IPC 7711A - 第186页
NOTES IPC-771 1A Number: 5.7.3 Revision: Date: 5/02 Subject: BGA Reballing Procedure P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduct…
EQUIPMENT REQUIRED
Solder removal system
Convective reflow station
Reballing fixture
OPTIONAL EQUIPMENT
Reflow oven
Bake-out (vacuum, convection) oven
MATERIALS
Flux
Cleaner
Tissue/wipes
Solder spheres
NOTE
Moisture sensitive components (as classified by IPC/JEDEC J-STD-020 or equivalent
documented procedure) must be handled in a manner consistent with J-STD-033 or
an equivalent documented procedure.
CAUTION
Verify component can withstand the multiple reflow cycles.
PROCEDURE
1. Remove excess solder in accordance with procedures 4.1.2, 4.1.3, or 4.2.1
2. Clean and inspect BGA for coplanarity.
3. Apply flux to land on BGA. (Figure 1.)
4. Insert the BGA into the applicable reballing fixture and secure. (Figure 2.)
5. Carefully pour solder sphere into fixture. (Figure 3.)
6. Drain off all excess spheres. Ensure all holes in fixture have a solder sphere.
7. Reflow solder spheres using the established profile. (Figure 4.)
8. Allow BGA to cool and remove from fixture.
9. Clean (if necessary) and inspect the BGA.
Figure 1
Figure 2
Figure 3
Figure 4
7711A
Rework of
Electronic Assemblies
Revision:
Date: 5/02
BGA Reballing Procedure
Number: 5.7.3
Product Class: R, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 5.7.3
Revision:
Date: 5/02
Subject: BGA Reballing Procedure
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Soldering handpiece
Appropriate tip*
MATERIALS
Flux
Cleaner
NOTES
*Choice of the proper tip is based on tools available and the number of bridged
leads. See tips illustrated above.
PROCEDURE
1. Install appropriate tip.
2. Start with the coolest tip temperature possible (approximately 280°C) and change
as necessary. The surface attraction of the solder to the tip must overcome that
of the leads.
3. Clean tip using a damp sponge.
4. Apply flux to the bridged leads. (See Figure 1.)
5. Bring the tip in with the bottom as flat as space will permit, with the toe towards
the component and between the bridged leads. When using the scalpel tip, the
flat bottom instead of the toe is towards the component. (See Figure 2.)
6. With the bottom still flat, stand the tip up so the side contacts the shoulders of
the leads and the bridge between them.
7. After a brief pause to allow the solder to flow to the tip surface, gently move the
tip straight out from the component body, drawing the bridge with it. (See Figure
3.)
8. If you did not draw off enough solder, allow leads to cool and repeat steps 2-5.
9. Clean, as required, and inspect.
Figure 1 Apply Flux
Figure 2 Tip Should Be Flat
Figure 3 Move tip
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Removing Shorts on J-Leads
Draw Off Method
Number: 6.1.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---