IPC-CM-770D-1996 - 第31页

January 1996 IPC-CM-770 6.2.2 Land Patterns Information on land patterns fol- lows that cited in Section 5.2.2 for axial-leaded compo- nents. IPC-1-00183 I Figure 6-5 Stress Relief Leads 6.2.3 Vertical Mounting Component…

IPC-CM-770

Januaty

1996

0.4

Not

Recommended Recommended

Component mounted flush to prlnted board. Component mounted wlth adequate clearance between end

NOTES:

The purpose of ralslng the component body off the

If the component

mounted tight to the board

(no

board surface is to facilitate solder flow, escape of

clearance) component movement will unduly Stress

gases in soldering and cleaning. Normally, this

the component lead.

accomplished only by raising the component

off

Conformal coating

application

and coverage may nec-

the board There are, however, certain hole

essitate

an increase

the

0.015’’

mlnlmum

dlmen-

support devices that can support the component

son.

and still accomplish solder flow, gas liberation,

Care should

taken when uslng spacers with

hlgh

and cleaning.

coefficlents of thermal expansion.

body and board; spacer may

used.

IPC-1-00145

Figure 5-1

Vertical Mounted Axial Lead Components

IPc-I-00040

Figure 6-1 Rectangular Radial Lead Capacitors

IPC-1-00155

Figure 6-2 Round Radial Lead Capacitor

leads of radial- lead components by forming the leads out-

ward from the normal component lead pattern to an

IPC-1-00149

Figure 6-3 Cast Radial Lead Capacitor

r”

IPC-1-00148

Figure 6-4 Radial-leaded “TO-3” Transistor Can

enlarged pattern to provide a degree of stress relief. (See

Figure

6-5.)

Another method of providing stress relief for

radial-lead components is the use of a flexible low-modulus

spacer supported by rounded protrusions.

2-6

Licensed by Information Handling Services

January

1996

IPC-CM-770

6.2.2 Land Patterns

Information on land patterns fol-

lows that cited in Section

5.2.2

for axial-leaded compo-

nents.

IPC-1-00183

Figure 6-5 Stress Relief Leads

6.2.3 Vertical Mounting

Components whose leads are on

one side should be mounted

their axes are as parallel

and perpendicular to the mounting base as practicable.

Components should have their vertical axis within

15"

the perpendicular plane of the mounting base unless

restricted by design. (See Figure

6-6.)

Any bend on the

lead should not fracture the case.

Components installed on boards with lands on the compo-

nent side should maintain a minimum clearance of

0.4

between the surface of the circuitry and where the coating

ends on the lead. (See Figure

6-7.)

A typical method for vertical mounting in unsupported

holes is shown in Figure

6-8.

IPC-1-00152

Figure 6-8 Radial Components Mounting (Unsupported

Holes)

Greater than

Not

Recommended

Recornmended

Vertical

axis

greater than

15''

from perpendlcular plane Axes

component are perpendicular and

horizontal

to the

mountlng base. mounting base wlthln prescrlbed angle requirements.

IPC-1-00150

Figure 6-6 Vertical Mounted Radial-lead Components

Not

Recommended

Coating on lead extends into solder joint

Recommended

IPC-1-00151

Figure 6-7 Vertical Mounted Components Coating Extension

The coating on leads should not be removed beyond where

6.2.4 Horizontal Mounting

When components are

the lead enters the component body. Components should be mounted horizontally, mounting clips or adhesives should

placed

the coating does not enter the mounting hole.

2-7

Licensed by Information Handling Services

IPC-CM-770

Januaty

1996

be used. A typical method of mounting a component of this

type is shown in Figure 6-9.

I I

'C-

-00185

Figure 6-9 Horizontal Mounting of Radial Leaded

Component

6.2.5 Metal Power Packages

Metal power packages

shown in Figure 6-10 should be mounted in accordance to

the following:

Lead holes may be plated through but should not be inter-

facial or interlayer if the component body is mounted in

contact with the board or circuitry thereon.

Component body should be spaced a minimum of 0.25

mm above the board surface if lead holes are interfacial

or interlayer (to permit solder flow to and onto the com-

ponent land).

Leads may be tempered or exceed 1.25 mm in diameter

provided they are not clinched against the printed board

land.

A washer should be inserted between each screw head

and the land (to preclude damage to the land).

A washer should be inserted between each screw head

and the board material (to preclude board damage).

Nut should be lock type or should be retained by locking

devices.

The heat sink or device mounting flange may be provided

with threads to match mounting screw for solder lug.

Resilient material and/or insulating material used as

required functionally or as standoffs.

Torque specification.

IPC-1-00049

Figure 6-1

Metal Power-package Transistor Mounted on

Resilient Standoffs

6.3 Surface Mounting

Radial-leaded components are

primarily suited for use in through-hole mounting technol-

ogy. However, when it is necessary to surface mount such

components, the guidelines of Section 22.1 should be fol-

lowed.

6.4 Mixed Technology

The assembly of surface mounted

devices in combination with radial-leaded through-hole

mounted devices requires two assembly processes if sur-

face mounted devices are positioned on the same printed

boards through which through-hole devices are placed. A

combination of reflow and wave solder assembly is

employed. See Section 25 for more information on mixed

assembly technology.

6.5 Manual Assembly

Procedures to be employed follow

practices to reduce contamination and damage to the com-

ponents. Identification marking is desirable on printed wir-

ing to assure proper placement of components during

assembly. Manual assembly practices as covered in Part

Five should be followed.

6.6 Automated Assembly

General information on auto-

mated techniques are covered in Part Five. Attention

should be given to control insertion forces on preformed

leads

as to not compromise clearance of components

from printed board surface to assure sufficient clearance for

cleaning after assembly.

6.7 Handling and Storage

The handling and storage of

radial-leaded components should be in accordance with the

guidelines of Section 26.

6.8 Soldering

General soldering techniques applying to

all types of components are described in Section 27.

6.9 Cleaning

General techniques for cleaning applying

to all types of components are described in Section 28.

6.1

Conformal Coating

General techniques for confor-

mal coating for all types of assemblies are described in

Section 29.

7.0 CHIP (TWO-TERMINAL) COMPONENTS

Almost every kind of two (and many three and four) termi-

nal device is available in chip component form. The most

common are chip resistors, chip capacitors and diodes but

linear magnetic devices (chokes and transformers), crystals

and even more complex devices are made in chip form.

7.1 Part Description

Chip component sizes range from

chip diodes on the order of 0.6 mm x 0.6 mm to large

capacitors that are over 9.0 mm x 2.5. Most other chip

components can be solder assembled to printed board

structures with assembly technologies similar to those

described for through-hole mounted components.

2-8

Licensed by Information Handling Services