IPC 7711A - 第8页
Coating Replacement Procedure Description Illustration Product Class Skill Level Level of Conformance 2.4.1 Coating Replacement, Solder Resist R, F , W , C Intermediate High 2.4.2 Coating Replacement, Conformal Coatings/…
Handling/Cleaning
Procedure Description Product Class Skill Level
Level of
Conformance
2.1A Handling Electronic Assemblies
R,F,W,C Intermediate High
2.2 Cleaning
R, F, C, W Intermediate High
Coating Removal
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.3.1 Coating Removal, Identification of
Conformal Coating
R, F, W, C Advanced High
2.3.2 Coating Removal, Solvent Method
R, F, W, C Advanced High
2.3.3 Coating Removal, Peeling Method
R, F, W, C Advanced High
2.3.4 Coating Removal, Thermal Method
R, F, W, C Advanced High
2.3.5 Coating Removal, Grinding/
Scraping Method
R, F, W, C Advanced High
2.3.6 Coating Removal, Micro Blasting
Method
R, F, W, C Advanced High
IPC-7711A/7721A October 2003
vi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Coating Replacement
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.4.1 Coating Replacement, Solder
Resist
R, F, W, C Intermediate High
2.4.2 Coating Replacement, Conformal
Coatings/Encapsulants
R, F, W, C Intermediate High
Conditioning
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.5 Baking and Preheating R, F, W, C Intermediate High
Epoxy Mixing and Handling
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.6 Epoxy Mixing and Handling R, F, W, C Intermediate High
October 2003 IPC-7711A/7721A
vii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Table of Contents
PART 2 Rework of Electronic Assemblies
3 Removal
3.1 Through-Hole Removal
Procedure Description
Round Lead
Product Class Skill Level
Level of
Conformance
3.1.1A Continuous Vacuum Method R,F,W Intermediate High
3.1.2 Continuous Vacuum Method - Partial Clinch R,F,W Intermediate High
3.1.3 Continuous Vacuum Method - Full Clinch R,F,W Intermediate High
3.1.4 Full Clinch Straigthening Method R,F,W Intermediate High
3.1.5 Full Clinch Wicking Method R,F,W Advanced High
3.2 PGA and Connector Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.2.1 Solder Fountain Method R,F,W,C Expert Medium
3.3 Chip Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.3.1 Bifurcated tip R,F,W,C Intermediate High
3.3.2 Tweezer Method R,F,W,C Intermediate High
3.3.3 Bottom Termination - Hot Air Method R,F,W,C Intermediate High
3.4 Leadless Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.4.1 Solder Wrap Method R,F,W,C Advanced High
3.4.2 Flux Application Method R,F,W,C Advanced High
IPC-7711A/7721A October 2003
viii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---