POLYPHOS_DP_8x00_2021-07-08_DS_CC_E (1)
POL YPHOS Depaneling Systems POL YPHOS_DP_8x00_2021-07-08_DS_CC_E POL YPHOS DP 8000 Series Laser Depaneling POL YPHOS DP 8000 Series Description T he POL YPHOS DP 8000 Series is a machine platform for laser depaneling of…
POLYPHOS Depaneling Systems
POLYPHOS_DP_8x00_2021-07-08_DS_CC_E
POLYPHOS DP 8000 Series
Laser Depaneling
POLYPHOS DP 8000 Series
Description
The POLYPHOS DP 8000 Series is a machine platform for
laser depaneling of rigid and flex PCBs. A hard stone base
allows for maximum stability and precision.
Dierent beam sources are available to adapt the laser
cutting process to the substrate material. The system is
available as a stand-alone manual loading system or fully
automated inline. For inline operation various product specific
carrier transport and fixture systems are available. Camera
vision is used for machine calibration and oset correction by
fiducials.
The system uses a precise XY-stage and a digital controlled
galvo scanner for a step&scan process to optimize through-
put and accuracy.
Features
_ Dust free and stress free depaneling of flexible and rigid
PCBs
_ High positioning accuracy
_ DIN language controlled (CNC) cutting recipes
_ Integrated camera vision system
_ State of the art beam sources and optics for improved
cutting result
Options
_ UV Laser for flex and thin FR4 material
_ 30 W Green Laser for cutting FPCBA and FR4
_ 40 W Green Laser for higher throughput
_ CO
2
-Laser for polyimide cutting and for niche applications
_ Focus shift for thicker PCBs and to match carrier height
_ Laser power measurement
_ Laser power calibration
_ ASYCAM software for easy import of CAD (DXF) data
_ Exhaust and filter system
_ External Air-water recooler for CO
2
and UV lasers
_ MES connection
_ Inline transport on workpiece carriers
_ Workpiece carrier return system
Top View:
Subject to change without notice.
Some general descriptions and performance characteristics may
not be applicable to all products. Technical specifications are
subject to change without notice. Only features and technical
data provided in purchasing contract are legally binding.
Printed in Germany
ASYS Automatisierungssysteme GmbH
Benzstrasse 10
89160 Dornstadt, Germany
Tel (+49) 7348 9855 0
Fax (+49) 7348 9855 91
info@asys-group.com
For more information visit
www.asys-group.com
POLYPHOS DP 8000 Series
POLYPHOS DP 8000 POLYPHOS DP 8100 POLYPHOS DP 8200
Machine Configuration
Transport height
Operating side
Working Area
Scan field
950mm ± 50mm
Front of the machine
305 × 250mm
50 x 50mm up to 80 x 80mm
(depending of wavelength)
460 x 305mm 460 x 460mm
Panel Dimensions
Panel length
Panel width
Panel thickness
Panel weight max.
PCB weight max.
Component clearance
20 to 305mm
20 to 250mm
Recommended: 0.1 to 1.6mm
(2.0mm)
4kg
1.5kg
+40mm / 0mm for manual loa-
ding (other options on request)
20 to 460mm
20 to 305mm
20 to 460mm
20 to 460mm
Installation Requirements
Power supply
Power consumption
CDA supply
CDA consumption
Water cooling
Ambient Temperature
Humidity
3/N/PE AC 400/230V 50Hz
3/N/PE AC 208/120V 60 Hz
UV-Laser 5.6kW avg., 7.2kW peak
GN-Laser 2.7kW avg.
6bar
20Nl/min
10l/min, 15°C, 2.0kW UV-Laser
7.5l/min, 18...20°C, 1.7kW 100W
CO2-Laser
GN-Laser option includes AW
recooler
22°C ±1°C
50% ±20% (non cond.)
3l/min, 20°C
500W 30W GN Laser
600W 40W GN Laser
3l/min, 20°C
500W 30W GN Laser
600W 40W GN Laser
Machine Description
Length × width × height
Clearance at back side
Laser type
Laser-class
Positioning accuracy
Repeatability accuracy
Cutting accuracy
Fiducial camera
Weight
Color
Noise Level
1090 × 1800 × 1455mm
1040mm
UV 343nm
GN 532nm
CO2 9300nm (others on request)
1
±15µm @ 5σ
±5µm @ 5σ
±25µm with Vision System @ 5σ
25 x 18mm FoV
Approx. 1725kg
Basic Light, RAL 7015, RAL 4010
< 75dB(A)
1400 × 1800 × 1570mm
670mm
2200kg
1400 × 1900 × 1570mm
670mm
2200kg