IPC 7711A - 第13页

5.7 BGA/CSP Installation Procedure Description Product Class Skill Level Level of Conformance 5.7.1 Using Wire Solder to Prefill Lands R,F ,W,C Advanced High 5.7.2 Using Solder Paste to Prefill Lands R,F ,W,C Advanced High…

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5 Installation
5.1 Through-Hole Installation
Procedure Description
Install following the requirements of J-STD-001 and
J-HDBK-001
5.2 PGA and Connector Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.2.1 Solder Fountain Method with PTH Prefilled R,F,W,C Expert Medium
5.3 Chip Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.3.1 Solder Paste Method R,F,W,C Intermediate High
5.3.2 Point to Point Method R,F,W,C Intermediate High
5.4 Leadless Component Installation (To Be Developed)
5.5 Gull Wing Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.5.1A Multi-Lead Method - Top of Lead R,F,W,C Advanced High
5.5.2 Multi-Lead Method - Toe Tip R,F,W,C Advanced High
5.5.3 Point-to-Point Method R,F,W,C Intermediate High
5.5.4 Hot Air Pencil/Solder Paste Method R,F,W,C Advanced High
5.5.5 Hook Tip w/Wire Layover (To be developed) R,F,W,C Intermediate High
5.5.6 Blade Tip with Wire R,F,W,C Advanced High
5.6 J-Lead Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.6.1 Wire Solder Method R,F,W,C Advanced High
5.6.2 Point-to-Point Method R,F,W,C Intermediate High
5.6.3 Solder Paste Method/Hot Air Pencil R,F,W,C Advanced High
5.6.4 Multi-Lead Method R,F,W,C Intermediate High
October 2003 IPC-7711A/7721A
xi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
5.7 BGA/CSP Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.7.1 Using Wire Solder to Prefill Lands R,F,W,C Advanced High
5.7.2 Using Solder Paste to Prefill Lands R,F,W,C Advanced High
5.7.3 BGA Reballing Procedure R,C Advanced High
6 Removing Shorts
Procedure Description Product Class Skill Level
Level of
Conformance
6.1.1 J-Leads - Draw Off Method R,F,W,C Intermediate High
6.1.2 J-Leads - Respread Method R,F,W,C Intermediate High
6.1.3 Gull-Wing - Draw Off Method R,F,W,C Intermediate High
6.1.4 Gull-Wing - Respread Method R,F,W,C Intermediate High
8 Wires
8.1 Splicing
Procedure Description Product Class Skill Level
Level of
Conformance
8.1.1 Mesh Splice N/A Intermediate Low
8.1.2 Wrap Splice N/A Intermediate Low
8.1.3 Hook Splice N/A Intermediate Low
8.1.4 Lap Splice N/A Intermediate Low
IPC-7711A/7721A October 2003
xii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Table of Contents
PART 3 Repair and Modification of Printed Boards and Electronic Assemblies
Legends/Markings
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.7.1 Legend/Marking, Stamping
Method
R, F, W, C Intermediate High
2.7.2 Legend/Marking, Hand Lettering
Method
R, F, W, C Intermediate High
2.7.3 Legend/Marking, Stencil Method
R, F, W, C Intermediate High
Blisters and Delamination
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.1 Delamination/Blister Repair,
Injection Method
R Advanced High
Bow & Twist
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.2 Bow and Twist Repair R, W Advanced Medium
Hole Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.3.1 Hole Repair, Epoxy Method R, W Advanced High
3.3.2 Hole Repair,Transplant Method
R. W Expert High
October 2003 IPC-7711A/7721A
xiii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---