IPC 7711A - 第9页

Table of Contents PART 2 Rework of Electronic Assemblies 3 Removal 3.1 Through-Hole Removal Procedure Description Round Lead Product Class Skill Level Level of Conformance 3.1.1A Continuous V acuum Method R,F ,W Intermed…

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Coating Replacement
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.4.1 Coating Replacement, Solder
Resist
R, F, W, C Intermediate High
2.4.2 Coating Replacement, Conformal
Coatings/Encapsulants
R, F, W, C Intermediate High
Conditioning
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.5 Baking and Preheating R, F, W, C Intermediate High
Epoxy Mixing and Handling
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.6 Epoxy Mixing and Handling R, F, W, C Intermediate High
October 2003 IPC-7711A/7721A
vii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Table of Contents
PART 2 Rework of Electronic Assemblies
3 Removal
3.1 Through-Hole Removal
Procedure Description
Round Lead
Product Class Skill Level
Level of
Conformance
3.1.1A Continuous Vacuum Method R,F,W Intermediate High
3.1.2 Continuous Vacuum Method - Partial Clinch R,F,W Intermediate High
3.1.3 Continuous Vacuum Method - Full Clinch R,F,W Intermediate High
3.1.4 Full Clinch Straigthening Method R,F,W Intermediate High
3.1.5 Full Clinch Wicking Method R,F,W Advanced High
3.2 PGA and Connector Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.2.1 Solder Fountain Method R,F,W,C Expert Medium
3.3 Chip Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.3.1 Bifurcated tip R,F,W,C Intermediate High
3.3.2 Tweezer Method R,F,W,C Intermediate High
3.3.3 Bottom Termination - Hot Air Method R,F,W,C Intermediate High
3.4 Leadless Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.4.1 Solder Wrap Method R,F,W,C Advanced High
3.4.2 Flux Application Method R,F,W,C Advanced High
IPC-7711A/7721A October 2003
viii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
3.5 SOT Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.5.1A Flux Application Method R,F,W,C Intermediate High
3.5.2A Flux Application Method - Tweezer R,F,W,C Intermediate High
3.5.3A Hot Air Pencil R,F,W,C Intermediate High
3.6 Gull Wing Removal (two sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.6.1 Bridge Fill Method R,F,W,C Intermediate High
3.6.2A Solder Wrap Method R,F,W,C Intermediate High
3.6.3 Flux Application Method R,F,W,C Intermediate High
3.6.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.6.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.6.6A Flux Application Method - Tweezer R,F,W,C Advanced High
3.7 Gull Wing Removal (four sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.7.1A Bridge Fill Method - Vacuum Cup R,F,W,C Advanced High
3.7.1.1 Bridge Fill Method - Surface Tension R,F,W,C Intermediate High
3.7.2A Solder Wrap Method - Vacuum Cup R,F,W,C Advanced High
3.7.2.1 Solder Wrap Method - Surface Tension R,F,W,C Intermediate High
3.7.3 Flux Application Method - Vacuum Cup R,F,W,C Advanced High
3.7.3.1 Flux Application Method - Surface Tension R,F,W,C Intermediate High
3.7.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.7.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.7.6 Flux Application Method - Tweezer R,F,W,C Advanced High
3.7.7 Hot Gas Reflow Method R,F,W,C Advanced High
October 2003 IPC-7711A/7721A
ix
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---