00197733-01_VD_605_04_DE_EN - 第24页
Station Software 60 5.04 / Version D escription Ausgabe 04/ 2015 Edition 24 Component r ange for Twin Head With type 33 compo nent camera (Stat. P&P 55 x 45 digital) With type 25 compo nent camera (Sta t. P&P 16 …

Station Software 605.04 / Version Description Ausgabe 04/2015 Edition
23
Component range
for C&P12 head
With standard
component
camera
C&P (type 28)
18 x 18, digital
With high-resolution
component camera
C&P (type 29)
27 x 27, digital
With high-resolution
component camera
C&P (type 30)
27 x 27, digital
With high-resolution
component camera
C&P (type 38)
16 x 16, digital
0402 through
PLCC44, BGA,
µBGA, flip-chip,
TSOP, QFP, SO
through SO32,
DRAM
0201 through
PLCC44, bare die,
BGA, µBGA, flip-
chip, TSOP, QFP,
SO through SO32,
DRAM
01005 through
PLCC, SO, QFP,
TSDP, SOT, MELF,
CHIP, IC, BGA
01005 through
PLCC44, bare die,
BGA, µBGA, flip-
chip, TSOP, QFP,
SO through SO32,
DRAM
Component
specification
Max height 6 mm 6 mm 6 mm 6 mm
Min. lead pitc 0.5 mm 0.3 mm 0.3 mm 0.25 mm
Min. ball pitch 0.45 mm 0.25 mm 0.25 mm < 18 x 18
0.35 mm ≥ 18 x 18
0.25 mm
Min. ball diameter 0.25 mm 0.14 mm 0.14 mm < 18 x 18
0.2 mm ≥ 18 x 18
0.14 mm
Min. dimensions 0.5 x 0.5 mm 0.3 x 0.3 mm 0.18 x 0.18 mm 0.18 x 0.18 mm
Max. dimensions 18.7 x 18.7 mm 18.7 x 18.7 mm 18.7 x 18.7 mm 16 x 16 mm
Max. weight 2 g 2 g 2 g 2 g
Programmable
placement force
2.4 N - 5 N 2.4 N - 5 N 2.4 N - 5 N 2.4 N - 5 N
Nozzle types 9 xx 9 xx 9 xx 9 xx
Table 7-4: Component range for C&P12 head
Component range for C&P6 head With high-resolution type 29 component camera (C&P 27 x 27 digital)
0201 through 27 x 27 mm
Component specification
Max height 8.5 mm
Min. lead pitch 0.3 mm
Min. ball pitch 0.25 mm für BE < 18 x 18 mm
Min. ball diameter
0.35 mm für BE ≥ 18 x 18 mm
0.14 mm für BE < 18 x 18 mm
0.2 mm für BE ≥ 18 x 18 mm
Min. dimensions 0.3 x 0.3 mm
Max. dimensions 27 x 27 mm
Max. weight 5 g
Programmable placement force 2.4 N - 5,0 N
Nozzle types 8 xx, 9 xx
Table 7-5: Component range for C&P6 head

Station Software 605.04 / Version Description Ausgabe 04/2015 Edition
24
Component range for
Twin Head
With type 33 component camera
(Stat. P&P 55 x 45 digital)
With type 25 component camera
(Stat. P&P 16 x 16 digital)
0603 through SO, PLCC, QFP,
BGA, special components, bare
die, flip-chip
0201 through SO, PLCC, QFP,
sockets, connectors, BGA, special
components, bare die, flip-chip,
shield
Component specification
Max height 25 mm (higher on request) 25 mm (higher on request)
Min. lead pitch 0.3 mm 0.25 mm
Min. ball pitch 0.35 mm 0.14 mm
Min. ball diameter 0.2 mm 0.08 mm
Min. dimensions 0.5 x 0.5 mm 0.2 x 0.2 mm
Max. dimensions 55 x 45 mm (single measurement) 16 x 16 mm (single measurement)
When used with two nozzles
50 x 50 mm or 69 x 10 mm²
When used with one nozzle:
85 x 85 mm or 125 x 10 mm²
max. 200 x 125 mm (with
restrictions)
Max. weight 100 g
*)
100 g
*)
Programmable placement
force
1.0 N - 15 N
1.0 N - 30 N
**)
1.0 N - 15 N
1.0 N - 30 N
**)
Nozzle types 5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
Distance between nozzles
on the two segments
70.80 mm 70.80 mm
Table 7-6: Component range for Twin Head
*)
If standard nozzles are used
**)
Valid for HFTH only
NOTICE for the 904 nozzle type:
For the 904 nozzle type the vacuum threshold value has been increased from 20% to
40%. For components drawing
more leak air due to their surface shapes, this may cause
a higher amount of error messages.
As workaround, it is possible to create a special nozzle in SIPLACE Pro, based on the
nozzle type 904, in which you enter lower vacuum values.

Station Software 605.04 / Version Description Ausgabe 04/2015 Edition
25
Component range
for P&P head
With type 36 component
camera
(Stat. P&P 32 x 32
digital)
With type 25 component
camera
(Stat. P&P 16 x 16
digital)
With type 33 component
camera
(Stat. P&P 55 x 45 digital)
0603 through SO, PLCC,
QFP, BGA, special
components, bare die,
flip-chip
0201 through SO, PLCC,
QFP, sockets,
connectors, BGA, special
components, bare die,
flip-chip, shield
0603 through SO, PLCC,
QFP, BGA, special
components, bare die, flip-
chip
Component
specification
Max height 18.80 mm 18.80 mm 18.80 mm
Min. lead pitch r 0.4 mm 0.25 mm 0.3 mm
Min. ball pitch 0.56 mm 0.14 mm 0.35 mm
Min. ball diameter 0.32 mm 0.08 mm 0.2 mm
Min. dimensions 0.8 x 0.,8 mm 0.2 x 0.2 mm 0.5 x 0.5 mm
Max. dimensions 32 x 32 mm (single
measurement)
16 x 16 mm (single
measurement)
55 x 45 mm (single
measurement)
85 x 85 mm or 125 x 10 mm
max. 200 x 125 mm (single
measurement)
Max. weight 100 g
*)
100 g
*)
100 g
*)
Programmable
placement force
1.0 N - 15 N 1.0 N - 15 N 1.0 N - 15 N
Nozzle typ 5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
Table 7-7: Component range for P&P head
*)
If standard nozzles are used