Technical datasheet-VF345 - 第3页
SELECTIVE SOLDERING VerSaFl OW VERSAFL OW 3/45 Optimal Ef ficiency Combined with Highest Fle xibility VERSAFL OW 3/45 Dual trac k ma chin e wit h dua l flux , preheat and solder modules Modular & Compact Machine Platf…
VERSAFLOW 3/45
Modular Selective Platform for Highly Efficient
& Flexible In-Line Soldering
SELECTIVE SOLDERING
VerSaFlOW
VERSAFLOW 3/45
Optimal Efficiency Combined with Highest Flexibility
VERSAFLOW 3/45
Dual track machine with dual flux,
preheat and solder modules
Modular & Compact Machine Platform Increases
Production Flexibility & Reduces Costs
ERSA, a world market leader for in-line selective sol-
dering systems for the past decade, has successfully
launched its third generation of selective machines in
the premium segment, the VERSAFLOW 3 Series.
Increased production efficiency, increased throughput
& flexibility and decreased floor space requirements
& running costs, make up just a few of the technology
highlights of the VERSAFLOW 3.
The VERSAFLOW 3/45 encompasses a new modular
machine platform which offers significant floor space
area savings when compared to the previous VERSA-
FLOW machines. An in-line selective solder machine
has three basic functional modules: flux, preheat and
solder. Depending on the job & throughput require-
ments, additional solder pots, fluxers and/or preheat
modules can be added to the machine after initial instal-
lation. This means that your VERSAFLOW 3 machine
can grow with your business. Machine configurations
from the smallest to the largest can be seen in Table 1.
5. Fl PH S PH S PH S (ST)
4. 2Fl PH 2S PH 2S (DT)
3. Fl PH S PH S (ST)
2. 2Fl PH 2S (ST)
1. Fl PH S (ST)
Near Zero Defect Soldering
Where quality is paramount, manual soldering cannot
guarantee the reproducible results achievable in an auto-
mated wave soldering process. Where keeping operational
costs to a minimum, however, conventional wave solder-
ing may no longer be a viable alternative, especially in a
lead-free environment with the high costs of solder. The
tremendous operational costs associated with increased
maintenance and bath analysis, higher dross formation,
triple the costs to fill the solder pot; shorter bath life due
to copper accumulation, enormous nitrogen costs, and
higher DPM and scrap rate might cause manufacturers to
examine the possibility of switching from wave soldering to
a selective soldering process.
The VERSAFLOW selective soldering process advantages
of “Better, Faster, Cleaner & Cheaper” can translate not
only into a tremendous increase in lead free soldering
quality, but also into significant costs savings!
Single & Dual track
VERSAFLOW 3/45
Basic Machine Configuration
The VERSAFLOW selective solder nozzle and pot
The revolutionary design of the ERSA VERSAFLOW
selective solder nozzle and pot offer a level of solder joint
process control never before dreamed of in a production
soldering process. All dynamic and static functions such
as solder level, wave height and solder temperature are
continually monitored & traceable. The maintenance-
free, electromagnetically operated solder delivery system
ensures a constant solder flow rate with no moving parts.
Exact wave height is precisely adjustable for repeatable
results. VERSAFLOW guarantees perfect solder joint defi-
nition and reproducibility, as well as complete documenta-
tion of individual solder parameters. All of these unique
features combine with the improved solder wave peel-off
function to offer individually programmable process param-
eters per solder joint!
MODULAR PLATFORM
Table 1: Fl = Flux Module, PH = Preheat Module, S = Solder Module,
ST = Single track transport, DT = Dual track transport
This table shows only some of the many possible configurations.
5. Fl PH S PH S PH S (ST)
4. 2Fl PH 2S PH 2S (DT)
3. Fl PH S PH S (ST)
2. 2Fl PH 2S (ST)
1. Fl PH S (ST)
Advantages of VERSAFLOW Technology:
High flexibility due to modular design
Highest solder joint quality and significant reduction
of DPM down to near Zero Defect
Shorter cycle times than in manual/robotic soldering
Highest throughput via dual track transport & parallel
processing in flux, preheat & solder module
High process safety, soldering at 0°; stationary PCB
during the soldering process
Optimal heavy mass multilayer soldering via top side
convection heating in the solder module
Processing of 2 solder alloys in one solder module
Increased positioning accuracy
Extensive software package with process documen-
tation; Possibility to connect traceability systems
Efficient and easy programming via graphic
programming