00195760-0102_UM_D3_SR605_EN - 第115页
User Manual SIPLACE D3 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head 115 3.5.3 SIPLACE T winHead for high-precision IC placement 3 Fig. 3.5 - 5 T winHead for high-…
3 Technical data for the machine User Manual SIPLACE D3
3.5 Placement head From software version SR.605.xx 07/2008 EN Edition
114
Programmed power stage
1
2
3
4
5
Programmed set-down force [N]
2.4 ± 0.5
2.4 ± 0.5
3 + 1
4 + 1
5 + 1
Nozzle types 8xx, 9xx
X/Y accuracy
b
± 45 μm/3σ, ± 60 μm/4σ
Angular accuracy ± 0.2°/3 σ, ± 0.3°/4 σ
Component range 99.5%
CO camera type 29
Illumination level 5
Possible illumination level settings
256
5
a) Please note that the component range that can be placed is also affected by the pad geometry, the cus-
tomer-specific standards and the packaging tolerances.
b) The accuracy value was measured using the vendor-neutral IPC standard.
User Manual SIPLACE D3 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
115
3.5.3 SIPLACE TwinHead for high-precision IC placement
3
Fig. 3.5 - 5 TwinHead for high-precision IC placement
3
(1) Pick&Place module - the TwinHead consists of 2 Pick&Place modules (P&P1 and P&P2)
(2) DP axis
(3) Z axis drive
(4) Incremental distance measuring system for the Z axis
3 Technical data for the machine User Manual SIPLACE D3
3.5 Placement head From software version SR.605.xx 07/2008 EN Edition
116
3.5.3.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether (twin head). Both heads work using the Pick&Place principle. The TwinHead is suitable for
processing particularly difficult or large components. Two components are picked up by the place-
ment head, optically centered on the way to the placement position and rotated into the necessary
placement angle. They are then placed gently and accurately onto the PCB with a controlled blast
of air.
New nozzles (type 5xx) have been developed for the TwinHead. It is also possible to fit an adapter
and then use type 4 nozzles for the Pick&Place head and type 8xx and 9xx nozzles for the Col-
lect&Place heads.
3.5.3.2 Technical data
Optical centering with Stationary P&P component camera,
(type 33) 55 x 45, digital
(see Section 3.8.5
, page 137)
Stationary P&P component camera,
(type 25) 16 x 16, digital
(see Section 6.6, page 315)
Range of components
a
0402 to SO, PLCC, QFP, BGA, spe-
cial components, bare dies, flip-
chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components,
bare dies, flip-chips, shields
Component specification
b
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
c
25 mm (higher available on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
55 x 45 mm² (single measurement)
For use with two nozzles
50 x 50 mm² or
69 x 10 mm²
For use with one nozzle
85 x 85 mm² or
125 x 10 mm²
max. 200 x 125 mm² (with restric-
tions)
100 g
25 mm (higher available on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 x 0.3 mm²
16 x 16 mm² (single measurement)
100 g