IPC 7711A - 第118页
NOTES IPC-771 1A Number: 3.8.1 Revision: Date: 2/98 Subject: J-Lead Removal (four sided) P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No repro…
EQUIPMENT REQUIRED
Soldering system
Tweezer handpiece
Removal tips
Board surface tip
Soldering handpiece
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install removal tips into tweezer handpiece.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Using soldering handpiece, melt solder to form a solder bridge fill joining all
component leads. (See Figure 1.)
5. Remove old solder from tips and thermal shock tips with damp sponge.
6. Tin inside edges of tips with solder. (See Figure 2.)
7. Lower tips over component and squeeze handpiece. (See Figures3&4.)
8. Contact ALL leads with tips, confirm solder melt of ALL joints and lift compo-
nent from PWB. (See Figures4&5.)
9. Release component onto a heat resistant surface.
10. Re-tin tips with solder.
11. Prepare lands for component replacement.
Figure 1 Bridge
Figure 2 Tin Tips
Figure 3 Position Tips
Figure 4 Melt Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Removal (four sided)
Bridge Fill Method - Tweezer
Number: 3.8.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.8.1
Revision:
Date: 2/98
Subject: J-Lead Removal (four sided)
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
Fixed head PLCC removal tip
Broad surface tip
MATERIALS
Solder wire
Flux
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides, or residues.
2. Install tip.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Using broad surface tip, melt solder around the outside of the leads, creating an
even, solid bridge across the entire row. (See Figure 1.)
5. Install and clean the inside edges of the PLCC removal tip.
6. Tin the tip evenly around the inside edge, ensuring that there is good wetting all
the way around. (See Figure 2.)
7. Apply flux to all the leads. (See Figure 3.)
8. Bring the tip straight down on the component, contacting all the leads evenly.
(See Figure 4.)
9. Wait for full reflow, displace the leads from the pads to break surface tension,
and lift straight up. (See Figure 5.)
10. Immediately remove the component from the tip.
11. Prepare the lands for component replacement.
Figure 1 Melt Solder
Figure 2 Tin Tip
Figure 3 Apply Flux
Figure 4 Melt Solder
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Removal
Bridge Fill Method – Surface Tension
Number: 3.8.1.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---