IPC 7711A - 第7页

Handling/Cleaning Procedure Description Product Class Skill Level Level of Conformance 2.1A Handling Electronic Assemblies R,F ,W,C Intermediate High 2.2 Cleaning R, F , C, W Intermediate High Coating Removal Procedure D…

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Table of Contents
PART 1 General Information and Common Procedures
1 General .............................................................................. 1
1.1 Scope ............................................................................. 1
1.2 Purpose .......................................................................... 1
1.2.1 Definition of Requirements ....................................... 1
1.2.2 Requirements Flowdown .......................................... 1
1.3 Background ................................................................... 1
1.4 Controls ......................................................................... 1
1. Modification
....................................................................... 1
2. Rework
.............................................................................. 1
3. Repair
................................................................................ 1
1.4.1 Classification .............................................................. 2
1. Class 1 – General Electronics Products
........................... 2
2. Class 2 – Dedicated Service Electronic Products
............ 2
3. Class 3 – High Performance Electronic Products
............ 2
1.4.2 Printed Board Types .................................................. 2
R. Rigid Printed Boards and Assemblies
.............................. 2
F. Flexible Printed Boards and Assemblies
.......................... 2
W. Discrete Wiring Boards and Assemblies
........................... 2
C. Ceramic Boards and Assemblies
...................................... 2
1.4.3 Level of Conformance ............................................... 2
1.4.4 Levels of Conformance ............................................. 2
L. Lowest Level
..................................................................... 2
M. Medium Level
.................................................................... 2
H. Highest Level
.................................................................... 2
1.4.5 Skill Level ................................................................... 3
1.5 Terms and Definitions .................................................. 3
1.6 Training .......................................................................... 3
1. Soldering Skills
.................................................................. 3
2. Personnel Selection
.......................................................... 3
3. Professional Training
......................................................... 3
1.7 Basic Considerations ................................................... 4
1. Appropriate Approvals
....................................................... 4
2. Singular Procedures
.......................................................... 4
3. Quality and Reliability
....................................................... 4
4. Procedure Selection
.......................................................... 4
5. Patience
............................................................................ 4
6. Heat Application
................................................................ 4
7. Removal of Coatings
......................................................... 4
1.8 Tools and Materials ...................................................... 4
1. Proper Workstations
.......................................................... 4
2. High Quality Microscope
................................................... 4
3. Lighting
.............................................................................. 4
4. Soldering Tools
................................................................. 4
5. Component Removal and Installation
............................... 4
6. Preheating (Auxiliary) Heating
.......................................... 4
7. Fume Extraction
................................................................ 4
8. Hand Held Drilling and Grinding Tool
............................... 4
9. Precision Drill/Mill System
................................................. 5
10. Replacement Conductors and Lands
............................... 5
11. Gold Plating System
......................................................... 5
12. Epoxy and Coloring Agents
.............................................. 5
13. Eyelets and Eyelet Press System
..................................... 5
14. Cleaning Station/System
................................................... 5
15. Tools and Supplies
............................................................ 5
16. Conformal Coating Area
................................................... 5
17. Materials
............................................................................ 5
1.9 Process Goals and Guidelines .................................... 5
1.9.1 Non-destructive Component Removal .................... 6
1.9.2 Surface Mount Land Preparation ............................. 6
1. Remove Old Solder
........................................................... 6
2. Clean Lands
...................................................................... 6
1.9.3 Component Installation ............................................. 6
1.9.4 Primary Heating Methods ......................................... 7
1.9.5 Preheating and Auxiliary Heating Methods ............ 8
1.9.6 Vision Systems and Surface Mount
Component Placement ......................................................... 8
1.9.7 Selecting Optimum Process for Manual
Assembly/Rework .................................................................. 9
1.9.8 BGA/CSP/Flip Chip Time Temperature
Profile TTP) ............................................................................ 9
1.9.9 Lead Free Solder ....................................................... 9
October 2003 IPC-7711A/7721A
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Handling/Cleaning
Procedure Description Product Class Skill Level
Level of
Conformance
2.1A Handling Electronic Assemblies
R,F,W,C Intermediate High
2.2 Cleaning
R, F, C, W Intermediate High
Coating Removal
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.3.1 Coating Removal, Identification of
Conformal Coating
R, F, W, C Advanced High
2.3.2 Coating Removal, Solvent Method
R, F, W, C Advanced High
2.3.3 Coating Removal, Peeling Method
R, F, W, C Advanced High
2.3.4 Coating Removal, Thermal Method
R, F, W, C Advanced High
2.3.5 Coating Removal, Grinding/
Scraping Method
R, F, W, C Advanced High
2.3.6 Coating Removal, Micro Blasting
Method
R, F, W, C Advanced High
IPC-7711A/7721A October 2003
vi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Coating Replacement
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.4.1 Coating Replacement, Solder
Resist
R, F, W, C Intermediate High
2.4.2 Coating Replacement, Conformal
Coatings/Encapsulants
R, F, W, C Intermediate High
Conditioning
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.5 Baking and Preheating R, F, W, C Intermediate High
Epoxy Mixing and Handling
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.6 Epoxy Mixing and Handling R, F, W, C Intermediate High
October 2003 IPC-7711A/7721A
vii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---