IPC-CM-770D-1996 - 第59页

IPC-CM-770

Januaty

1996

make adequate contact with substrate solder lands. Flatness

of the substrate is also of concern and needs to be con-

trolled.

12.3.2 Land Patterns

The land patterns used with chip

carriers fall into two main categories, high density and low

density,based on the local routing density associated with

the surface mounted device. The selection, design and posi-

tion of the land geometry in relation to the chip carrier

have a significant impact on the resultant solder joint con-

figuration. An example of a land pattern is presented in

Figure 12-6 for use with Type A leaded chip carriers (see

IPC-SM-782).

The attachment lands for surface mounting leadless chip

carriers should be the same width as the component termi-

nal maximum plus 1.3 mm whenever possible. The land

length should extend between 3.8 to

1.0

mm beyond the

maximum chip carrier outline on each of all four sides to

create a horizontal solder fillet length equal to the vertical

fillet rise.

IPC-I-

L

Figure 12-6 Land Pattern for Type A Leaded Chip Carrier

Mounting

12.3.3 LeadlLand Configuration After Assembly

Care

must be taken to assure the condition of the chip carrier

terminations is such that solderability is not adversely

impacted. Techniques in storage, handling and placement

must be adequate to preserve good metallurgical and

mechanical properties of the termination up to and through

placement of the device.

12.3.4 Mounted Component Configuration

Quality,

reliable, solder joints, device performance, and the ability

to withstand operating environments are in part dependent

on control of the configuration of the mounted component/

substrate interface.

Assembled chip carriers may be constrained mechanically

or with adhesive prior to soldering, or they may be allowed

to float.

If

adhesives are used, they should not absorb mois-

ture, create a conductive leak path or interfere with solder

joint formation. Standoffs may be used to control solder

joint configuration and/or provide required clearance for

cleaning after solder. It is generally recommended that a

clearance of 0.25 mm minimum be provided between the

chip carrier and the substrate to facilitate adequate

cleaning.

In some solder paste applications, the leadless components

may be allowed to “float”, because surface tension will

serve to pull the chip carrier into correct alignment with

respect to the land pattern. However, this is dependent

upon chip carrier size, positional tolerance, flatness of

leads, etc.

For leaded chip carriers having through-hole clip leads,

adequate tooling should be used to assure the leads mate

with holes in substrate. Preforms can be used on either

side, depending upon structures and orientation during

reflow.

12.4 Mixed Technology

General techniques for mixed

assemblies are discussed in Section 25.

The process sequence for mixed assembly using chip car-

riers will vary depending on what type of other compo-

nents are mounted on both sides of the substrate; and what

specific solder process (or processes) will be used.

Where through-hole mounted components and discrete

chips and chip carriers are all mounted on the same side of

the board the order of assembly must take into account the

solder process to be used. As for class C-1 assemblies, if

solder preforms are utilized with the through-hole mounted

components one of the solder passes can be eliminated (see

Section 22 for more details).

12.5 Manual Assembly

Manual mounting techniques for

surface mount devices can be found in Section 22.

12.6 Automated Assembly

Automated placement tech-

niques applied to high volume, high density mounting of

chip carriers provides benefits in quality and productivity.

Currently several manufacturers provide automatic place-

ment equipment and robotic devices to place chip carriers.

Robotics may offer more flexibility than other placement

equipment while packaging standards are developed; how-

ever, placement systems utilizing vacuum pickup and/or

self centering tweezer grips are in use today and provide

versatility for chip carrier placement.

12.7 Handling and Storage

The handling and storage of

chip carriers should be in accordance with the guidelines of

Section 26.

12.8 Soldering

General soldering characteristics apply-

ing to all types of components and assemblies are

described in Section 27.

3

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COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

January

1996

IPC-CM-770

12.9 Cleaning

General techniques for cleaning applying

to all types of components are described in Section 28.

Because of generally smaller spacing between leads,

smaller clearances between substrate and the component

body, and large area beneath the devices, chip carriers

present a more difficult cleaning situation than through-

hole mounted devices. Clearance under the package should

be adequate to facilitate an effective cleaning operation.

Some surface mounting soldering processes result in

exposing the fluxes to high heat for longer and repeated

periods of time than experienced with through-hole compo-

nent soldering. This can lead to a more stable flux residue

making the cleaning more difficult. There is generally less

flux residue associated with chip carriers, but it is concen-

trated in smaller crevices under and between close spaced

devices.

Techniques using azeotropic solvents, aqueous cleaning

with detergents, as well as combinations of aqueous and

solvent cleaning process have been successfully applied.

12.10 Conformal Coating

General techniques for con-

formal coating for all types of assemblies are described in

Section 29.

13.0 AREA ARRAY COMPONENTS

The advent of very large scale integration (VLSI) and very

high speed integrated circuit (VHSIC) has brought a need

for very high pin count packages with lead symmetry and

methods to reliably assemble them onto circuit boards.

Grid arrays are pinned or leadless carriers with I/O contacts

that populate one surface of the package on a

0.100

inch

(eventually

0.050

inch) grid. The use of a solid grid neces-

sitates placing the die cavity on the side opposite the

Il0

contacts.

A

double or multiple concentric row grid permits

having die cavity and

Il0

contacts on the same side with

an optional heat sink on the opposite side.

13.1 Pin Grid Array Components

13.1.1 Port Types

The pin grid array package is the

package designed for high pin out ICs for through-hole

mounting because of its space efficiency and compatibility

with existing DIP facilities.

The main advantage of the pin-array is to avoid the

Il0

limitations of peripherally terminated packages such as

LCC at the same time providing terminal separations of

100-mil centerlines.

As

such it can be readily installed into

a conventional printed board and also wave soldered.

Offset disadvantages which have to be weighed:

Inspection of solder joints

Impedance limitations

Removal and replacement

A

typical pin grid array is a square, multilayer (usually

ceramic package having terminals on 2.54 x 2.54 mm cen-

ters. These packages are available in either cavity up or

cavity down versions.

A

cavity up configuration mounts the die opposite the pins,

thereby allowing a full grid of pins and the highest I/O

density.

A

cavity down configuration has the die on the same side

as the pins and is generally used with high power circuits

in air cooled applications to allow a heat sink opposite the

die. However, this version is not as space efficient.

Pin grid arrays have good electrical characteristics due to

the short signal paths from I/O pin to die. Pin grid arrays

overcome thermal expansion problems typically encoun-

tered at ceramic/printed board interfaces because the pins

are compliant. Conventional soldering techniques such as

wave soldering can attach these packages to printed boards.

The higher the I/O lead count becomes, the lower the per-

centage of the total package area any given-size die cavity

will occupy, e.g., the 96-lead, 40-mil center chip carrier is

over one-inch square.

For optimum packaging density, this percentage should be

as high as possible. Therefore, 0.635 and

0.5

mm chip car-

riers and grid arrays are used (Figure 13-1).

Figure 13-2 shows the

Il0

density achievable with the vari-

ous packages.

As

can be seen, for lead count require- ments

in excess of

100,

a 0.10-mil centerline solid grid provides

greater I/O density than either

50-

or 40- mil centerline

chip carriers.

IPC-I-

Figure 13-1 149 Pin Array Package

The 25-mil centerline chip carrier is clearly more I/O effi-

cient than is a 0.100-mil grid array. However, a double-

row 50-mil solid grid provides the greatest I/O density.

With pins brazed on 100-mil centers, pin grid arrays are a

logical carrier for high lead counts intended for through-

hole (not surface mount) board assembly compatible with

3-23

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services

IPC-CM-770

Januaty

1996

DIPS. This should extend the useful life of present day

technology for some high lead count applications.

soot-

.OSO'

SOLID

CRlD

I

l

lo'

50

110

id0

II0

300

PACKAQE

LEAD

COUNT

Ipc.I.

L

Figure 13-2

110

Density Versus Lead Count (All

Dimensions in Inches)

13.1.2 Through-Hole Mounting

Through-hole mounting

is the dominant choice in pin grid array package applica-

tions.

Due to the high count of I/O pins the package can be

inserted in the present 100-mil grid through-hole process

and subjected to wave soldering.

Inspection of the solder connections under the package

body can be easily performed on the solder side of the

board and the device can be tested on existing "bed

of

nails" testers.

Inspecting the solder joints on the component side of the

board is extremely difficult without the aid of special tools

such as a fiber optic inspection system or a laser system

where joint temperature profile is indicative of the amount

of solder and integrity of the joint.

For this reason and because of the risks involved with

removal of these packages, sockets have been utilized (see

Figure

13-3).

Low profile grip sockets can also be used.

13.1.2.1 Component Preparation

Pin grid arrays con-

taining rigidized leads do not require lead forming prior to

assembly. They are through-hole mounted with straight

lead attach.

13.1.2.2 Land Patterns

When mounted directly to the

printed board, land patterns will be developed according to

the applicable class of the assembly. However, the lead

hole clearance should be

0.010-0.014

inch to allow for

placement variables and good capillary action of solder

flow.

Figure 13-3 Zero Insertion Force Socket

13.1.2.3 Lead Configuration After Assembly

Due to pin

density of pin grid array packages they can be mounted

with leads extending through the holes. Lead clinching is

not required.

13.1.3 Mixed Technology

The pin grid array being

through-hole mounted can be utilized along with other

through-hole components, DlPs, axial- leaded components,

etc. as part of a mixed assembly.

13.1.4 Manual Assembly

Manual assembly of the pin

grid array package to the printed board can be achieved by

using special tools designed for ease of alignment and

insertion. The operator can use a tweezer- type device to

place and hold a component, or a machine-positioned

vacuum pick-up under the operators control.

13.1.5 Automated Assembly

For high volume pin grid

array package assembly, high accuracy assembly robot

workcells represent a cost effective method of automating

semiautomatic and manual steps. The workcells can be

configured to perform a wide variety of insertion and

assembly tasks. Automated techniques for installing the

PGA to the board presently utilize robotic applications.

13.2 Surface Mount Area Arrays

This section provides

information on the design and assembly considerations for

the use of Surface Mount Grid Array packages. Generally,

they are known as Pad Grid Arrays or as Land Grid Arrays

(LGA). The terminations on the BGA packages are distrib-

uted over the bottom of the package and are solder

assembled to an area array of lands on a printed circuit

board. They are intended to provide high IO packaging of

integrated circuits in a small physical space with good reli-

ability, good assembly quality and low assembly cost.

Some have been registered under the JEDEC JC-11 proce-

dures of the EIA.

3

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Licensed by Information Handling Services

COPYRIGHT Association Connecting Electronics Industries

Licensed by Information Handling Services