IPC 7711A - 第147页
EQUIPMENT REQUIRED Soldering system Soldering handpiece Chisel tip Damp sponge MATERIALS Wicking braid Flux Cleaner PROCEDURE Caution: The wicking method is not recommended for the removal of solder joints in plated-thro…
NOTES
IPC-7711A
Number: 4.1.2
Revision:
Date: 2/98
Subject: Surface Mount Land Preparation
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Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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EQUIPMENT REQUIRED
Soldering system
Soldering handpiece
Chisel tip
Damp sponge
MATERIALS
Wicking braid
Flux
Cleaner
PROCEDURE
Caution:
The wicking method is not recommended for the removal of solder joints
in plated-through holes.
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install chisel tip into soldering handpiece.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Apply flux to lead/land areas. (See Figure 1.)
5. Remove old solder from tip and thermal shock tip with damp sponge. (See Fig-
ure 2.)
6. Place prefluxed braid on the solder to be removed. Place iron tip on the braid.
Ensure the braid contacts only the solder and the tip contacts only the braid to
prevent damage. (See Figure 3.)
7. When the observable solder flow due to solder wicking action has ceased,
remove both the soldering iron and solder braid from the solder being removed
and allow the area to cool to room temperature. (See Figures4&5.)
8. Repeat steps4-7forallremaining lead/land areas.
9. Re-tin tip with solder and return handpiece to stand.
10. Prepare lands for component replacement.
Figure 1 Apply Flux
Figure 2 Clean Tip
Figure 3 Place Braid & Iron on Land
Figure 4 Solder Flows on Braid
Figure 5 Lift Both Iron & Braid
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Surface Solder Removal
Braid Method
Number: 4.1.3
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 4.1.3
Revision:
Date: 2/98
Subject: Surface Solder Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---