IPC-CM-770D-1996 - 第9页
January 1996 IPC-CM-770 Figure 10-5 Figure 10-6 Figure 10-7 Figure 10-8 Figure 10-9 Figure 10-10 Figure 10-11 Figure 11-1 Figure 11-2 Figure 11-3 Figure 11-4 Figure 11-5 Figure 11-6 Figure 11-7 Figure 11-8 Figure 11-9 Fi…
IPC-CM-770
Januaty
1996
Table
of
Contents
.
Section
3
12.4 Mixed Technology
......................................
3-22
Manual Assembly
.......................................
3-22
12.6 Automated Assembly
..................................
3-22
12.7 Handling and Storage
.................................
3-22
12.8 Soldering
.....................................................
3-22
12.9 Cleaning
......................................................
3-23
8.0
MULTIPLE-RADIAL-LEAD COMPONENTS
............
3-1 12.5
8.1 Part Type Description
...................................
3-1
8.3 Surface Mounting
.........................................
3-4
8.4 Mixed Technology
........................................
3-4
8.5 Manual Assembly
.........................................
3-4
8.6 Automated Assembly
....................................
3-4
8.7 Handling and Storage
...................................
3-5
12.10 Conformal Coating
.....................................
3-23
8.8 Soldering
.......................................................
3-5
l3mo
AREA
ARRAY
............................
3-23
8.10 Conformal coating
.......................................
3-5 13.2
.......................
8.9 Cleaning
........................................................
3-5
13.1 Pin Grid Array Components 3-23
Surface Mount Area Arrays 3-24
.......................
9.0
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
SMALL OUTLINE COMPONENTS
..........................
3-5
Part Type Description
...................................
3-5
Through-Hole Mounting
...............................
3-6
Surface Mounting
.........................................
3-6
Mixed Technology
........................................
3-6
Manual Assembly
.........................................
3-6
Automated Assembly
....................................
3-6
Handling and Storage
...................................
3-6
Soldering
.......................................................
3-6
Cleaning
........................................................
3-6
Conformal Coating
.......................................
3-6
10.0
INLINE-LEAD COMPONENTS
..............................
3-6
10.2 Through-Hole Mounting
...............................
3-7
10.3 Surface Mounting
.........................................
3-9
10.4 Mixed Technology
......................................
3-10
10.5
Manual Assembly
.......................................
3-10
10.6 Automated Assembly
..................................
3-10
10.7 Soldering
.....................................................
3-11
10.8 Cleaning
......................................................
3-11
10.9 Conformal Coating
.....................................
3-11
11.0
RIBBON-LEAD COMPONENTS
..........................
3-11
11.1
Part Type Descriptions
................................
3-11
11.2 Through-Hole Mounting
.............................
3-12
11.3 Surface Mounting
.......................................
3-14
11.4 Mixed Technology
......................................
3-16
11.5
Manual Assembly
.......................................
3-16
11.6 Automated Assembly
..................................
3-16
11.7 Handling and Storage
.................................
3-16
11.8 Soldering
.....................................................
3
-
1
6
11.10
Conformal Coating
.....................................
3-16
11.9 Cleaning
......................................................
3-16
14.0
14.1
14.4
14.5
14.6
14.7
14.8
14.9
14.10
UNPACKAGED SEMICONDUCTOR
COMPONENTS
...................................................
3-26
Part Type Description
.................................
3-26
Mixed Technology
......................................
3-30
Manual Assembly
.......................................
3-30
Automated Assembly
..................................
3-30
Handling and Storage
.................................
3-30
Soldering
.....................................................
3-30
Cleaning
......................................................
3-30
Coatings
......................................................
3-31
Figures
Figure 8-1 Multiple-lead Variable Resistor
.................................
3-1
Figure 8-2 “TO” Can Lead Forming
..........................................
3-1
Figure 8-3 Dimple Preformed Leads
...........................................
3-1
Figure 8-4
Typical
TO-100
Can Layout (Inches Only)
..............
3-2
Figure 8-5 Typical Mounting Pattern for 10-lead Cans With
Clinched Leads
..........................................................
3-2
Figure 8-6 Typical Mounting Pattern for 12-lead Cans with
Clinched Leads Mounting
.........................................
3-2
Figure 8-7 Straight-through Lead. Unclinched Can
...................
3-3
Figure 8-8
Figure 8-9
Figure 8-10
Figure 8-11
Figure 8-12
Figure 8-13
Figure 8-14
Figure 8-15
Figure 8-16
Figure 9-1
Figure 9-2
Offset Lead Can Mounting
........................................
3-3
Transistor Mounting (Unsupported Holes)
...............
3-3
Transistor Mounting (with Spacer)
...........................
3-3
Can Mounting Spreader
.............................................
3-3
Horizontal “TO” Mounting
......................................
3-4
Transistor Can Horizontal Mounting
........................
3-4
Mechanically Secured Transistor
..............................
3-4
Transistor Assembly Tools
........................................
3-5
Taping Specifications (Only Inches Shown)
.............
3-5
SO-16 Package Drawings Typical
Dimension
..................................................................
3-6
Typical SOT Packages
...............................................
3-7
12.0
CHIP CARRIERS
..................................................
3-16
Figure 10-1
16-Lead DIP
...............................................................
3-8
12.1 Part Type Descriptions
...............................
3-17
Figure 10-2
Single In-line Component
.........................................
3-8
12.2 Through-Hole Mounting
.............................
3-20
Figure 10-3
A Typical Dual In-line Layout
..................................
3-8
12.3 Surface Mounting
.......................................
3-20
Figure 10-4
Lead Configuration (After Assembly)
.......................
3-8
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COPYRIGHT Association Connecting Electronics Industries
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January
1996
IPC-CM-770
Figure 10-5
Figure 10-6
Figure 10-7
Figure 10-8
Figure 10-9
Figure 10-10
Figure 10-11
Figure 11-1
Figure 11-2
Figure 11-3
Figure 11-4
Figure 11-5
Figure 11-6
Figure 11-7
Figure 11-8
Figure 11-9
Figure 11-10
Figure 11-1 1
Figure 11-12
Figure 11-13
Figure 11-14
Figure 11-15
Figure 12-1
Figure 12-2
Figure 12-3
Figure 12-4
Figure 12-5
Figure 12-6
Figure 13-1
Figure 13-2
Figure 13-3
Figure 13-4
Figure 14-1
Figure 14-2
Figure 14-3
Figure 14-4
Resilient Spacer to Heat Sink Frame
........................
3-9
Modifying DIP for Surface Mounting
......................
3-9
Gull-Wing Lead for SIP-type Component
................
3-9
Dual-in-line Package Gripping Tools
......................
3-10
DIP Clearances
.........................................................
3-10
DIP Layout in Rows and Columns
.........................
3-11
DIP Slide Magazines
...............................................
3-11
Flatpack Outline Drawing
.......................................
3-12
Quad Pack Configuration
........................................
3-12
Typical Ribbon Leaded Discrete Device
Outline Drawing
......................................................
3-13
Staggered Hole Pattern Mounting
.
“MO” Flatpack
Outline Drawing (Only Inches Shown)
..................
3-13
Through-hole Mounting
.
“MO” Flatpack
Outline Drawing
......................................................
3-13
Through-the-board board Mounting with
Unclinched Leads
....................................................
3-13
Through-the-board Mounting with Clinched
Leads and Circumscribing Land
.............................
3-14
Through-the-board Mounting with Offset Land
.....
3-14
Lead Bending Requirements for Surface
Mounting
..................................................................
3-14
Surface-mounted Flatpacks
.....................................
3-15
Typical Surface Land Flatpack Mounting
..............
3-15
Minimum Planar Lead Contact
...............................
3-15
Axial Alignment
.......................................................
3-15
Lead Extension
........................................................
3-16
Welded Configurations
............................................
3-16
The 50-mil Center JEDEC Packages
......................
3-18
Features Common to the 50-mil Center
Packages
...................................................................
3-18
Type A (Leaded Type B)
.........................................
3-19
Criteria for Lead Attachment to Leadless
Double Row Plastic Chip Carrier
...........................
3-21
Criteria for Lead Attachment to Leadless
Type A (Leaded Type B)
.........................................
3-21
Land Pattern for Type A Leaded Chip Carrier
Mounting
..................................................................
3-22
149 Pin Array Package
............................................
3-23
I/O
Density Versus Lead Count (All Dimensions
in Inches)
.................................................................
3-24
Zero Insertion Force Socket
....................................
3-24
Ball Grid Array Package Outline
............................
3-27
Packaging and Assembling Integrated Circuits
......
3-28
Face-down Bonding Concepts
.................................
3-28
Beam-lead Transistor
...............................................
3-29
Wire Bonding Layout Features
..............................
3-30
Tables
Table 12-1 Chip Carrier Application Considerations
...................
3-17
Table 12-2 JEDEC Ceramic Sizes and Fine Pitch
Terminal Counts
.........................................................
3-19
Table 12-3 JEDEC Designations
..................................................
3-20
Table 13-1 Variations in BGA Package Sizes
..............................
3-25
Table 13-2 BGA Solder Sphere Dimensions and Package
Coplanarity
..................................................................
3-26
Table 14-1 Various Chip Bonding Adhesive Types
.....................
3-29
Table 14-2 Wire Bonding Feature Limits (see Figure 14-4)
.......
3-29
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COPYRIGHT Association Connecting Electronics Industries
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IPC-CM-770
Januaty
1996
15.0
15.1
15.2
15.3
15.4
15.5
15.6
15.7
Table
of
Contents
.
Section
4
CONNECTORS
.......................................................
4-1
19.0
Performance Considerations
.........................
4-
1
Selection Considerations 4-
1
Part Type Descriptions 4-2
Through-Hole Mount Connectors 4-3
Surface Mounting
.........................................
4-4
Mixed Technology 4-5
Manual Assembly
.........................................
4-5
19.1
19.2
19.3
..............................
.................................
................
19.4
........................................
15.8 Automated Assembly
....................................
4-5
15.9 Handling and Storage
...................................
4-5
15.10
Soldering
.......................................................
4-6
15.11
Cleaning
........................................................
4-6
15.12 Coating
..........................................................
4-6
16.0
DISCRETE COMPONENT SOCKETS
...................
4-6
16.1 Part Type Description
...................................
4-6
16.2 Through-Hole Mounting
.............................
4-1
1
16.3 Surface Mounting
.......................................
4-13
16.4 Mixed Technology
......................................
4-14
16.5 Manual Assembly
.......................................
4-15
16.6 Automated Assembly
..................................
4-15
16.7 Handling and Storage
.................................
4-15
16.8 Soldering
.....................................................
4-15
16.9 Cleaning
......................................................
4-15
16.10 Coating
........................................................
4-15
17.0
INTERCONNECT COMPONENTS
.......................
4-15
17.1 Part Type Description
.................................
4-15
17.2 Through-Hole Mounting
.............................
4-20
17.3 Surface Mounting
.......................................
4-24
17.4 Mixed Technology
......................................
4-25
17.5 Manual Assembly
.......................................
4-25
17.6 Automated Assembly
..................................
4-25
17.7 Handling and Storage
.................................
4-25
17.8 Soldering
.....................................................
4-25
17.9 Cleaning
......................................................
4-25
17.10 Conformal Coating
.....................................
4-25
18.0
MECHANICAL COMPONENTS
...........................
4-26
18.1 Part Type Description
.................................
4-26
18.2 Through-Hole Mounting
.............................
4-28
18.3 Surface Mounting
.......................................
4-28
18.4 Mixed Technology
......................................
4-28
18.5 Manual Assembly
.......................................
4-28
18.6 Automated Assembly
..................................
4-28
18.7 Handling and Storage
.................................
4-29
18.8 Soldering
.....................................................
4-29
18.10 Conformal Coating
.....................................
4-29
18.9 Cleaning
......................................................
4-29
PACKAGING AND INTERCONNECTING
STRUCTURES
......................................................
4-29
Printed Boards
............................................
4-29
Surface Mounting
.......................................
4-30
Supporting-Plane Printed Board
Structures
....................................................
4-30
Constraining Core Printed Board
Structures
....................................................
4-32
Figure 15-1
Figure 15-2
Figure 15-3
Figure 15-4
Figure 15-5
Figure 15-6
Figure 15-7
Figure 15-8
Figure 15-9
Figure 15-10
Figure 15-11
Figure 15-12
Figure 15-13
Figure 16-1
Figure 16-2
Figures
Typical Polarization
...................................................
4-2
Connector with Keying and Polarization
..................
4-2
Card Edge Connector to Ribbon Cable
....................
4-2
Card Edge Connector for Discrete Wiring
...............
4-2
Card Guide Connector
...............................................
4-3
Two-piece Connector System
....................................
4-3
Header Connectors
.....................................................
4-3
Female Receptacles
...................................................
4-4
Connector with Press Fit Contacts
............................
4-4
Surface Mount Connector
.........................................
4-5
D-subminiature Surface Mount Connector
...............
4-6
Surface Mount Receptacle
.........................................
4-7
Box-contact Surface Mount Receptacle
....................
4-7
Low Profile Pluggable Devices
.................................
4-8
Low Profile Devices
..................................................
4-8
Figure 16-3 Closed Bottom Socket
...............................................
4-8
Figure 16-4 Low Profile Grip Type Device
..................................
4-8
Figure 16-5
Use of Low Profile Grip Devices
.............................
4-8
Figure 16-6 Styles of Low-Profile Grip Devives
..........................
4-9
Figure 16-7
Contact Configurations
..............................................
4-9
Figure 16-9 Surface Mount Chip Carrier Socket
........................
4-10
Figure 16-10 Pin Grid Array Sockets
............................................
4-11
Figure 16-11 Leadless Grid Array Socket
....................................
4-12
Figure 16-12 Section Through Socket Solder Contact
.................
4-12
Figure 16-13 Screw Down Cover
.................................................
4-13
Figure 16-15 Section Through Pressure Mounted Socket
............
4-14
Figure 16-8 DIP Socket
...............................................................
4-10
Figure 16-14 High Speed Circuit Socket
......................................
4-13
Figure 16-16 Example of 68
I/O
Land Pattern on Printed
Board Structure
........................................................
4-14
Figure 17-1 Typical Turret Terminals
.........................................
4-16
Figure 17-3
Typical Pin Terminals
..............................................
4-17
Figure 17-4 Typical Solder Cup Terminal
..................................
4-17
Figure 17-5 Typical Crimp Terminal
...........................................
4-17
Figure 17-2 Typical Bifurcated Terminals
..................................
4-16
Figure 17-6
Expendable Carrier Strip
.........................................
4-18
Figure 17-7
Stamped Pins
...........................................................
4-18
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