IPC 7711A - 第75页

EQUIPMENT REQUIRED Soldering system Tweezer handpiece Soldering handpiece Removal tips Chisel tip MATERIALS Flux-cored solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contaminatio…

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NOTES
IPC-7711A
Number: 3.3.3
Revision:
Date: 2/98
Subject: Chip Removal (bottom termination)
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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EQUIPMENT REQUIRED
Soldering system
Tweezer handpiece
Soldering handpiece
Removal tips
Chisel tip
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install removal tips into tweezer.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Tack solder to one of the end solder joints using soldering handpiece with chisel
tip installed. (See Figure 1.)
5. Wrap solder around the four sides of component.
6. Terminate solder at end of last side using soldering handpiece.
7. Remove old solder from tips and thermal shock tips with damp sponge.
8. Tin inside edges of tips with solder. (See Figure 2.)
9. Lower tips over component and squeeze handpiece. (See Figure 3.)
10. Contact ALL solder joints with tips, confirm solder melt of ALL joints, and lift
component from PWB. (See Figures4&5.)
11. Release component onto a heat resistant surface.
12. Prepare lands for component replacement.
Figure 1 Tack & Wrap
Wire Solder
Figure 2 Tin Tips
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Leadless Component Removal
Solder Wrap Method
Number: 3.4.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.4.1
Revision:
Date: 2/98
Subject: Leadless Component Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---