IPC CH-65B CHINESE.pdf - 第119页

16. ational Physical Laboratory ( PL ) , White residues on soldered printed circuit assemblies. Retrieved from www .npl.co.uk / ei 17. Keeping, J. ( 2008, Oct ) . Critical Considerations for Selecting a Conformal Coati…

100%1 / 215
8.11.6.10 组件表⾯的残留物 助焊剂残留物导致元器件、元器线和覆敷形涂覆时
附着/退润湿这些导致或者源在的清洗、材料和
焊接/返修助焊剂
8.11.6.11 导致周围的敷形涂覆附着/退润湿源在的清
洗、标选择和标
考⽂
1. Bixenman, M., Zhang, P. & Shi, C. (2009, May). White Residues on Printed Circuit Boards Post Cleaning.
SMTA China Technical Conference. Shenzhen, China.
2. Lee, .C. (2002). Reflow soldering processes and troubleshooting SMT, BGA, CSP and Flip Chip Tech-
nologies. ewness: Woburn, MA
3. Dishart, K., (2008, Oct). Using Hansen solubility parameters to match the cleaning agent to the lead free
flux residue. IPC/SMTA High Performance Cleaning Symposium.
4. Lee, .C. (2008, Oct). Lead-free flux technology and influence on cleaning. IPC-SMTA High Performance
Cleaning Symposium.
5. Chan, TM, Moo, KS, Teoh, KH (2008). White residue formation on printed circuit board assemblies.
Sanmina-SCI Penang, Malaysia.
6. Polymerization. Retrieved February 25, 2008 from http://en.wikipedia.org/wiki/Polymerization
7. Steinke, T, Ling, Z., & Bogert. G.L. (2002) April. White residue on LPI Solder Mask. Retrieved from IPC
Techet Forum.
8. Alpha-Fry Technologies (n.d.). White residue and water soluble fluxes. Cookson Electronics. Jersey City,
J.
9. Sozansky, W. Ihms, D., & Bixenman, M. (2002, Feb). Enhanced vapor phase cleaning fluid for demanding
flip chip cleaning requirements. International Workshop on Wafer Level CSP and Flip Chip Packaging.
Georgia Tech University.
10. Munson, T. (n.d.). White residue on finished assemblies: Is it good or bad? Retrieved February 15, 2009
from http://www.residues.com/pdf/white_residue2.pdf
11. Munson, T. (2006, T). White residues: Are they or aren’t they? Circuit Assembly. Retrieved on February
15, 2009 from http://www.residues.com/pdfs/Circuits%20Assembly%20Articles/2006/lowres/
2006.01-White%20Residues-%20Are%20They%20or%20Arent%20They%20-%20Circuits%20
Assembly.pdf
12. Munson, T. (2004, July). Is white residue a reliability risk? Circuit Assembly. Retrieved on February 15,
2009 from http://www.residues.com/pdfs/Circuits%20Assembly%20Articles/2004/low%20res/2004.
07- Is%20White%20Residue%20a%20Reliability%20Risk%20-%20Circuits%20Assembly.pdf
13. Pham, H.H. (2007, July) Flux residues and selective soldering. SMT. Retrieved on February 13, 2009 from
http:// smt.pennnet.com/display_article/297961/35/ARTCL/none/none/Flux-Residue-&-Selective-
Soldering
14. Munson, T. (n.d.). White residue below BGA components: Is it good or bad? Retrieved February 15, 2009
from http://www.residues.com/pdf/white_residue1.pdf
15. Bixenman, M., & Stach, S. (2007, Aug). Development and Validation of a new test platform for cleaning
process development: Phase I. SMTAI 2007, Orlando, FL.
IPC-CH-65B-C 20117
104
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,`,`,,,`,,,`,`,`,`,,,```-`-`,,`,,`,`,,`---
16. ational Physical Laboratory (PL), White residues on soldered printed circuit assemblies. Retrieved
from www.npl.co.uk/ei
17. Keeping, J. (2008, Oct). Critical Considerations for Selecting a Conformal Coating Process. IPC/SMTA
Cleaning Symposium.Rosemont, IL.
18. Stach, S., & Bixenman, M. (2004). Optimizing Spray Energy in Batch and Inline Spray Systems. SMTAI,
Rosemont, IL.
19. Bixenman, M., Lee, .C., & Stach, S. (2009, Oct). Ionic Cleanliness Testing Research of Printed Wiring
Boards for Purposes of Process Control. SMTAI, San Diego, CA.
20. Stach, S. (2009). Using Hansen Solubility to Optimize Solvent Based Cleaning Processes for Manufactur-
ing Electronic Assemblies, Retrieved from http://www.aat-corp.com/technical_papers/
UsingHansenSpaceToOptimizeSolvent BasedCleaningProcesses.pdf
21. Stach, S., & Bixenman, M. (2005). Optimizing Spray Energy in Batch and Inline Spray Systems, Phase II.
SMTAI, Rosemont, IL.
22. Telcordia Technologies’ (formerly Bellcore’s) GR-78-CORE.
23. Tellefesen, K. GREE RESIDUES AD ELECTRICAL RELIABILITY, Proceedings of the International
Conference on Electronic Assembly: Materials and Process Challenges, Atlanta, Georgia, June, 1998.
24. ‘Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution’
Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, aveen Ravindran,
ZESTRO America, John M. Radman, Daniel D. Phillips, Trace Laboratories East
9 环境考虑要点
9.1 安全性 主要中在国的法律法规方面,
这些
或者或者的主的,在我们
认知:在遵守地方法规时,要兼顾遵守州和联邦政府法规
选择清洗必须考虑排放、污排放物产生在影三个环境介质
一个都可能基于使和设排放、污排放
物产生可。溶剂
水基清洗 化学溶剂。所们都必须遵照在工作场合的化学物质方面的准
1994国工业健康安全风险交标准生效物质安全数据表明
许多有关像毒测试健康风险评估物处理安全作措施保护性设物质化学
性和易面的文件信息。并确保这些文件使
化学物质的人
使用。 法规要求任何有可能使半水基清洗的和其化学物质的人在任何工作场合都能到相
化学物质安全数据表。
作场良好暴露的化学物质应该越少越好。工业保健监确保暴露的化
物质限值。在化学物质或者清洗设时,工程制不能使暴露物质达到
其可限值,必须确保
有合适的个人防护保护安全工业安全健
中的个人防护标准, 位都要有份个人防护备评估报告。材料安全数据表中列
议使用的个人防护将这些与清洗一并出。
9.1.1 环境意识 国有一套完法规气清洁法规清洁法规,资源保护
总之这些法规使和制由始至终排放
排放物产生,印制线
组装所产生负责有一法规要求对排放气、水或者运出的特定物质
报告这些法规要求们的清洗说服力的有关环境安全问题的文件
20117 IPC-CH-65B-C
105
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,`,`,,,`,,,`,`,`,`,,,```-`-`,,`,,`,`,,`---
报告。用户也意识要性,要求安全的化学物质更加
方案技术要求。
清洗程中会排放和污清洗设备或者浸泡槽中会很少或者
工业,所以许多物质要一个排放许可证。用必须遵循政府或者或者法规
个公司必须至少符
政府的标准。 法规可能与政府法规可能政府法规更加约束
性。性的法规至少与州法规约束性。
9.1.2 环境问题 选择焊接清洗的清洗时,制必须考虑清洗对气排放、污排放
排放产生的影。在有对排放量有精确定义的国,都要对气释放量、污
排放出量具体规定常常
注点
排放
VOCs发性有化合
消耗臭物质
全球变暖物质
气有物质
•废
重金属阳离子(主要有
阴离子(主要
/EDTA/化合
pH或者件)
COD/BOD(化学需氧/生需氧量)
生物降解生物性(24小时和96小时)
体物质悬浮、表面张力
•固
重金属(主要有
列出的有物质或者过期的化学物质
使溶剂(包的)
1
管使用的溶剂体物环境保护定义液体体物都为
261.3环境保护联邦法案
9.2 体排放 气清洁法规要求各州具体的污染物质合国家环境空量标准规定的六
物质这些污染有五)不电子制
备引的。第六发的有化合可能电子制备引的。州和方政府
清洁法规授权下实性的法规,而这些法规性的法规标准严格此来达到国
环境空量标准。有任何新的化学物质 (包清洗生产制程中,用到上
要求使可量必须照地性的导方法规。审长,所
在任何一
新的化学物质选择和实施阶段调许可量申请程的要性。
用一化学清洗清洗松助焊剂时,气排放环境产生。通,在的清洗
程中,有两种的气排放:(1发性的有化合 和(2汽。发性的有化合
溶剂产生的,包含和支,有时候也
乳剂产生
乙烯族认定毒排放。在一区,发性的有化合严格
IPC-CH-65B-C 20117
106
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,`,`,,,`,,,`,`,`,`,,,```-`-`,,`,,`,`,,`---