00195679-02_AI_XPS_DE EN - 第86页

5 Mounting the XPS Assembly Instructi ons 5.4 Aligning the XPS SIPLACE X-Seri es Productivity Shuttle T ype I/II 28 2. Remove the transport lock on the shuttle. 3. Connect the XPS to the power supply system and switch it…

Assembly Instructions 5 Mounting the XPS

SIPLACE X-Series Productivity Shuttle Type I/II 5.4 Aligning the XPS

5.4 Aligning the XPS

The transport height of all XPSs must now be adjusted to the transport height of the placement

system. Make the following adjustments for Track 1 and Track 2.

1. Start by roughly adjusting the height of the XPS. For this purpose, loosen the lock nuts on the

adjustable feet and turn the feet with the adjustment nuts in the appropriate direction.

The XPS should be flush with the placement system at the front and top.

Lock nut

Adjustment

Roughly flush

5 Mounting the XPS Assembly Instructions

5.4 Aligning the XPS SIPLACE X-Series Productivity Shuttle Type I/II

2. Remove the transport lock on the shuttle.

3. Connect the XPS to the power supply system and switch it on at the main switch.

4. The SIPLACE X-Series can now be switched on again if required, for example, to adjust the

transport width.

5. Start with Track 1. Manually move the shuttle conveyor of the XPS to the appropriate position;

the fixed stops of both conveyors must match up. Refer to the operating manual for the XPS

for this.

6. Place two printed-circuit boards on the shuttle conveyor and one printed-circuit board on Track

1 of the inlet/outlet conveyor of the placement system. Place the precision spirit level on the

printed-circuit boards on the shuttle conveyor.

NOTE

The widths of both machines should be adjusted to the width of the printed-circuit boards you

are using for this adjustment. Follow the procedure for this in the operating manuals for the

machines.

The shuttle is secured for

transport.

The toothed drive belt is

held together with a clamp.

Precision spirit level

Assembly Instructions 5 Mounting the XPS

SIPLACE X-Series Productivity Shuttle Type I/II 5.5 Cover over the Transfer Openings

7. Adjust the adjustable feet so that the XPS is in the water and the printed-circuit boards can be

slid from the shuttle conveyor onto Track 1 of the placement system without tipping and

colliding.

8. Repeat the procedure for Track 2.

9. Check the adjustments for tracks 1 and 2 again and make corrections as necessary.

10.Remove the printed-circuit boards used for the adjustment and the precision spirit level.

11.Switch off the XPS again at the main switch and disconnect it from the power supply system.

5.5 Cover over the Transfer Openings

The transfer opening on the SIPLACE X-Series Productivity Shuttle (XPS) must always be

covered with the plates provided, except for the necessary printed-circuit board width. This applies

to the input module (at the inlet), the end module (at the outlet) and every transfer opening of each

XPS that does not adjoin a SIPLACE placement system.

Figure 5 - 1 Cover over the Transfer Openings: Minimum Printed-Circuit Board Width

Attach the cover plate according to the your requirements (printed-circuit board width).

Minimum printed-

circuit board width

Input module,

view in pass-

through direction