IPC 7711A - 第132页
4. Perform alignment of gas nozzle to component location. 5. Bring gas focusing nozzle into re-flow position. 6. Perform TTP re-flow cycle defined by procedural analysis. 7. Clean PWA as appropriate to customer requireme…
EQUIPMENT REQUIRED
Hot air or hot gas re-flow system (representative examples shown by Figures 1-4)
Gas focusing nozzle (sized to BGA dimensions)
Gas supply (if other than ambient atmosphere)
Preheat method (oven, hotplate, high intensity lamp)
OPTIONAL EQUIPMENT
Bake-out (vacuum, convection) oven
Inert gas supply, if used
MATERIALS
Flux-cored solder
Flux
Cleaner
PROCEDURE SUMMARY
The procedure outlined below is generic in nature and identifies the procedural steps
which need be accomplished to effect BGA or CSP removal. Each step must be tai-
lored to accommodate the attributes and characteristics of the specific system being
used (system manufacturers will customarily provide generalized operating proce-
dures which must be further refined to achieve optimum results).
PROCEDURAL PRECONDITIONS
The following preconditions shall be accomplished prior to performing the procedure:
1) Develop a time/temperature profile (TTP) for the specific BGA and PWA. (See
1.9, Process Goals and Guidelines.)
NOTE: If plastic body components are used, see IPC J-STD-020 (Moisture/Reflow
Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices) for
information on moisture sensitivity classification tests, preconditioning, and attach-
ment.
2) Bake the PWA to remove entrained moisture which may, if not removed, pre-
cipitate measling or delamination.
PROCEDURE STEPS
NOTE: Some systems do not include integrated preheating capability and it may
be necessary to preheat the PWA and BGA separately.
1. Place the PWA in the system work piece holder.
2. Inject flux under the BGA.
3. Set hot gas re-flow system to achieve the TTP defined by procedural analysis.
Figure 1 Align Nozzle
Figure 2 Lower Nozzle
Figure 3 Nozzle to BGA
Figure 4 Raise Nozzle and BGA
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
BGA/CSP Removal
Number: 3.9.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
4. Perform alignment of gas nozzle to component location.
5. Bring gas focusing nozzle into re-flow position.
6. Perform TTP re-flow cycle defined by procedural analysis.
7. Clean PWA as appropriate to customer requirements.
IPC-7711A
Number: 3.9.1
Revision:
Date: 2/98
Subject: BGA/CSP Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Heater handpiece with vacuum cup
BGA removal tip
MATERIALS
Cleaner
Flux
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install BGA removal tip and vacuum cup into dual handpiece. (See Figures1&2.)
3. Start with tip temperature of approximately 371°C and change as necessary.
4. Lower tip over component. (See Figure 3.)
NOTE: Injection of liquid flux under component may reduce cycle time.
5. Confirm solder melt of ALL joints. (See Figure 4.)
6. Actuate vacuum and lift component from PWB. (See Figure 5.)
7. Release component onto a heat resistant surface.
8. Prepare lands for component replacement.
Figure 1 Install Tip
Figure 2 Install Vacuum Cup
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
BGA Removal
Vacuum Method
Number: 3.9.2
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---