IPC 7711A - 第138页

NOTES IPC-771 1A Number: 3.10.2 Revision: Date: 2/98 Subject: PLCC Socket Removal P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction…

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EQUIPMENT REQUIRED
Soldering system
Soldering handpieces
Removal tip
Chisel tip
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Cut tabs holding plastic center piece to PLCC socket and remove.
3. Install chisel tip into soldering handpiece.
4. Start with tip temperature of approximately 315°C and change as necessary.
5. Tack solder to an inside corner lead using soldering handpiece with chisel tip
installed. Wrap solder around leads inside component. Terminate solder at last
lead using soldering handpiece. (See Figure 1.)
6. Replace chisel tip in soldering handpiece with removal tip.
7. Remove old solder from tip and thermal shock tip with damp sponge.
8. Tin outside and bottom edges of tip with solder. (See Figure 2.)
9. Fully insert tip into component contacting ALL leads with tip. (See Figures 3
& 4.)
10. Confirm solder melt of ALL joints and lift component from PWB. (See Figures 4
& 5.)
11. Release component from tip by wiping on a heat resistant surface.
12. Re-tin tip with solder.
13. Prepare lands for component replacement.
Figure 1 Tack and Wrap
Figure 2 Tin Tip
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Components
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
PLCC Socket Removal
Solder Wrap Method
Number: 3.10.2
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.10.2
Revision:
Date: 2/98
Subject: PLCC Socket Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Removal tip
Soldering handpiece
MATERIALS
Flux
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Cut tabs holding plastic center piece to PLCC socket and remove.
3. Apply flux to inside lead/land areas. (See Figure 1.)
4. Start with tip temperature of approximately 315°C and change as necessary.
5. Install removal tip into soldering handpiece.
6. Remove old solder from tip and thermal shock tip with damp sponge.
7. Tin outside and bottom edges of tip with solder. (See Figure 2.)
8. Fully insert tip into component contacting ALL leads with tip. (See Figures 3
& 4.)
9. Confirm solder melt of ALL joints and lift component from PWB. (See Figures 4
& 5.)
10. Release component from tip by wiping on a heat resistant surface.
11. Re-tin tip with solder.
12. Prepare lands for component replacement.
Figure 1 Apply Flux
Figure 2 Tin Top
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
PLCC Socket Removal
Flux Application Method
Number: 3.10.3
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---