IPC 7711A - 第310页
NOTES IPC-7721A Number: 5.3 Revision: Date: 2/98 Subject: Plated Hole Repair , Inner Layer Connection P a g e4o f4 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Re…
12. Solder the eyelet to the exposed inner layer signal or plane by applying heat
from a soldering iron to barrel of the eyelet. (See Figure 3.)
13. Completely remove any solder flux residue by spray rinsing with cleaner.
14. Use a microscope and inspect the solder fillet from the eyelet to the inner con-
nection and perform electrical tests as required.
15. Mix epoxy as required.
16. Fill the milled hole with the epoxy up to, and level with, the surface of the board.
(See Figure 4.) The epoxy filler material should be free of voids and air bubbles.
17. Cure epoxy per the manufacturer’s recommendations
18. Select the proper setting tools and insert them into the eyelet press. (See Fig-
ure 5.)
19. Turn the printed wiring board over and rest the eyelet flange on the lower set-
ting tool.
20. Apply firm even pressure to form the eyelet barrel. (See Figure 6.)
21. Install the component lead and solder, if required.
22. Clean the area.
EVALUATION
1. Visual examination, dimensional requirement of pad diameter and inside diam-
eter.
2. Electrical continuity measurement.
IPC-7721A
Number: 5.3
Revision:
Date: 2/98
Subject: Plated Hole Repair, Inner Layer Connection
Page3of4
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7721A
Number: 5.3
Revision:
Date: 2/98
Subject: Plated Hole Repair, Inner Layer Connection
Page4of4
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
OUTLINE
This procedure covers the repair/modification of printed boards and electronic
assemblies by the use of jumper wires to complete electrical continuity between two
points. This procedure is meant to provide a foundation for adding jumper wires dur-
ing the repair/modification process. The techniques and guidelines are based on
general commercial and industry practices.
Jumper wires fall into three (3) categories
1. Those that are considered wires and are installed during assembly. The routing,
termination, and bonding of these jumper wires are documented by engineering
instructions or drawing notations.
2. Those that are added after assembly to effect a change or modification. The
routing, termination, and bonding of these jumper wires are documented by engi-
neering change notice instructions or drawing notations.
3. Those that are added to correct a defect.
This procedure has nine main sections.
1. References
2. Tools and Materials
3. General Rules
4. PC Board Preparation
5. Jumper Wire Selection
6. Jumper Wire Preparation
7. Jumper Wire Termination and Routing
8. Jumper Wire Bonding
9. Jumper Wire Termination Figures
REFERENCES
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking and Preheating
TOOLS & MATERIALS
Adhesive, Hot Melt
Adhesive, Quick Set
Cleaner
Cleaning Wipes
Flush Cutter
Flux, Liquid
Smooth Pliers
Solder
Soldering Iron with Tips
Tape Dots
Wire
Wire, Adhesive Coated
Wire Stripper
Figure 1 Route jumper wires.
Figure 2 Use sleeving through PTH.
Figure 3 Use insulated wire if
required.
Figure 4 Bond wires using tape dots
or strips.
7721A
Repair and
Modification of
Printed Boards and
Electronic Assemblies
Revision:
Date: 11/99
Jumper Wires
Number: 6.1
Product Class: R/F/W/C
Skill Level: Intermediate
Level of Conformance: N/A
Material in this manual was voluntarily established by Technical Committees of IPC. This material is advisory only and its use
or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material.
Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment
referenced is for the convenience of the user and does not imply endorsement by IPC.
Page1of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---