IPC-CM-770D-1996 - 第42页

January

1996

IPC-CM-770

method. The radial method requires a clearance around the

body diameter of approximately 2.0 mm larger than the

body.

FRONT

VIEW

PLAN

VIEW

.O70

4

.O70

Spacing

on

two-lead

side

may

be

.100/.125"

IPC-1-00167

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Figure 8-15 Transistor Assembly Tools

8.6.2 Radial Method

The component body is held during

the insertion process for means of inserting and locating

the part on the board. After the leads are prepped, the major

problem with the radial technique is that the physical con-

figuration of the parts vary substantially from batch to

batch, and from manufacturer to manufacturer.

8.6.3 Axial Method

The axial method of automatic inser-

tion is used the transistor is treated like an axial-leaded

component. This system for handling TO-92, TO-18, and

similar transistors, is based on forming the leads as shown

in Figure 8-16 and taping them on conventional lead tape,

just like and axial-leaded component.

Since the physical configuration of the component can vary

due to manufacturers' processes, it is advisable to obtain

parts on reels with thick interliners. This would ensure the

handling of one size part only. (See Figure 8-16.)

Once on tape, the insertion problem becomes one of com-

patible wire diameter-since the part is handled only by

the leads and a body clearance to a maximum envelope. As

a result, nearly all vendors' devices can be used by a single

insertion head without retooling. Spans from 7.6 to 10.2

mm are possible.

8.7 Handling and Storage

The handling and storage of

multiple-radial-lead components should be in accordance

with the guidelines of Section 26.

8.8 Soldering

General soldering techniques applying to

all types of components are described in Section 27.

8.9 Cleaning

General techniques for cleaning applying

to all types of components are discussed in Section 28.

8.10 Conformal Coating

General techniques for confor-

mal coating for all types of assemblies are described in

Section 29.

Notes:

1. Heavy Kraft

or

single ply

"A*

type corrugated interliner to be used.

2. Lead length in contact with tape, each side-,120" minimum.

3.

Leads must be straight within ,015" between body and tape.

4.

Component bodies

must

be in line withil .015"

5.

No

more than one component may be missing at a gap.

6.

Distance between tapes may not go below minimum shown.

Variation of

,060"

over reel permisslble.

7.

Both In-line leads (TO-92, TO-98, etc.) and TO-18 pin conflgurations

suitable for this process.

8. Insertion spacmg

IS

a function of part width.

For example: for

,235

"

width, it is

,400'

Certain plastlc devices can be handled down to

300'.

IPC-1-00374

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Figure 8-16 Taping Specifications (Only Inches Shown)

9.0 SMALL OUTLINE COMPONENTS

Small outline

(SO)

components are available in a series of

molded plastic packages with .025" pitch and up to

.050"

pitch. They are designed to be surface mounted to the PCB

or to other substrates and therefore are supplied with gull-

wing or

J

shaped lead configuration.

9.1 Part Type Description

9.1.1 SOIC Packages

Small outline integrated circuit,

(SOIC) packages can have eight, fourteen, sixteen, twenty,

twenty-four or twenty-eight leads and fall into two groups.

The leads are arrayed as two rows of leads with adjacent

leads spaced 1.25 mm apart. It the smaller component

group, consisting of SO-8, SO-14, and SO-16 packages, the

rows are spaced about 6.0 mm apart while in the group of

larger components, consisting of S0-16L, SO-20, SO-24

and SO-28 packages, the rows of leads are about

10.0

mm

apart. A typical SOIC package is illustrated in Figure 9-1.

9.1.2 SOT Packages

Three leaded components are des-

ignated SOT packages. There are two common SOT pack-

ages: SOT-23 and SOT-89. In general, SOT packages are

used with diodes, transistors and small I/O devices (devices

with only a limited number of input-output lead require-

ments). SOT packages are illustrated in Figure 9-2.

3-5

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COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

IPC-CM-770

Januaty

1996

view

+

7

4

040 150

tt

4

L-

o12

SO-16

(INCHES

SHOWN)

IPC-1.00375

Figure 9-1 SO-1 6 Package Drawings Typical Dimension

9.1.3 Outlines

SO

package are included in JEDEC

95-83.

9.2 Through-Hole Mounting

so

devices are not

designed for through-hole mounting.

9.3 Surface Mounting

9.3.1 Component Preparation

SO

devices are supplied

by the manufacturers preformed for surface mounting.

Lead configurations are illustrated in Figures 9-1 and 9-2.

9.3.2 Land Patterns

Land pattern configurations for

small outline packages are provided in IPC-SM-782.

The SOT-23 package is the most common three leaded sur-

face mount device configuration. SO-89 packages are used

for high power devices where heat transfer to the support-

ing printed board is important.

With an SOT-23, the single land on one side of the pack-

age can be enlarged when reflow soldering is used,

so

that

the solder-lead surface tension is more nearly balanced.

When wave soldering is used the parts are held onto the

board with an adhesive and the surface tension balance is

not important.

9.3.3 LeadlLand Configuration After Assembly

so

devices may be mounted with or without adhesive.

If

adhe-

sive is used to secure the

SO

package to the substrate,

major considerations are:

The adhesive must not contaminate the land area.

The adhesive must be cured prior to soldering

9.3.4 Mounted Component Configurations

Applicable

guidelines are included in Section 22.

9.4 Mixed Technology

Higher count

SO

devices are nor-

mally mounted on the component side of the substrate

while the small SOT devices can be found on both sides.

Therefore, the guidelines of Section 25 are the usual

method of fabrication when the assembly uses both

SO

devices and through-the-board mounted devices.

9.5 Manual Assembly

Manual techniques for assembly

using

SO

devices are included in Section 22.

9.6 Automated Assembly

Automated techniques for

assembly using

SO

devices are included in Section 22.

9.7 Handling and Storage

The handling and storage of

small-outline components should be in accordance with the

guidelines of Section 26.

9.8 Soldering

General soldering techniques applying to

all types of components are described in Section 27.

9.9 Cleaning

General techniques for cleaning applying

to all types of components are described in Section 28.

9.1

O

Conformal Coating

General techniques for confor-

mal coating for all types of assemblies are described in

Section 29.

10.0 INLINE-LEAD COMPONENTS

10.1

Part Type Description

10.1.1 Dual-lnline Packages

The dual inline multiple-

lead component (DIP) has its lead pointing downward

ready for insertion into holes in a printed board.

The dual inline package can be inserted easily, either auto-

matically or manually. Sockets are available for mounting

and testing purposes. Automatic insertion is very feasible

using this package configuration.

A DIP is made of metal, ceramic, glass, plastic, or combi-

nations of these materials. Leads, body, and glass sealing

are designed to make this a rugged package. Lead configu-

ration (shoulder) provides a standoff feature. Leads formed

3-6

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Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

January

1996

IPC-CM-770

i

I

l

I

L

'I

t-"I

t

T

SOT

23

t"i

SOT

89

IPC-I-

Typical SOT Packages

into a

10+5"

vee provide retention of the component. (See

Figure

10-

1

.)

10.1.2 Single-lnline Packages

The single inline (SIP)

components are similar to the dual inline (DIP) compo-

nents with leads that exit the component body "in-line"

2.54

mm apart center to center, but in a single row pattern

rather that the dual row (square) pattern of the DIP (see

Figure

10-2).

Single inline (SIP) component configuration is usually

associated with resistor networks and can therefore reduce

handling, inventory, and assembly require- ments by the

use of a single component, versus a number of discrete

components. Advantageous use of the SIP type component

are applications where printed board real estate is limited.

10.2 Through-Hole Mounting

10.2.1 Component Preparation

SIP components are

ready for manual insertion without the use of special tools

or fixtures. Lead preparation is not normally required. Lead

clinching is required for component retention on board

through manufacturing operations. Standoffs are usually

built-in to the component body to accomplish proper board

spacing as shown in the typical SIP specification in Figure

10-2.

For DIP packages (whether lands are of a round,

square or ribbon across section) leads should be dressed to

3-7

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Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services