IPC 7711A - 第157页
EQUIPMENT REQUIRED Hot air pencil Hot air tip Solder paste dispenser Tweezers MATERIALS Solder paste Cleaner Solder paste dispense needles Tissue/wipe PROCEDURE NOTE: Preheating is recommended for sensitive components. (…
9. At the end of the timer cycle, wait at least 5 seconds for the solder to solidify,
then remove the board.
10. Clean the flux residue, if required, and inspect.
NOTES
IPC-7711A
Number: 5.2.1
Revision:
Date: 2/98
Subject: PGA and Connector Installation
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Hot air pencil
Hot air tip
Solder paste dispenser
Tweezers
MATERIALS
Solder paste
Cleaner
Solder paste dispense needles
Tissue/wipe
PROCEDURE
NOTE:
Preheating is recommended for sensitive components. (i.e., chip capaci-
tors.)
1. Install tip into hot air pencil.
2. Start with tip temperature of approximately 315°C and change as necessary.
3. Adjust pressure output so hot air scorches a tissue from approximately 0.5 cm
away. (See Figure 3.)
4. Apply a small bead of solder paste to each land using a dispenser. (See Figure
1.)
5. Position component onto lands using tweezers. (See Figure 2.)
6. Direct hot air over component with tip at a distance of 2.5 cm to pre-dry solder
paste. (See Figure 4.)
7. When pre-drying is observed (paste has dull, flat appearance), move tip closer
(0.5 cm) and heat until complete solder melt is observed. (See Figure 5.)
8. Return hot air pencil to its stand.
9. Clean, if required, and inspect.
Figure 1 Apply Solder Paste
Figure 2 Position Component
Figure 3 Adjust Pressure
Figure 4 Pre-dry Paste
Figure 5 Melt Joints
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Chip Installation
Solder Paste Method/Hot air Pencil
Number: 5.3.1
Product Class: R, F, C, W
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 5.3.1
Revision:
Date: 2/98
Subject: Chip Installation
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---