IPC-CM-770D-1996 - 第3页

GPC THE INSTITUTE FOR INTERWNNECTING AND PACKAGING ELECTRONIC ORCUITS IPC-CM-770D Guidelines for Printed Board Component Mounting Developed by the Institute for Interconnecting and Packaging Electronic Circuits Users of …

Notice

IPC Standards and Publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitat-

ing interchangeability and improvement of products, and assisting the pur-

chaser in selecting and obtaining with minimum delay the proper product for

his particular need. Existence of such Standards and Publications shall not

in any respect preclude any member or nonmember of IPC from manufacturing

or selling products not conforming to such Standards and Publication, nor

shall the existence of such Standards and Publications preclude their voluntary

use by those other than IPC members, whether the standard is to be used

either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to

whether their adoption may involve patents on articles, materials, or processes.

By such action, IPC does not assume any liability to any patent owner, nor

do they assume any obligation whatever to parties adopting the Recommended

Standard or Publication. Users are also wholly responsible for protecting

themselves against all claims of liabilities for patent infringement.

The material in this standard was developed by the IPC-CM-770 Task Group

(5-21a) of the Assembly

Joining Processes Committee (5-20) of the Institute

for Interconnecting and Packaging Electronic Circuits.

IPC 1996

Original Publication September 1968

Revision

March 1976

Revision

October 1980

Revision C March 1987

Revision

January 1996

Licensed by Information Handling Services

GPC

THE

INSTITUTE

FOR

INTERWNNECTING

AND

PACKAGING

ELECTRONIC

ORCUITS

IPC-CM-770D

Guidelines for Printed

Board Component

Mounting

Developed

the Institute for Interconnecting and Packaging

Electronic Circuits

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

2215 Sanders Road

Northbrook, Illinois

Tel 847 509.9700

Fax 847 509.9798

60062-61

Licensed by Information Handling Services

January

1996

IPC-CM-770

Acknowledgment

Any Standard involving a complex IPC-CM-770 Task Group of the assisted in the evolution of this

technology draws material from a Assembly

Joining Processes standard. To each of them, the

vast number of sources. While the Committee are shown below, it is not members of the IPC extend their

principle members of the possible to include all of those who

gratitude.

Assembly

Joining

Processes Committee

Chairman

Jim Reed

T.I.

IPC-CM-770

Task Group

Chairman

Sue Jones

Wilcox

Technical Liaison

the

IPC Board

Directors

Carl McCormick

Group Technologies

IPC-CM-770 Task Group

Arnold, Daniel, EMD Associates Inc.

Bellardo, Aldo, Alcatel Italia S.P.A.

Brill, Charles, Amp Inc.

Davy, J. Gordon, Westinghouse

Felty, Joe, Texas Instruments Inc.

Ferrari, Gary, Tech Circuits Inc.

Igo, Greg, Amkor Electronics Inc.

Jarboe, Mike, Alliedsignal Aerospace

Jawitz, Martin, Eimer Company

Electric Corp.

Jones, Sue, Wilcox Electric Inc.

Kenyon, William, Global Centre for

Knowles, Larry, Librascope Corp.

Lambert, Leo, Digital Equipment

Lovati, Guido, Alcatel Italia S.P.A.

Mackzum, Stan, Ericsson GE

Officer, R. Bruce, Lockheed

Process Change

Corp.

Sanders Inc.

Rudy, Donald, AT&T Bell

Rumps, Don, AT&T Technology

Schneider, Alvin, Alpha Metals Inc.

Schoenthaler, David, AT&T Bell

Swenson, Don, Alliedsignal Inc.

Taylor, Ralph, Lockheed Martin

Laboratories

Systems

Laboratories

Corporation

Licensed by Information Handling Services