IPC 7711A - 第160页

NOTES IPC-771 1A Number: 5.3.2 Revision: Date: 5/02 Subject: Chip Installation P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction or…

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EQUIPMENT REQUIRED
Soldering iron
Chisel or conical tip
Damp sponge
Wood stick or tweezers
MATERIALS
Flux-cored solder
Flux
Cleaner
Tissue/wipes
NOTE
Preheating is recommended for sensitive components (i.e., chip capacitors).
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides, residues or fluxes.
2. Install soldering iron tip in handpiece.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Apply flux to one land (optional).
5. Thermal shock tip with damp sponge.
6. Prefill one land with solder. (See Figure 1.)
7. Place the component in position and hold it with a wooden stick or tweezers.
8. Apply flux to both lands.
9. Place the tip at the junction between the prefilled land and termination area of
component.
10. Observe complete solder melt. This is evident by component dropping down
onto land. area. (See Figure 2.)
11. Pause briefly for solder to solidify
12. Solder remaining side by applying additional solder as needed. (See Figure 3.)
13. Re-tin tip end with solder and return handpiece to its stand.
14. Clean lands as required for component replacement.
Figure 1
Figure 2
Figure 3
7711A
Rework of
Electronic Assemblies
Revision:
Date: 5/02
Chip Installation
Point to Point Method
Number: 5.3.2
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 5.3.2
Revision:
Date: 5/02
Subject: Chip Installation
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Flat faced or cup-shaped tip
Damp sponge
Vacuum pick-up tool
OPTIONAL EQUIPMENT
Tweezers
MATERIALS
Flux-cored solder
Flux
Cleaner
PROCEDURE
1. Install selected tip into the soldering handpiece.
2. Start with tip temperature of approximately 315°C and change as necessary.
3. Position the component ensuring proper lead-to-land alignment. Hold the com-
ponent in place using the vacuum pick-up tool or tweezers. (See Figure 1.)
4. Apply flux and tack solder opposing corner leads. (See Figure 2.)
5. Apply flux to remaining lead/land areas. (See Figure 3.)
6. Clean tip using a damp sponge.
7. Apply solder to tip to create a bead of molten solder. (See Figure 4.)
8. Position tip so the solder bead contacts the top portion of leads. Slowly move
tip over the row of leads to form proper solder fillets at each joint. (See Figure
5.)
9. Repeat steps 7 through 8 on remaining sides of component.
10. Re-tin tip with solder.
11. Clean, if required, and inspect.
Figure 1 Position Component
Figure 2 Tack Lead
Figure 3 Flux Leads
Figure 4 Fill Tip
Figure 5 Solder Component
7711A
Rework of
Electronic Assemblies
Revision: A
Date: 5/02
Gull Wing Installation
Multi-Lead Method – Top of Lead
Number: 5.5.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---