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3 Technical data User Manual SIP LACE CF 3.8 Placement heads Software Version SR.408.xx 03/2006 US E dition 88 3 Fig. 3.8 - 2 Structure of the 6-segment Collect&Place head wit h standard component vision cam era - pa…
User Manual SIPLACE CF 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.8 Placement heads
87
3.8 Placement heads
3.8.1 6-segment Collect&Place head
3.8.1.1 Structure
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Fig. 3.8 - 1 Structure of the 6-segment Collect&Place head with standard component vision camera - part 1
(1) Star with 6 sleeves (4) Z-axis drive
(2) Motor for "Reject" valve adjustment drive (5) Star motor
(3) Component vision camera
3 Technical data User Manual SIPLACE CF
3.8 Placement heads Software Version SR.408.xx 03/2006 US Edition
88
3
Fig. 3.8 - 2 Structure of the 6-segment Collect&Place head with standard component vision camera - part 2
3
(1) Forced air valve
(2) Turning station
(3) Vacuum generator
User Manual SIPLACE CF 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.8 Placement heads
89
3.8.1.2 Description
– The 6-segment Collect&Place head works using the "collect & place" principle, i.e. the compo-
nents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– All the components are inserted with the same cycle time. Before the component is inserted, it
is measured by the optoelectronic vision module.
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
– Defective components are rejected and are picked up again during a repair run.
3.8.1.3 Technical data
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Component range 0201 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
6 mm (10.7 mm available upon request)
0.5 mm
0.35 mm
0.2 mm
0.6 mm x 0.3 mm
18.7 mm x 18.7 mm
2 g
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 9,000 comp/h
Nozzle types 9 xx
Angular accuracy ± 0.5° / 3σ ± 0.7° / 4σ
Placement accuracy ± 68 µm / 3σ ± 90 µm / 4σ