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3 Technical data User Manual SIP LACE CF 3.8 Placement heads Software Version SR.408.xx 03/2006 US E dition 90 3.8.2 Pic k&Plac e head 3.8.2.1 S tructu re 3 Fig. 3.8 - 3 Structure of the Pick&Place head 3 (1) Sle…
User Manual SIPLACE CF 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.8 Placement heads
89
3.8.1.2 Description
– The 6-segment Collect&Place head works using the "collect & place" principle, i.e. the compo-
nents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– All the components are inserted with the same cycle time. Before the component is inserted, it
is measured by the optoelectronic vision module.
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
– Defective components are rejected and are picked up again during a repair run.
3.8.1.3 Technical data
3
Component range 0201 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
6 mm (10.7 mm available upon request)
0.5 mm
0.35 mm
0.2 mm
0.6 mm x 0.3 mm
18.7 mm x 18.7 mm
2 g
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 9,000 comp/h
Nozzle types 9 xx
Angular accuracy ± 0.5° / 3σ ± 0.7° / 4σ
Placement accuracy ± 68 µm / 3σ ± 90 µm / 4σ
3 Technical data User Manual SIPLACE CF
3.8 Placement heads Software Version SR.408.xx 03/2006 US Edition
90
3.8.2 Pick&Place head
3.8.2.1 Structure
3
Fig. 3.8 - 3 Structure of the Pick&Place head
3
(1) Sleeve
(2) DR axis drive
(3) Z axis drive
(4) Fine-pitch camera
User Manual SIPLACE CF 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.8 Placement heads
91
3.8.2.2 Description of the Pick&Place head
The Pick& Place head works on the Pick&Place principle. According to this principle, a compo-
nent is picked up by the nozzle with the aid of a vacuum. It is then optically centered by the fine-
pitch vision module, turned in the placement angle and placed on the PCB with high precision.
The Pick&Place head offers particularly high angular accuracy.
3.8.2.3 Technical data - Pick&Place head
3
Range of components
PLCC, LCCC, QFP, SO, BGA, flip-chip,
components with connectors up to 55 mm x 55 mm
(J leads and gull-wings, balls, bumps)
Component specification
Max. height Component height ≤ 13.5mm- PCB thickness
- PCB warpage
Option:
Component height ≤ 20mm- PCB thickness
- PCB warpage
Min. lead pitch 0.4 mm
Min. bump pitch 0.56 mm
Min. ball/bump diameter 0.32 mm
Min. dimensions 1.6 mm x 0.8 mm
Max. dimensions 55 mm x 55 mm (92 mm edge length available upon request)
Max. weight 25 g
Programmable placement force 1 - 10 N
Component centering Fine pitch camera
up to 32 mm x 32 mm with single measurement
up to 55 mm x 55 mm with quadruple measurement
Max. placement rate 1,800 comp/h
Nozzle types 4xx, 5 standard nozzles with nozzle changer
Angular accuracy ± 0.05° / 3σ ± 0.07° / 4σ
Placement accuracy ± 38 µm / 3σ ± 50 µm / 4σ