IPC 7711A - 第152页
NOTES IPC-771 1A Number: 4.3.1 Revision: Date: 2/98 Subject: SMT Land Tinning P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction or …
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
Dual or single shaft blade tip
MATERIALS
Flux-cored solder
Flux
PROCEDURE
1. Choose a blade tip with a width that matches or slightly overhangs a single row
of pads. (See Figure 1.)
2. Install tip.
3. Start with the coolest tip temperature possible (approximately 280°C) and change
as necessary.
4. Tin and wipe the blade on a clean sponge to ensure that the surface is clean and
fully wettable.
5. Apply flux to the row of lands.
6. Place an even bead of solder along the full length of the beveled edge. (See Fig-
ure 2.)
7. Place the beveled edge lightly across the center line of the row of lands. (See Fig-
ure 3.)
8. When the solder reflows across all the lands they will become uniform and shiny.
9. Gently draw the tip off the lands as soon as the lands are tinned. (See Figure 4.)
Figure 1 Blade Fits Lands
Figure 2 Tin Tip
Figure 3 Place Beveled Edge Across
Figure 4 Draw Tip Off Lands
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
SMT Land Tinning
Using Blade Tip
Number: 4.3.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 4.3.1
Revision:
Date: 2/98
Subject: SMT Land Tinning
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering Systems(s)
1 or 2 Soldering handpieces
Single or dual shaft blade tip
MATERIALS
Solder braid
Flux
Cleaner
PROCEDURE
This technique uses a blade tip with solder braid to draw old solder off the lands. The
blade tip used should be as long or a little longer than the row of lands. The braid
should also be sized to the lands, so that the braid width equals or is slightly less
than the land length.
CAUTION
Oversized braids are not to be used. Undersized braids may be drawn across the
surface of the land, but only with the grain of the land. Never draw solder off by
dragging the braid down a row of lands. The heat combined with the abrasive action
will lift the lands.
1. Choose the size of blade tip that best fits a single row of lands. (See Figure 1.)
2. Install tip.
3. Start with tip temperature of approximately 371°C and change as necessary.
4. Apply flux to the lands. (See Figure 2.)
5. Lay the trimmed end of the braid along the row of lands to be cleaned. (See Fig-
ure 3.)
6. Bring the beveled edge of the blade down on the centerline of the braid. Do not
move the braid across the lands in any direction. (See Figure 4.)
7. Remove braid and tip together, immediately after reflow.
8. Clean the flux residue from the lands.
Figure 1 Choose Tip
Figure 2 Apply Flux
Figure 3
Figure 4
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Cleaning SMT Lands
Using Blade Tip and Solder Braid
Number: 4.4.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---