IPC 7711A - 第178页
NOTES IPC-771 1A Number: 5.6.3 Revision: Date: 2/98 Subject: J-Lead Installation P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction …
EQUIPMENT REQUIRED
Hot air pencil
Hot air tip
Solder paste dispenser
OPTIONAL EQUIPMENT
Tweezers
MATERIALS
Solder paste
Cleaner
Tissue/wipe
PROCEDURE
1. Install tip into hot air pencil.
2. Set heater temperature of approximately 425°C and change as necessary.
3. Apply a small bead of solder paste along the land pattern using a dispenser. (See
Figure 1.)
4. Position component onto lands using a vacuum pick up tool or tweezers. (See
Figure 2.)
5. Adjust pressure output so hot air scorches a tissue from approximately 0.5 cm
away. (See Figure 3.)
6. Direct hot air over solder paste/component termination at a distance of 2.5 cm to
pre-dry solder paste. (See Figure 4.)
7. When pre-drying is observed (paste has dull, flat appearance), move tip closer
(0.5 cm) and heat until complete solder melt is observed. (See Figure 5.)
8. Clean, if required, and inspect.
Figure 1 Apply Solder Paste
Figure 2 Position Component
Figure 3 Adjust Pressure
Figure 4 Pre-dry Paste
Figure 5 Melt Joints
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Installation
Solder Paste Method/Hot Air Pencil
Number: 5.6.3
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 5.6.3
Revision:
Date: 2/98
Subject: J-Lead Installation
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Flat faced tip or cup
Flux
Flux-cored solder
MATERIALS
Cleaner
Tissue/wipe
PROCEDURE
1. Install tip into soldering handpiece.
2. Start with tip temperature of approximately 315°C and change as necessary.
3. Align the component carefully and solder it to the board at diagonally opposite
corners to fix it in place. (See Figure 1.)
4. Clean tip using damp sponge.
5. Apply solder to the face of the tip to cover approximately 1/2 of the face, keep-
ing the solder down toward the end of the tip, and add about the same amount
to the top end of the tip, also at the heel. The precise amount of solder will vary
between different types of components. (See Figure 2.)
6. Work with one side at a time, and start with a side that does not include a tacked
joint.
7. Bring the tip in at a 45° angle in relation to the row of leads. The tip will make
contact with the leads and lands where they meet. (See Figure 3.)
8. Maintaining the same angle, draw the tip down the row of leads slowly and
steadily. (See Figure 4.)
9. Clean, if required, and inspect.
Figure 1 Solder at Corners
Figure 2 Apply Solder to Tip
Figure 3 Tip in Contact with Heel
Figure 4 Draw Tip Down
45 degree
maximum
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Installation
Multi-Lead Method
Number: 5.6.4
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---