IPC 7711A - 第19页

Component Additions Procedure Description Illustration Product Class Skill Level Level of Conformance 6.3 Component Modiﬁcations and Additions R, F , W , C Advanced N/A Flexible Conductor Repair Procedure Description Ill…

Surface Mount Pad Repair

Procedure Description Illustration

Product

Class

Skill

Level

Level of

Conformance

4.7.1 Surface Mount Pad Repair, Epoxy

Method

R, F, C Advanced Medium

4.7.2 Surface Mount Pad Repair, Film

Adhesive Method

R, F, C Advanced High

Plated Hole Repair

Procedure Description Illustration

Product

Class

Skill

Level

Level of

Conformance

5.1 Plated Hole Repair, No Inner

Layer Connection

R, F, W Intermediate High

5.2 Plated Hole Repair, Double Wall

Method

R, F, W Advanced Medium

5.3 Plated Hole Repair, Inner Layer

Connection

R Expert Medium

Jumpers

Procedure Description Illustration

Product

Class

Skill

Level

Level of

Conformance

6.1 Jumper Wires R, F, W, C Intermediate N/A

6.2.1 Jumper Wires, BGA Components,

Foil Jumper Method

R, F Expert Medium

6.2.2 Jumper Wires, BGA Components,

Through Board Method

R, F Expert High

October 2003 IPC-7711A/7721A

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Component Additions

Procedure Description Illustration

Product

Class

Skill

Level

Level of

Conformance

6.3 Component Modiﬁcations and

Additions

R, F, W, C Advanced N/A

Flexible Conductor Repair

Procedure Description Illustration

Product

Class

Skill

Level

Level of

Conformance

7.1.1 Flexible Conductor Repair F Expert Medium

IPC-7711A/7721A October 2003

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General Information and

Common Proedures

1 General

1.1 Scope

This document covers procedures for repair-

ing and reworking printed board assemblies. It is an aggre-

gate of information collected, integrated and assembled by

the Repairability Subcommittee (7-34) of the Product

Assurance Committee of the IPC.

1.2 Purpose This document prescribes the procedural

requirements, tools and materials and methods to be used

in the modiﬁcation, rework, repair, overhaul or restoration

of electronic products. Although this document is based in

large part on the Product Class Deﬁnitions of ANSI/J-STD-

001, this document should be considered applicable to any

type of electronic equipment. When invoked by contract as

the controlling document for the modiﬁcation, rework,

repair, overhaul or restoration of products, the requirements

ﬂowdown apply.

IPC has identiﬁed the most common equipment and pro-

cess in order to affect a speciﬁc repair or rework. It is pos-

sible that alternate equipment and processes can be used to

make the same repair. If alternate equipment is used, it is

up to the user to determine that the resultant assembly is

good and undamaged.

1.2.1 Definition of Requirements The words must and

shall have no special meaning beyond that commonly used

in other IPC standards.

1.2.2 Requirements Flowdown The applicable require-

ments of this document must be imposed by each manufac-

turer or supplier on all applicable subcontracts and pur-

chase orders. The manufacturer or supplier must not

impose or allow any variation from these requirements on

subcontracts or purchase orders other than those that have

been approved by the user. Unless otherwise speciﬁed, the

requirements of this document are not imposed on the pro-

curement of off the shelf assemblies or subassemblies.

However, the manufacturer of these items may comply as

deemed appropriate.

1.3 Background Today’s PC boards are more complex

and microminiaturized than ever before. Despite this, they

can be successfully modiﬁed, reworked or repaired if the

proper techniques are followed. This manual is designed to

help you repair, rework and modify PC boards reliably. The

procedures in this document have been obtained from end

product assemblers, printed board manufacturers and end

product users who recognized the need for documenting

commonly used rework, repair and modiﬁcation tech-

niques. These techniques have, in general, been proven to

be acceptable for the class of product indicated through

testing and extended ﬁeld functionality. Procedures con-

tained herein were submitted for inclusion by commercial

and military organizations too numerous to list individu-

ally. The Repairability Subcommittee has, where appropri-

ate, revised procedures to reﬂect improvements.

Rework completed satisfactorily will meet the original

speciﬁcation and requirements of IPC-A-600 and IPC-A-

610. But, by deﬁnition, modiﬁcations and repairs do not

comply with the initial design or fabrication criteria. For

modiﬁcation and repair, the user must recognize that the

criteria in IPC-A-600 Acceptability of Printed Boards and

IPC-A-610 Acceptability of Printed Board Assemblies are

not necessarily applicable to the procedures herein. Modi-

ﬁcations and repairs should not compensate for the lack of

proper processes and quality controls. Ultimate cost effec-

tiveness is achieved using appropriate design, fabrication

and assembly techniques that minimize the need for modi-

ﬁcation and repair.

1.4 Controls Although modiﬁcation, rework and repair

procedures may be very similar, the control of such proce-

dures may not be the same, due to the conditions and

objectives involved.

1. Modiﬁcation

The revision of the functional capability of a product

in order to satisfy new acceptance criteria.

Modiﬁcations are usually required to incorporate

design changes which can be controlled by drawings,

change orders, etc. Modiﬁcations should only be per-

formed when speciﬁcally authorized and described in

detail on controlled documentation.

2. Rework

The act of reprocessing non-complying articles,

through the use of original or equivalent processing, in

a manner that assures full compliance of the article

with applicable drawings or speciﬁcations.

3. Repair

The act of restoring the functional capability of a

defective article in a manner that precludes compliance

of the article with applicable drawings or speciﬁca-

tions.

October 2003 IPC-7711A/7721A

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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