IPC 7711A - 第150页
NOTES IPC-771 1A Number: 4.2.1 Revision: Date: 2/98 Subject: Pad Releveling P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction or ne…
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
Dual or single shaft blade tip
MATERIALS
Flux
PROCEDURE
This technique can be used in cases where components have been removed in such
a manner that sufficient solder to tin the lands is left on the lands after removal of the
component. This is almost always the case when hot air or wire wrap methods are
used in the removal.
1. Choose a blade tip with a width that matches or slightly overhangs a single row
of lands. (See Figure 1.)
2. Install tip.
3. Start with the coolest tip temperature possible (approximately 280°C) and change
as necessary.
4. Tin and wipe the blade on a clean sponge to ensure that the surface is clean and
fully wettable.
5. Apply flux to the row of lands.
6. Place the beveled edge lightly across the center of the row of lands. (See Figure
2.)
7. When the solder reflows across all the lands they will become uniform and shiny.
8. Draw the tip evenly off the lands as soon as possible after all the lands become
shiny and uniform in appearance.* (See Figure 3.)
*
Note:
This technique reuses solder that is in indeterminate condition.
Figure 1 Blade Fits Lands
Figure 2 Use Beveled Edge
Bevel
Figure 3 Draw Tip Off Evenly
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Pad Releveling
Using Blade Tip
Number: 4.2.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 4.2.1
Revision:
Date: 2/98
Subject: Pad Releveling
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
Dual or single shaft blade tip
MATERIALS
Flux-cored solder
Flux
PROCEDURE
1. Choose a blade tip with a width that matches or slightly overhangs a single row
of pads. (See Figure 1.)
2. Install tip.
3. Start with the coolest tip temperature possible (approximately 280°C) and change
as necessary.
4. Tin and wipe the blade on a clean sponge to ensure that the surface is clean and
fully wettable.
5. Apply flux to the row of lands.
6. Place an even bead of solder along the full length of the beveled edge. (See Fig-
ure 2.)
7. Place the beveled edge lightly across the center line of the row of lands. (See Fig-
ure 3.)
8. When the solder reflows across all the lands they will become uniform and shiny.
9. Gently draw the tip off the lands as soon as the lands are tinned. (See Figure 4.)
Figure 1 Blade Fits Lands
Figure 2 Tin Tip
Figure 3 Place Beveled Edge Across
Figure 4 Draw Tip Off Lands
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
SMT Land Tinning
Using Blade Tip
Number: 4.3.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---