ProductBrochure_EN - 第8页
Nexus Void free soldering with vacuum Perfect for different applications Reliable vacuum processes for improved quality The vacuum soldering process generates temperatu - res of up to 450 °C and is an ideal solution for …
CondensoX
Condensation Soldering
In reflow condensation soldering or vapour-phase soldering, soldering is ac-
complished with the aid of a hot vapour. Heat transfer in condensation solder-
ing is up to ten times higher than with convection soldering. This is particularly
suitable for processing large or high-mass boards in a stable process atmos-
phere. The inert heat transfer medium used is perfluorpolyether (Galden
®
).
Our CondensoX series can solder even the most difcult assemblies quickly
and dependably, at temperatures up to 240 °C. In order to improve control of
the condensation phase, Rehm has developed a patented injection process
that allows the soldering procedure to be individually regulated. An optional
vacuum module ensures void-free soldered joints – directly after the sol-
dering process or as a pre-vacuum. Our systems let you adjust parameters,
such as temperature or pressure (vacuum), flexibly according to production
requirements.
CondensoX Condensation Soldering
Smartline
Inline
Inline loading/
unloading
air operation
X-Line
Inline
Inline loading/
unloading
nitrogen operation
XC
Manual
Front loading
XS Smart
Manual
Loading from
the side and front
XM Smart
Manual / Autom.
Loading from
the side
CondensoX-Serie
Nexus
Void free soldering with vacuum
Perfect for different applications
Reliable vacuum processes for improved quality
The vacuum soldering process generates temperatu-
res of up to 450 °C and is an ideal solution for void-free
and flux-free applications. The Nexus not only provi-
des your manufacturing operation with advantages for
the soldering process, but rather for bonding proces-
ses as well.
Without vacuum With vacuum
Up to
450 °C
TECHNOLOGY BENEFITS
› Oxide and void-free joint surface between chip and interconnected device
› Integrated or separate oxidation and deoxidation processes
› Simple proling and fast heating and cooling rates
› Assembly under high level of vacuum
› Integration of drying and degassing processes
› Optimum dispersal of waste heat
Nexus
Contact Soldering
The Nexus system guarantees high-quality results with a reflow process using
contact heat in a vacuum. It thus meets the highest requirements of power
electronics, in the advanced packaging and semi-conductor area.
The Nexus contact soldering system is best suited for void-free soldering of
different devices (e.g. IGBT) on DCB substrates. The combining of materials
that are normally highly dissimilar takes place in the vacuum at a reduced
pressure at temperatures up to 450 °C. The reduced pressure thereby helps to
minimise oxidation on the components and on the solder itself. The transfer of
heat is via heat contact surfaces or optional by radiation. The Nexus system is
predominantly used in small and medium production lines as well as in the eld
of laboratory.
Nexus Contact Soldering