IPC 7711A - 第66页
NOTE: Once solder stops wicking into the braid material remove the iron and braid material immediately. 9. Remove tip and braid material. 10. Confirm complete solder removal from area. 11. Lift lead with a non-metallic t…
EQUIPMENT REQUIRED
Soldering iron
Chisel tip
Damp sponge
Non-metallic tool (wood stick or spudger)
Wicking braid
OPTIONAL EQUIPMENT
N/A
MATERIALS
Flux-cored solder
Flux
Cleaner
Tissue/wipes
NOTE
On multileaded devices a skipping/alternating pattern may be needed to reduce heat
buildup.
CAUTION
This procedure is not recommended for the removal of solder in plated-through
holes due to the risk of conductor damage. This method should only be used when
no other method exists. Wicking is most affective on surface solder only.
CAUTION
Trim the wicking braid to prevent damage to other land areas or components.
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides, residues or fluxes.
2. Install soldering iron tip in handpiece.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Apply flux to all solder connections (optional).
5. Thermal shock tip with damp sponge.
6. Apply braid material to lead land junction. (See Figure 1.)
7. Lower tip contacting braid material connection.
8. Observe solder wicking into the braid material.
Figure 1
Figure 2
7711A
Rework of
Electronic Assemblies
Revision:
Date: 5/02
Through-Hole Desoldering
Full Clinch Wicking Method
Number: 3.1.5
Product Class: R, F, W
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTE: Once solder stops wicking into the braid material remove the iron and
braid material immediately.
9. Remove tip and braid material.
10. Confirm complete solder removal from area.
11. Lift lead with a non-metallic tool to the vertical position. (See Figure 2.)
12. Repeat for all solder connections.
13. Re-tin tip end with solder and return handpiece to its stand.
14. Clean lands as required for component replacement.
IPC-7711A
Number: 3.1.5
Revision:
Date: 5/02
Subject: Through-Hole Desoldering
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Solder fountain
Chimney or nozzle to match part
Removal tool
Pallet to hold board over fountain
Preheat oven
OPTIONAL EQUIPMENT
Vacuum pick-up tool
MATERIALS
Flux-cored solder
Cleaner
Heat resistant, antistatic gloves
Protective face gear
Heat resistant tape
PROCEDURE
This process is for experienced operators only. Caution must be exercised due to
working with hot, molten solder.
1. Set solder fountain pot control to the required temperature for removing that par-
ticular component from that particular board. Wait until solder pot reaches the set
temperature.
2. Attach the correct nozzle or chimney to the solder pot. (See Figure 1.)
3. Set the timer for the amount of time the fountain is to be running for that particu-
lar part.
4. The area around the rework site may be masked with a high temperature resis-
tant tape, or similar material, to protect the adjacent area during rework. (See
Figure 2.)
5. Preheat the board to the desired temperature, depending on the component
restrictions and the board T
g
material.
6. Flux the bottom side site where the part will be removed. (See Figure 2.)
7. Place the board on the pallet over the solder fountain and trip the timer. (See Fig-
ure 3.)
8. At the end of the timer cycle, use vacuum pickup tool, tweezers, or removal tool
to remove the part from the board.
9. Clean the flux residue, if required, and inspect.
Figure 1 Attach Nozzle
Figure 2 Flux
Figure 3 Place Over Solder Fountain
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
PGA and Connector Removal
Solder Fountain Method
Number: 3.2.1
Product Class: R, F, W, C
Skill Level: Expert
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---