IPC 7711A - 第74页
NOTES IPC-771 1A Number: 3.3.3 Revision: Date: 2/98 Subject: Chip Removal (bottom termination) P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No…
EQUIPMENT REQUIRED
Soldering system
Hot air pencil
Hot air tip
Tweezers
MATERIALS
Flux
Cleaner
Tissue/wipe
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install tip into hot air pencil.
3. Set heater temperature to approximately 425°C and change as necessary.
4. Apply flux to component terminations. (See Figure 1.)
5. Adjust pressure output so hot air scorches a tissue from approximately 0.5 cm.
(See Figure 2.)
6. Direct hot air over component with tip at a distance of 0.5 cm until complete sol-
der melt is observed. (See Figure 3.)
7. Lift component from PWB. (See Figure 4.)
NOTE: Chip components may have adhesive between the body and the board.
If adhesive is used, it may be necessary to slightly turn the component to allow
the component to be removed from the board. This must only be accomplished
after complete solder melt to prevent damage.
8. Release component onto a heat resistant surface.
9. Prepare lands for component replacement.
Figure 1 Flux Component
Figure 2 Adjust Pressure
Figure 3 Melt Joints
Figure 4 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Chip Removal (bottom termination)
Hot Air Method
Number: 3.3.3
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.3.3
Revision:
Date: 2/98
Subject: Chip Removal (bottom termination)
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Tweezer handpiece
Soldering handpiece
Removal tips
Chisel tip
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install removal tips into tweezer.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Tack solder to one of the end solder joints using soldering handpiece with chisel
tip installed. (See Figure 1.)
5. Wrap solder around the four sides of component.
6. Terminate solder at end of last side using soldering handpiece.
7. Remove old solder from tips and thermal shock tips with damp sponge.
8. Tin inside edges of tips with solder. (See Figure 2.)
9. Lower tips over component and squeeze handpiece. (See Figure 3.)
10. Contact ALL solder joints with tips, confirm solder melt of ALL joints, and lift
component from PWB. (See Figures4&5.)
11. Release component onto a heat resistant surface.
12. Prepare lands for component replacement.
Figure 1 Tack & Wrap
Wire Solder
Figure 2 Tin Tips
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Leadless Component Removal
Solder Wrap Method
Number: 3.4.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---