ProductBrochure_EN - 第9页

TECHNOLOGY BENEFIT S › Oxide and v oid-free joint sur face between chip and interconnected device › Integrated or separate o xidation and deoxidation processes › Simple proling and fast heating and cooling rates › Assem…

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Nexus
Void free soldering with vacuum
Perfect for different applications
Reliable vacuum processes for improved quality
The vacuum soldering process generates temperatu-
res of up to 450 °C and is an ideal solution for void-free
and flux-free applications. The Nexus not only provi-
des your manufacturing operation with advantages for
the soldering process, but rather for bonding proces-
ses as well.
Without vacuum With vacuum
Up to
450 °C