The insulating material upon which

the conductor pattern may be formed. (The base material

may be rigid or flexible or both. It may be a dielectric sheet

or insulated metal sheet.

3.3 *Castellations

A recessed metallized features on the

edge of a leadless chip carrier that is used to interconnect

conducting surfaces or planes within or on the chip carrier.

3.4 *Chip Carrier

A low-profile, usually square, surface

mount component semiconductor package whose die cavity

or die mounting area is a large fraction of the package size

and whose external connections are usually on all four

sides of the packaged. (It may be leaded or leadless.)

3.5 *Clinched Leads

A component lead that is inserted

through a hole in a printed board and is then formed in

order to retain the component in place and in order to make

metal-to-metal contact with a land prior to soldering. (See

also “Partially-Clinched Lead.”)

3.6 Coefficient of Thermal Expansion (CTE)

The linear

thermal expansion per unit change in temperature.

3.7 *Coefficient of Thermal Expansion Mismatch

(CTE)

The linear dimensional change of a material per

unit change in temperature. (See also “Thermal Expansion

Mismatch.”)

3.8 *Component

The individual part or combination of

parts that, when together, perform a design function(s).

(See also “Discrete Component.”)

3.9 *Component Lead Hole

A hole used for the attach-

ment and electrical connection of component terminations,

including pins and wires, to the printed board.

3.10 *Component Mounting Site

A location on a pack-

aging and interconnection structure that consists of a land

pattern and conductor fan out to additional lands for test-

ing or vias that are associated with the mounting of a single

component.

3.11 *Conductive Pattern

The configuration or design

of the conductive material on the base material. (Includes

conductors, lands, vias, heatsinks and passive components

when these are an integral part of the printed board manu-

facturing process.)

3.12 *Conductor

A single conductive path in a conduc-

tive pattern.

3.13 *Constraining Core

A supporting plane that is

internal to a packaging and interconnecting structure.

3.14 *Double-Sided Assembly

A packaging and inter-

connecting structure with components mounted on both the

primary and secondary sides. (Also see “Single-Sided

Assembly.”)

3.1

5

*Dual lnline Package (DIP)

A basically -rectangular

component package that has a row of leads extending from

each of the longer sides of its body that are formed at right

angles to a plan that is parallel to the base of its body.

3.1 6 *Edge Board Connector

A connector designed spe-

cifically for making nonpermanent interconnections

between the edge-board contacts on a printed board.

3.17 *Flat Pack

A rectangular component package that

has a row of leads extending from each of the longer sides

of its body that are parallel to the base of its body.

3.1 8 *Footprint

(see preferred term “Land Pattern”)

3.1 9 *Grid

An orthogonal network of two sets of parallel

equidistant lines used for locating points on a printed

board.

3.20 Integrated Circuit (IC)

An assembly of miniature

electronic components simultaneously produced in batch

processing, on or within a single substrate to perform an

electronic circuit function.

1-5

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services