IPC 7711A - 第12页
5 Installation 5.1 Through-Hole Installation Procedure Description Install following the requirements of J-STD-001 and J-HDBK-001 5.2 PGA and Connector Installation Procedure Description Product Class Skill Level Level o…
3.8 J-Lead Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.8.1 Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.8.1.1 Bridge Fill Method - Surface Tension R,F,W,C Advanced High
3.8.2 Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.8.2.1 Solder Wrap Method - Surface Tension R,F,W,C Advanced High
3.8.3 Flux Application Method - Tweezer R,F,W,C Advanced High
3.8.4 Flux & Tin Tip Only R,F,W,C Advanced High
3.8.5 Hot Gas Reflow System R,F,W,C Advanced High
3.9 BGA/CSP Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.9.1 BGA/CSP Removal R,F,W,C Advanced High
3.9.2 Vacuum Method R,F,W,C Advanced Medium
3.10 PLCC Socket Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.10.1 Bridge Fill Method R,F,W,C Advanced High
3.10.2 Solder Wrap Method R,F,W,C Advanced High
3.10.3 Flux Application Method R,F,W,C Advanced High
3.10.4 Hot Air Pencil Method R,F,W,C Advanced Medium
4 Pad/Land Preparation
Procedure Description Product Class Skill Level
Level of
Conformance
4.1.1 Surface Mount Land Preparation - Individual Method R,F,W,C Intermediate High
4.1.2 Surface Mount Land Preparation - Continuous Method R,F,W,C Intermediate High
4.1.3SurfaceSolderRemoval-BraidMethodR,F,W,CIntermediate High
4.2.1 Pad Releveling R,F,W,C Intermediate Medium
4.3.1 SMT Land Tinning R,F,W,C Intermediate Medium
4.4.1CleaningSMTLandsR,F,W,CIntermediateHigh
IPC-7711A/7721A October 2003
x
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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5 Installation
5.1 Through-Hole Installation
Procedure Description
Install following the requirements of J-STD-001 and
J-HDBK-001
5.2 PGA and Connector Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.2.1 Solder Fountain Method with PTH Prefilled R,F,W,C Expert Medium
5.3 Chip Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.3.1 Solder Paste Method R,F,W,C Intermediate High
5.3.2 Point to Point Method R,F,W,C Intermediate High
5.4 Leadless Component Installation (To Be Developed)
5.5 Gull Wing Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.5.1A Multi-Lead Method - Top of Lead R,F,W,C Advanced High
5.5.2 Multi-Lead Method - Toe Tip R,F,W,C Advanced High
5.5.3 Point-to-Point Method R,F,W,C Intermediate High
5.5.4 Hot Air Pencil/Solder Paste Method R,F,W,C Advanced High
5.5.5 Hook Tip w/Wire Layover (To be developed) R,F,W,C Intermediate High
5.5.6 Blade Tip with Wire R,F,W,C Advanced High
5.6 J-Lead Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.6.1 Wire Solder Method R,F,W,C Advanced High
5.6.2 Point-to-Point Method R,F,W,C Intermediate High
5.6.3 Solder Paste Method/Hot Air Pencil R,F,W,C Advanced High
5.6.4 Multi-Lead Method R,F,W,C Intermediate High
October 2003 IPC-7711A/7721A
xi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
5.7 BGA/CSP Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.7.1 Using Wire Solder to Prefill Lands R,F,W,C Advanced High
5.7.2 Using Solder Paste to Prefill Lands R,F,W,C Advanced High
5.7.3 BGA Reballing Procedure R,C Advanced High
6 Removing Shorts
Procedure Description Product Class Skill Level
Level of
Conformance
6.1.1 J-Leads - Draw Off Method R,F,W,C Intermediate High
6.1.2 J-Leads - Respread Method R,F,W,C Intermediate High
6.1.3 Gull-Wing - Draw Off Method R,F,W,C Intermediate High
6.1.4 Gull-Wing - Respread Method R,F,W,C Intermediate High
8 Wires
8.1 Splicing
Procedure Description Product Class Skill Level
Level of
Conformance
8.1.1 Mesh Splice N/A Intermediate Low
8.1.2 Wrap Splice N/A Intermediate Low
8.1.3 Hook Splice N/A Intermediate Low
8.1.4 Lap Splice N/A Intermediate Low
IPC-7711A/7721A October 2003
xii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---